Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Bezel
Heat sinks / Fans / Cooling Modules
Memory 4800MHz
Memory 5600MHz
Storage Devices
SFF SAS Drives
SFF SATA Drives
NVMe Drives
Rear Drive Cage Options
Riser Card
Networking PCI
OCP Networking NIC
GPU
TPM
Rail Kit
iDRAC 9
Power Cooling
ECS Warranty
The request has been sent.
Thank you.
Price as Configured:
$0
Price as Configured:
$0
2U rack server
Processor | Max: 56 Cores2x Gen 4 / 5th Gen Intel Xeon Scalable
Memory | Max: 8TB32 ECC DDR5 RDIMM 4800Mhz
Storage | Max: 368.64TBFront bays:
Up to 16x 2.5" SAS/SATA + 8x NVMe
Up to 24x 2.5" SAS/SATA/NVMe (Universal)
Up to 24x 2.5" NVMe (Passive)
Up to 24x 2.5" NVMe (Switched)
Rear bays:
Only supported on the Universal 24x Chassis
Up to 2x 2.5" SAS/SATA/NVMe (HDD/SSD) Max 30.72 TB
Up to 4x 2.5" SAS/SATA/NVMe (HDD/SSD) Max 61.44 TB
Up to 4x 2.5" EDSFF E3.S NVMe SSD
Boot Optimized Server Storage (BOSS-N1) Hot-Swap
Internal USB
S160 (SATA/NVMe SW RAID)
H355i, H755, H755N, H965i, HBA355i, H355e, HBA355e, H965e
2 x 1GE LOM / 25 or 100 GbE x 2 (DPU Must be Installed)
Networking OptionsOCP 3.0 x8 Mezz 3.0
Remote Management:iDRAC9 with Lifecycle Controller
PCIe Slots:Up to 8 x PCIe Gen5 or Gen 4 slots
SNAP Support | Slot 7 SNAPI: 1 x16 Gen5 FH, HL
GPU:Up to 2 x 350 W DW
6 x 75 W SW
12 x 2.5-inch and rear drive configuration systems do not support a GPU card.
- Dell PowerEdge R710
- Dell PowerEdge R720
- Dell PowerEdge R720XD
- Dell PowerEdge R730
- Dell PowerEdge R730XD
- Dell PowerEdge R740
- Dell PowerEdge R740XD
- Dell PowerEdge R740XD2
- Dell PowerEdge R7415
- Dell PowerEdge R7425
- Dell PowerEdge R750
- Dell PowerEdge R750XA
- Dell PowerEdge R750XS
- Dell PowerEdge R7515
- Dell PowerEdge R7525
- Dell PowerEdge R760
- Dell PowerEdge R760XA
- Dell PowerEdge R760XS
- Dell PowerEdge R760XD2
- Dell PowerEdge R7615
- Dell PowerEdge R7625
(Click to View)
Ideal for:
- Artificial Intelligence (AI)
- Data Analytics
- Database
- Machine Learning (ML)
- Virtual Desktop Interface (VDI)
The Dell PowerEdge R760 Built for demanding enterprise workloads, the Dell PowerEdge R760 is a 2U dual-socket rack server engineered to handle AI and machine learning applications with ease. This mainstream server delivers strong, cyber-resilient performance in a design built specifically for modern data center needs.
There is no 16-bay backplane, its actually multiple 8SFF Backplanes.
- 16 x 2.5" (SAS4/SATA) + 8 x 2.5" NVMe Direct
- 24 x 2.5" (SAS4/SATA) with 8 x Universal slots (SAS/SATA HWRAID + NVMe Direct)
- 24 x 2.5" (SAS4/SATA)
- 24 x 2.5" (SAS4/SATA) + 2 x 2.5" (NVMe Direct)
- 24 x 2.5"(SAS4/SATA) + 2 x 2.5" (SAS/SATA)
- 24 x 2.5"(SAS4/SATA) + 4 x 2.5" (SAS/SATA)
- 24 x 2.5" (SAS4/SATA) + 4 x 2.5" (NVMe Direct)
- 24 x 2.5" (SAS4/SATA) - Dual Controller
- 24 x 2.5" + 2 x 2.5" (SAS4/SATA) - Dual Controller
- 24 x 2.5" (SAS4/SATA) with 8 x Universal slots (SAS/SATA HWRAID + NVMe Direct)
- 24 x 2.5" (SAS4/SATA)
- 24 x 2.5" (SAS4/SATA) - Dual Controller
- 24 x 2.5" (SAS4/SATA) with 4 x Universal slots (SAS/SATA HWRAID + NVMe Direct) + 4 x 2.5" (SAS4/SATA)
- 24 x 2.5" (NVMe Gen5 switched)
- 24 x 2.5" (NVMe RAID - Gen5 Switched) - Dual Controller
- 24 x 2.5" (NVMe Gen4 Direct) Passive
There are so many options we had to split them up to make it easier to understand the scale the R760 can perform.
12x 3.5" SAS/SATA
8x 2.5" SAS/SATA/NVMe
8x 2.5" NVMe
8x 2.5" EDSFF E3.S
24x 2.5" SAS/SATA/NVMe
24x 2.5" NVMe Passive
24x 2.5" NVMe SwitchedUp to 2 x 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors with up to 56 cores
There are three types of heat sinks for this Dell R760 Rack server. The heat sink option is based on the configuration and the TDP of the CPU. Any TPD above 250W will be liquid-cooled.
- STD HSK ≤ 165 W (supports only 2.5-inch drives and non-GPU configuration)
- 2U HPR HSK 165 W–350 W (supports 2.5-inch drives and non-GPU configuration)
- L-type HSK Supports all GPU/FPGA configurations
Any Processors TPD above 250W will need the liquid-cooled system installed.
CPUs 9480, 9470, 8470Q and 6458Q are supported only in liquid cooling configuration.
This Dell Gen16 server offers two cooling paths — air-cooled or Direct Liquid Cooled. Choosing DLC for the CPUs removes the rear VGA port, though it can be relocated to the front or restored at the rear, with the rear option using up a PCIe slot.
All GPU/FGPA cards require 1U L-type HSK and GPU shroud.
GPU configuration supports only High performance Gold (HPR Gold) fan.
Every system ships with 6 hot-swap fans, with the specific type varying by CPU TDP and system configuration — mirroring how heat sink selection works. Supported fan types are listed below.
Up to six hot-swap fans- Standard (STD) fans
- High-performance Silver (HPR Silver) fans
- High-performance Gold (HPR Gold) fans
- For TDP that are 250W+ requires DLC
Planning to add a rear drive to the Dell PowerEdge R760? You'll need the High-Performance Gold fan installed, unless the CPU's TDP already sits at 270W or above.
Rear drive cages each require an added fan for adequate cooling support, plus an airflow baffle — both supplied automatically when rear drives are ordered.
Rear drives supported on the 12 LFF and the 24 SFF Chassis.
Memory-intensive workloads benefit from up to 32 DDR5 RDIMMs running at 4400 MT/s (2DPC), or up to 4800 MT/s when capped at 16 DDR5 RDIMMs (1DPC).
| DIMM Type | DIMM Rank | DIMM Capacity | Single Processor | Dual Processor | ||
|---|---|---|---|---|---|---|
| Minimum system capacity | Maximum system capacity | Minimum system capacity | Maximum system capacity | |||
| DDR5 RDIMM | Single Rank | 16 GB | 16 GB | 256 GB | 32 GB | 512 GB |
| Dual Rank | 32 GB | 32 GB | 512 GB | 64 GB | 1 TB | |
| Dual Rank | 64 GB | 64 GB | 1 TB | 128 GB | 2 TB | |
| Quad Rank | 128 GB | 128 GB | 2 TB | 256 GB | 4 TB | |
| Octa Rank | 256 GB | 256 GB | 4 TB | 512 GB | 8 TB | |
Among Dell's RAID controller options is the fPERC solution, which frees up a PCIe slot entirely by delivering a base RAID hardware controller through a compact, high-density connector to the base planar.
Both PERC11 and PERC12 controllers work with this system, and dual-controller configurations are possible by pairing an fPERC with an APERC card. See the manual's cabling section for the full range of supported setups.

| Supported storage controller cards | |
|---|---|
| Internal controllers | PERC H965i PERC H755 PERC H755N PERC H355 |
| External controllers | HBA355e PERC H965e |
| Internal Boot | Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD USB |
| Software RAID | S160 |
| SAS Host Bus Adapters (HBA) | HBA355i |
| NOTE: PowerEdge does not support Tri-Mode, the mixing of SAS, SATA, and NVMe behind the same controller. | |
| NOTE: The Universal Backplane supports HW RAID for SAS/SATA with direct attach NVMe, and does not support HW RAID for NVMe. | |
A boot option is available on this server via 2x M.2 NVMe drives on the optional BOSS-N1 card, consistent with most Dell systems — though its physical placement shifts depending on the risers or rear drives installed.
No shutdown is needed to install the BOSS-N1 card carrier itself — powering down the system is only necessary when installing the BOSS-N1 controller card module.
| Components in kit | R760 (quantity) |
|---|---|
| BOSS-N1 controller card module | 1 |
| BOSS-N1 card carrier | 1 or 2* |
| M.2 NVMe SSD | 1 or 2* |
| M.2 NVMe SSD capacity label | 1 or 2† |
| BOSS-N1 card carrier blank | 1 |
| M3 x 0.5 x 4.5 mm screws | 1 |
| BOSS-N1 power cable for Riser 1 (220 mm) | 1 |
| BOSS-N1 signal cable for Riser 1 (170 mm) | 1 |
| BOSS-N1 power cable for x4 rear drive module (260 mm) | 1 |
| BOSS-N1 signal cable for x4 rear drive module (240 mm) | 1 |
Choosing NIC support on the Dell Gen16 R760 rack server means picking between the LOM card or the MIC card, since only one can be installed. The OCP 3.0 slot, however, remains available independently of that choice.

- 1 GbE x 2
On the Dell R760 the standard LOM is Optional and supports 2x1Gb with BCM5720 LAN controller.
Management Interface card (MIC)
- 25 GbE x 2
- 100 GbE x 2
A Dell Data Processing Unit (DPU) card requires the MIC to be installed alongside it — and because the MIC occupies the LOM ports, a LOM card can't be added at the same time.
Open Compute Project (OCP) 3.0
- 1GbE x 4
- 10 GbE x 2
- 10 GbE x 4
- 25 GbE x 2
- 25 GbE x 4
Keep in mind that an x16 card installed in the OCP 3.0 slot gets downgraded to x8, a limitation of this system board. Port support also differs: the LOM maxes out at two ports, while the OCP 3.0 slot can handle a card with up to 4 ports.
PCIe capacity reaches up to 8x Gen4 or 4x Gen5 slots across 4 riser slots, supported by 15 riser cards forming 14 unique configurations. Review the riser table below carefully, and don't hesitate to contact support if you need help finding the right setup.
| Config No. | Riser configuration | No. of Processors | PERC type supported | Rear storage possible |
|---|---|---|---|---|
| 0 | NO RSR | 2 | Front PERC | No |
| 1 | R1B+R2A+R3B+R4B | 2 | Front PERC/PERC Adapter | No |
| 2 | R1Q+R2A+R3B+R4Q | 2 | Front PERC/PERC Adapter | No |
| 3-1 | R1P+R2A+R3B+R4P (HL) | 2 | Front PERC/PERC Adapter | No |
| 3-2 | R1P+R2A+R3B+R4P (FL) | 2 | Front PERC/PERC Adapter | No |
| 4-1 | R1P+R2A+R3B+R4R (HL) | 2 | Front PERC/PERC Adapter | No |
| 5-1 | R1R+R2A+R3A+R4P (HL) | 2 | Front PERC/PERC Adapter | No |
| 5-2 | R1R+R2A+R3A+R4P (FL) | 2 | Front PERC/PERC Adapter | No |
| 6 | R2A+R4Q | 2 | Front PERC/PERC Adapter | Yes |
| 7 | R1Q+R2A+R4Q | 2 | Front PERC/PERC Adapter | Yes |
| 8 | R1B+R2A | 1 | PERC Adapter | No |
| 9 | R1Q+R2A+R4R | 1 | Front PERC | No |
| 10-1 | R1P+R2A+R4R (HL) | 1 | Front PERC | No |
| 10-2 | R1P+R2A+R4R (FL) | 1 | Front PERC | No |
| 11 | R1 Paddle + R2A + R3B + R4 Paddle | 2 | N/A | No |
| 12 | R1Q+R2A+R4Q | 2 | Front PERC/PERC Adapter | Yes |
Riser Cards
Riser 1B 2x16 (R1B)
Riser 1R 2x16 (R1R)
Riser 1R-FL 2x16 (R1R-FL)
Riser 1P 1x16 (R1P)
Riser 1P-FL 1x16 (R1P-FL)
Riser 1Q 2x16 (R1Q)
Riser 2A 2x16 (R2A)
Riser 3A 1x16 (R3A)
Riser 3A-FL 1x16 (R3A-FL)
Riser 3B 2x8 (R3B)
Riser 4P 1x16 (R4P)
Riser 4P-FL 1x16 (R4P-FL)
Riser 4B 2x16 (R4B)
Riser 4Q 2x16 (R4Q)
Riser 4R 2x16 (R4R SNAPI)
Paddle Card KitThis system handles up to two double-wide 350W accelerators or six single-wide 75W accelerators. Adding GPUs means swapping in the GPU air shroud in place of the default one, and a filler must also go in when using a single-width GPU card or leaving a riser slot empty.
All GPU/FGPA cards require 1U L-type HSK and GPU shroud.
- Double Width (DW) GPU only supported on Riser Configurations 3-2, 5-2, or 10-2
- RC 5-2: Supports DW GPU only on slot 7
- RC 10-2: Only supports a single processor configuration.
- RC 10-2: Supports DW GPU only on slot 2.
| Components | GPU FL Kit | |
|---|---|---|
| Details | Quantity | |
| Risers | Riser configuration (RC) 3-2, 5-2*, or, 10-2* | RC 3-2: R1P^ (FL) + R2A (HL) + R3B (HL) + R4P^ (FL) RC 5-2: R1R (FL) + R2A (HL) + R3A (FL) + R4P^ (FL) RC 10-2: R1P^ (FL) + R2A (HL) + R4R (FL) |
| Shroud | GPU shroud | 1 |
| Fans | HPR GOLD fan | 6 |
| Heat sinks | L-type heat sink for processor 1 and processor 2 | RC 3-2, 5-2: 2 RC 10-2: 1 |
| Cables | Power cable | 2 x 4 (8-position) or 2 x 6 + 1 x 4 (12-position + 4-sideband) |
| FL - Full Length, HL - Half Length, HPR - High Performance, RC - Riser configuration | ||
| 12 x 3.5-inch and rear drive configuration systems do not support a GPU card. | ||
Two redundant Hot-Swap AC or DC power supply units.
- 2800 W Titanium 200—240 VAC or 240 HVDC,
- 2400 W Platinum 100—240 VAC or 240 HVDC,
- 1800 W Titanium 200—240 VAC or 240 HVDC,
- 1400 W Platinum 100—240 VAC or 240 HVDC,
- 1100 W Titanium 100—240 VAC or 240 HVDC,
- 1100 W LVDC -48 — -60 VDC,
- 800 W Platinum 100—240 VAC or 240 HVDC,
- 700 W Titanium 200—240 VAC or 240 HVDC,
Width with Ears: 482.0 mm (18.97")
Width without Ears: 434.0 mm (17.08")
Height: 86.8 mm (3.41")
Length: 736.29 mm (28.98") Ear to PSU handle
Weight: A server with fully populated drives 36.1 kg (79.58 lbs)
A server without drives and PSU installed 25.1 kg (55.33 lbs)
Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Bezel
Heat sinks / Fans / Cooling Modules
Memory 4800MHz
Memory 5600MHz
Storage Devices
SFF SAS Drives
SFF SATA Drives
NVMe Drives
Rear Drive Cage Options
Riser Card
Networking PCI
OCP Networking NIC
GPU
TPM
Rail Kit
iDRAC 9
Power Cooling
ECS Warranty
The request has been sent.
Thank you.
Price as Configured:
$0
Base Standard Capabilities
| Features | Technical Specifications | |
|---|---|---|
| Processor | Up to two 4th Generation Intel Xeon Scalable processor with up to 56 cores per processor and with optional Intel® QuickAssist Technology | |
| Memory |
| |
| Storage controllers |
| |
| Drive Bays | Front bays:
| |
| Power Supplies |
| |
| Cooling Options |
| |
| Fans |
| |
| Dimensions |
| |
| Form Factor | 2U rack server | |
| Embedded Management |
| |
| Bezel | Optional LCD bezel or security bezel | |
| OpenManage Software |
| |
| Mobility | OpenManage Mobile | |
| OpenManage Integrations |
| |
| Security |
| |
| Embedded NIC | 2 x 1 GbE LOM card (optional) | |
| Network options | 1 x OCP card 3.0 (optional) Note: The system allows either LOM card or an OCP card or both to be installed in the system. | |
| GPU Options | Up to 2 x 350 W DW and 6 x 75 W SW | |
| Ports | Front Ports
| Rear Ports
|
Internal Ports
| ||
| PCIe | Up to eight PCIe slots:
| |
| Operating System and Hypervisors |
| |
| *Future releases will include additional capacity/form factor. | ||
Spec Sheet 4
| Rack Server | R760 | R660 | R7625 | R6625 | R7615 | R6615 |
|---|---|---|---|---|---|---|
| Key attributes | Provides performance and versatility for demanding applications | Provides performance and versatility for demanding applications | Breakthrough performance | Breakthrough performance | Powerful performance and scalability | Peak performance and excellent TCO |
| Target workloads | Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure | High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization | High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization | High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization | Software-Defined Storage (SDS), Virtualization, Data Analytics | Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV) |
| Type of processor | 2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor | 2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor | 1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores | |||
| Memory (DDR5 DIMM slots & max) | 32 (8 TB) | 24 (1.5 TB*) | 12 (768 GB*) | |||
| Disk drives up to: | 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5” (rear) |
8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear) |
4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear) |
4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
| NVMe drives up to: | 24 | 10 | 24 | 10 | 24 | 10 |
| Gen5 PCIe slots up to: | 4 | 2 | 4 | 2 | 4 | 2 |
| Gen4 PCIe slots up to: | 8 | 3 | 8 | 3 | 4 | 3 |
| Accelerator support up to: | 2 x 350 W DW or 6 x 75 W SW | 2** x 75 W SW | 2 x 300 W DW or 6 x 75 W SW | 3 x 75 W SW | 3 x 300 W DW or 6 x 75 W SW | 3 x 75 W SW |
| Rack height (U) | 2 | 1 | 2 | 1 | 2 | 1 |
| Integrated security | TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks. | TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV) | ||||
| * Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615. ** Future releases will include additional GPU slots in R660. |
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