Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Bezel

Heat sinks / Fans / Cooling Modules

Memory 4800MHz

Memory 5600MHz

Storage Controllers

EDSFF Drives

Riser Card

Networking PCI

OCP Networking NIC

GPU

Rail Kit

TPM

iDRAC 9

Power Cooling

ECS Warranty

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Dell PowerEdge R760 Rack Server (16x 2.5" EDSFF E3.S) | Configurable

 

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Select Chassis

Up to 16 EDSFF Drives
When 2 H965i PERC controllers are installed. The right drive cage needs to move over one to line up with the PERC Card.

Select Processor

Supports up to 2 Processors.
Depending on the TDP and the configuration you desire. The Heatsinks below will change.
Please read up on the different cooling systems below.

4th Gen Intel Scalable Processors

Supports up to 2 Processors.

5th Gen Intel Scalable Processors

Supports up to 2 Processors.

Bezel (Optional)

Heat sinks / Fans / Cooling Modules (Optional)

For all GPU systems, the L-type Heat Sink must be installed. Along with HPR Gold Fans.
Depending on configuration the Heat Sinks and Fans will need to be adjusted from the Standard version to the performance version.
Please view the Thermal restriction matrix for more details.

Memory 4800MHz (Optional)

DDR4 memory are not supported in the R760.
32x DDR5 DIMM slots on a 2 Socket configuration, supports RDIMM 8 TB max

Memory 5600MHz (Optional)

DDR4 memory are not supported in the R760.
32x DDR5 DIMM slots on a 2 Socket configuration

Storage Controllers (Optional)

System comes with the Gen16 Software RAID S160.
This Server has a Special 2 PERC tray that installs behind the backplane to support Dual H965i cards.

EDSFF Drives

Supports up to 16 Drives.

Riser Card (Optional)

Each configuration comes with all the risers in the kit.
Please click on "view item" or see the manual below for all the details about the riser configurations.
x16 Adapters installed in an x8 PCIe slot will see downgrading. Please keep this in mind when selecting the riser configuration.

Networking PCI (Optional)

When choosing the Riser configuration and the Networking cards. Take notice of the PCIe Slot size, x16 installed in x8 will see some downgraded performance.
If you want a DPU installed, the LOM will be replaced by the MIC.

OCP Networking NIC (Optional)

LOM and OCP can be installed together.

GPU (Optional)

If a GPU is installed a GOLD fan and the L-Type heatsink must be installed. Some CPUs require the DLC as well to be installed for cooling.
Please read the manual for all the details about a GPU Configuration.

Rail Kit (Optional)

TPM (Optional)

iDRAC 9 (Optional)

Default iDRAC9 Express

Power Cooling

Supports up to 2 PSU
Mixing of PSU is not supported.

ECS Warranty

Helpful Tip: Once desired configuration is selected click "Add to Cart".
From the cart page you can submit a submit a quote request for best pricing

Quick Specs

Form Factor:

2U rack server

Processor | Max: 56 Cores

2x Gen 4 / 5th Gen Intel Xeon Scalable

Memory | Max: 8TB

32 ECC DDR5 RDIMM 4800Mhz

Storage | Max: N/A

Front bays:
Up to 16 x 2.5" EDSFF E3.S
Rear bays:
Only Supported on the 12x 3.5" and 24 Bay Universal Chassis

Boot Options

Boot Optimized Server Storage (BOSS-N1) Hot-Swap
Internal USB

RAID Controller: (fPERC)

S160 (SATA/NVMe SW RAID)
H355i, H755, H755N, H965i, HBA355i, H355e, HBA355e, H965e

LOM/MIC

2 x 1GE LOM / 25 or 100 GbE x 2 (DPU Must be Installed)

Networking Options

OCP 3.0 x8 Mezz 3.0

Remote Management:

iDRAC9 with Lifecycle Controller

PCIe Slots:

Up to 8 x PCIe Gen5 or Gen 4 slots

SNAP Support | Slot 7 SNAPI: 1 x16 Gen5 FH, HL

GPU:

Up to 2 x 350 W DW
6 x 75 W SW
12 x 3.5-inch and rear drive configuration systems do not support a GPU card.


Ideal for:

  • Artificial Intelligence (AI)
  • Data Analytics
  • Database
  • Machine Learning (ML)
  • Virtual Desktop Interface (VDI)

The Dell PowerEdge R760 is a 2U dual-socket rack server built to handle demanding enterprise workloads, including AI and machine learning applications. This full-featured, cyber-resilient server delivers robust performance in a purpose-built mainstream design suited to modern data centers.

Dell PowerEdge R760 Drive Options
16 EDSFF E3.S Configuration Options

There is no 16-bay backplane. Each of these configurations below is built with multiple 8 EDSFF E3.S Backplanes.

  • 16 x EDSFF E3.S (Gen5 x 4 NVMe Direct)
  • 16 x EDSFF E3.S (NVMe RAID) - Dual fPERC (H965i)

Dell R760 12x 3.5 SAS/SATA Backplane 12x 3.5" SAS/SATA
Dell R760 8x 2.5 SAS/SATA/NVMe Backplane 8x 2.5" SAS/SATA/NVMe
Dell R760 8x 2.5 NVMe Backplane 8x 2.5" NVMe
Dell R760 8x 2.5 EDSFF E3.S Backplane 8x 2.5" EDSFF E3.S

Processor, Heatsink & Fans
Processors & Heatsink

Up to 2 x 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors with up to 56 cores

There are three types of heat sinks for this Dell R760 Rack server. The heat sink option is based on the configuration and the TDP of the CPU. Any TPD above 250W will be liquid-cooled.

  • STD HSK ≤ 165 W (supports only 2.5-inch drives and non-GPU configuration)
  • 2U HPR HSK 165 W–350 W (supports 2.5-inch drives and non-GPU configuration)
  • L-type HSK Supports all GPU/FPGA configurations
Liquid Cooling

Any Processors TPD above 250W will need the liquid-cooled system installed.
CPUs 9480, 9470, 8470Q and 6458Q are supported only in liquid cooling configuration.

Cooling on this Dell Gen16 server comes in two forms: air-cooled or Direct Liquid Cooled (DLC). Opting for DLC on the CPUs removes the rear VGA port, though it can be restored either at the front or rear — with the rear option consuming a PCIe slot.


Fans

GPU and FPGA cards on this system require a 1U L-type heat sink and GPU shroud, with GPU configurations limited to High-Performance Gold (HPR Gold) fans only.

Six hot-swap fans come standard on this system, with fan type varying by CPU TDP and overall configuration — similar to how heat sink selection works. The supported fan types are outlined below.

Up to six hot-swap fans
  • Standard (STD) fans
  • High-performance Silver (HPR Silver) fans
  • High-performance Gold (HPR Gold) fans
  • For TDP that are 250W+ requires DLC
Rear Drive Fans

Installing a rear drive on the Dell PowerEdge R760 requires the High-Performance Gold fan, unless the CPU TDP reaches 270W or higher.

Each rear drive cage requires an additional fan for proper cooling, along with an airflow baffle — both of which are included when rear drives are ordered.

Rear drives supported on the 12 LFF and the 24 SFF Chassis.

Supported Memory

In-memory workloads get a boost from up to 32 DDR5 RDIMMs at 4400 MT/s (2DPC), or up to 4800 MT/s when limited to 16 DDR5 RDIMMs (1DPC).

DIMM Type DIMM Rank DIMM Capacity Single Processor Dual Processor
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
DDR5 RDIMM Single Rank 16 GB 16 GB 256 GB 32 GB 512 GB
Dual Rank 32 GB 32 GB 512 GB 64 GB 1 TB
Dual Rank 64 GB 64 GB 1 TB 128 GB 2 TB
Quad Rank 128 GB 128 GB 2 TB 256 GB 4 TB
Octa Rank 256 GB 256 GB 4 TB 512 GB 8 TB
Storage Controllers Options
Storage Controllers

Dell's RAID controller lineup includes the fPERC solution, delivering a base RAID hardware controller that skips PCIe slot usage entirely — accomplished through a small form factor, high-density connector to the base planar.

PERC11 and PERC12 controllers are both supported on this system, with dual-controller setups possible using one fPERC and one APERC card. Check the manual's cabling section for supported configuration details.

Image of the R760 with an fPERC being installed.
Supported storage controller cards
Internal controllers PERC H965i
PERC H755
PERC H755N
PERC H355
External controllers HBA355e
PERC H965e
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD
USB
Software RAID S160
SAS Host Bus Adapters (HBA) HBA355i
NOTE: PowerEdge does not support Tri-Mode, the mixing of SAS, SATA, and NVMe behind the same controller.
NOTE: The Universal Backplane supports HW RAID for SAS/SATA with direct attach NVMe, and does not support HW RAID for NVMe.
BOSS-N1 Hot-Swap Boot Options

This server includes a boot option via 2x M.2 NVMe drives on the optional BOSS-N1 card, as seen across most Dell systems — though its position shifts depending on which risers or rear drives are installed.

The BOSS-N1 card carrier installs without a system shutdown; powering down is only needed for installing the BOSS-N1 controller card module.

The BOSS-N1 Boot option for Dells R760 Rack Server
Components in kit R760 (quantity)
BOSS-N1 controller card module 1
BOSS-N1 card carrier 1 or 2*
M.2 NVMe SSD 1 or 2*
M.2 NVMe SSD capacity label 1 or 2†
BOSS-N1 card carrier blank 1
M3 x 0.5 x 4.5 mm screws 1
BOSS-N1 power cable for Riser 1 (220 mm) 1
BOSS-N1 signal cable for Riser 1 (170 mm) 1
BOSS-N1 power cable for x4 rear drive module (260 mm) 1
BOSS-N1 signal cable for x4 rear drive module (240 mm) 1
Networking Adapters Options

NIC support on the Dell PowerEdge R760 (Gen16) comes down to a choice between the LOM card or the MIC card — only one can be installed at a time. Separately, the OCP 3.0 slot remains available regardless of which one you choose.

Image of the R760 System board LOM, MIC, and OCP Slots

Expansion Slots

This system offers up to 8x PCIe Gen4 or 4x PCIe Gen5 slots, spread across 4 riser slots with 15 riser cards forming 14 distinct PCIe riser configurations. Take time reviewing the options, and reach out for support if needed — the table below maps each riser card to its corresponding configuration.

Config No. Riser configuration No. of Processors PERC type supported Rear storage possible
0 NO RSR 2 Front PERC No
1 R1B+R2A+R3B+R4B 2 Front PERC/PERC Adapter No
2 R1Q+R2A+R3B+R4Q 2 Front PERC/PERC Adapter No
3-1 R1P+R2A+R3B+R4P (HL) 2 Front PERC/PERC Adapter No
3-2 R1P+R2A+R3B+R4P (FL) 2 Front PERC/PERC Adapter No
4-1 R1P+R2A+R3B+R4R (HL) 2 Front PERC/PERC Adapter No
5-1 R1R+R2A+R3A+R4P (HL) 2 Front PERC/PERC Adapter No
5-2 R1R+R2A+R3A+R4P (FL) 2 Front PERC/PERC Adapter No
6 R2A+R4Q 2 Front PERC/PERC Adapter Yes
7 R1Q+R2A+R4Q 2 Front PERC/PERC Adapter Yes
8 R1B+R2A 1 PERC Adapter No
9 R1Q+R2A+R4R 1 Front PERC No
10-1 R1P+R2A+R4R (HL) 1 Front PERC No
10-2 R1P+R2A+R4R (FL) 1 Front PERC No
11 R1 Paddle + R2A + R3B + R4 Paddle 2 N/A No
12 R1Q+R2A+R4Q 2 Front PERC/PERC Adapter Yes

Riser Cards

Dell PowerEdge R760 Riser 1B Riser 1B 2x16 (R1B)
Dell PowerEdge R760 Riser 1R 2x16 (R1R) Riser 1R 2x16 (R1R)
Dell PowerEdge R760 Riser 1R-FL 2x16 (R1R-FL) Riser 1R-FL 2x16 (R1R-FL)
Dell PowerEdge R760 Riser 1P 1x16 (R1P) Riser 1P 1x16 (R1P)
Dell PowerEdge R760 Riser 1P-FL 1x16 (R1P-FL) Riser 1P-FL 1x16 (R1P-FL)
Dell PowerEdge R760 Riser 1Q 2x16 (R1Q) Riser 1Q 2x16 (R1Q)
Dell PowerEdge R760 Riser 2A 2x16 (R2A) Riser 2A 2x16 (R2A)
Dell PowerEdge R760 Riser 3A 1x16 (R3A) Riser 3A 1x16 (R3A)
Dell PowerEdge R760 Riser 3A-FL 1x16 (R3A-FL) Riser 3A-FL 1x16 (R3A-FL)
Dell PowerEdge R760 Riser 3B 2x8 (R3B) Riser 3B 2x8 (R3B)
Dell PowerEdge R760 Riser 4P 1x16 (R4P) Riser 4P 1x16 (R4P)
Dell PowerEdge R760 Riser 4P-FL 1x16 (R4P-FL) Riser 4P-FL 1x16 (R4P-FL)
Dell PowerEdge R760 Riser 4B 2x16 (R4B) Riser 4B 2x16 (R4B)
Dell PowerEdge R760 Riser 4Q 2x16 (R4Q) Riser 4Q 2x16 (R4Q)
Dell PowerEdge R760 Riser 4R 2x16 (R4R SNAPI) Riser 4R 2x16 (R4R SNAPI)
Dell PowerEdge R760 Paddle Card Kit Paddle Card Kit
GPU Options

GPU support on this system tops out at two double-wide 350W accelerators or six single-wide 75W accelerators. Installing GPUs requires swapping the default air shroud for the GPU air shroud, which also needs a filler installed whenever a single-width GPU card or empty riser slot is present.
All GPU/FGPA cards require 1U L-type HSK and GPU shroud.

  • Double Width (DW) GPU only supported on Riser Configurations 3-2, 5-2, or 10-2
  • RC 5-2: Supports DW GPU only on slot 7
  • RC 10-2: Only supports a single processor configuration.
  • RC 10-2: Supports DW GPU only on slot 2.
Components GPU FL Kit
Details Quantity
Risers Riser configuration (RC) 3-2, 5-2*, or, 10-2* RC 3-2: R1P^ (FL) + R2A (HL) + R3B (HL) + R4P^ (FL)
RC 5-2: R1R (FL) + R2A (HL) + R3A (FL) + R4P^ (FL)
RC 10-2: R1P^ (FL) + R2A (HL) + R4R (FL)
Shroud GPU shroud 1
Fans HPR GOLD fan 6
Heat sinks L-type heat sink for processor 1 and processor 2 RC 3-2, 5-2: 2
RC 10-2: 1
Cables Power cable 2 x 4 (8-position) or 2 x 6 + 1 x 4 (12-position + 4-sideband)
FL - Full Length, HL - Half Length, HPR - High Performance, RC - Riser configuration
12 x 3.5-inch and rear drive configuration systems do not support a GPU card.
Power, Dimensions & Weight:
Power

Two redundant Hot-Swap AC or DC power supply units.

  • 2800 W Titanium 200—240 VAC or 240 HVDC,
  • 2400 W Platinum 100—240 VAC or 240 HVDC,
  • 1800 W Titanium 200—240 VAC or 240 HVDC,
  • 1400 W Platinum 100—240 VAC or 240 HVDC,
  • 1100 W Titanium 100—240 VAC or 240 HVDC,
  • 1100 W LVDC -48 — -60 VDC,
  • 800 W Platinum 100—240 VAC or 240 HVDC,
  • 700 W Titanium 200—240 VAC or 240 HVDC,
Dimensions & Weight:

Width with Ears: 482.0 mm (18.97")
Width without Ears: 434.0 mm (17.08")
Height: 86.8 mm (3.41")
Length: 736.29 mm (28.98") Ear to PSU handle
Weight: A server with fully populated drives 36.1 kg (79.58 lbs)
A server without drives and PSU installed 25.1 kg (55.33 lbs)

Base Standard Capabilities

FeaturesTechnical Specifications
ProcessorUp to two 4th Generation Intel Xeon Scalable processor with up to 56 cores per processor and with optional Intel® QuickAssist Technology
Memory
  • 32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 4800 MT/s
  • Supports registered ECC DDR5 DIMMs only
Storage controllers
  • Internal Controllers: PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i
  • Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB
  • External HBA (non-RAID): HBA355e
  • Software RAID: S160
Drive BaysFront bays:
  • Up to 12 x 3.5-inch SAS/SATA (HDD/SSD) max 240 TB
  • Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 122.88 TB
  • Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 245.76 TB
  • Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 368.64 TB
Rear bays:
  • Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 30.72 TB
  • Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 61.44 TB
Power Supplies
  • 2800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
  • 2400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant
  • 1800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
  • 1400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant
  • 1100 W Titanium 100—240 VAC or 240 HVDC, hot swap redundant
  • 1100 W LVDC -48 — -60 VDC, hot swap redundant
  • 800 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant
  • 700 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
Cooling Options
  • Air cooling
  • Optional Direct Liquid Cooling (DLC)
Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
Fans
  • Standard (STD) fans/High performance Silver (HPR) fans/ High performance Gold (VHP) fans
  • Up to 6 hot plug fans
Dimensions
  • Height – 86.8 mm (3.41 inches)
  • Width – 482 mm (18.97 inches)
  • Depth – 772.13 mm (30.39 inches) with bezel
    758.29 mm (29.85 inches) without bezel
Form Factor2U rack server
Embedded Management
  • iDRAC9
  • iDRAC Direct
  • iDRAC RESTful API with Redfish
  • iDRAC Service Module
  • Quick Sync 2 wireless module
BezelOptional LCD bezel or security bezel
OpenManage Software
  • CloudIQ for PowerEdge plug in
  • OpenManage Enterprise
  • OpenManage Enterprise Integration for VMware vCenter
  • OpenManage Integration for Microsoft System Center
  • OpenManage Integration with Windows Admin Center
  • OpenManage Power Manager plugin
  • OpenManage Service plugin
  • OpenManage Update Manager plugin
MobilityOpenManage Mobile
OpenManage Integrations
  • BMC Truesight
  • Microsoft System Center
  • OpenManage Integration with ServiceNow
  • Red Hat Ansible Modules
  • Terraform Providers
  • VMware vCenter and vRealize Operations Manager
Security
  • Cryptographically signed firmware
  • Data at Rest Encryption (SEDs with local or external key mgmt)
  • Secure Boot
  • Secure Erase
  • Secured Component Verification (Hardware integrity check)
  • Silicon Root of Trust
  • System Lockdown (requires iDRAC9 Enterprise or Datacenter)
  • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
Embedded NIC2 x 1 GbE LOM card (optional)
Network options1 x OCP card 3.0 (optional)
Note: The system allows either LOM card or an OCP card or both to be installed in the system.
GPU OptionsUp to 2 x 350 W DW and 6 x 75 W SW
PortsFront Ports
  • 1 x iDRAC Direct (Micro-AB USB) port
  • 1 x USB 2.0
  • 1 x VGA
Rear Ports
  • 1 x Dedicated iDRAC Ethernet port
  • 1 x USB 2.0
  • 1 x USB 3.0
  • 1 x VGA
  • 1 x Serial (optional)
  • 1 x VGA (optional for Direct Liquid Cooling configuration)
Internal Ports
  • 1 x USB 3.0 (optional)
PCIeUp to eight PCIe slots:
  • Slot 1: 1 x8 Gen5 or 1 x8/1 x16 Gen4 Full height, Half length or 1 x16 Gen4 Full height, Full length
  • Slot 2: 1 x8/1 x16 Gen5 or 1 x8 Gen4 Full height, Half length or 1 x16 Gen5 Full height, Full length
  • Slot 3: 1 x16 Gen4 Low profile, Half length
  • Slot 4: 1 x8 Gen4 Full height, Half length
  • Slot 5: 1 x8/1 x16 Gen4 Full height, Half length or 1 x16 Gen4 Full height, Full length
  • Slot 6: 1 x16 Gen4 Low profile, Half length
  • Slot 7: 1 x8/1 x16 Gen5 or 1 x8 Gen4 Full height, Half length
  • Slot 7 SNAPI: 1 x16 Gen5 Full height, Half length
  • Slot 8: 1 x8 Gen5 or 1 x8 Gen4 Full height, Half length
Operating System and Hypervisors
  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
*Future releases will include additional capacity/form factor.

Spec Sheet 4

Rack Server R760 R660 R7625 R6625 R7615 R6615
Key attributes Provides performance and versatility for demanding applications Provides performance and versatility for demanding applications Breakthrough performance Breakthrough performance Powerful performance and scalability Peak performance and excellent TCO
Target workloads Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization Software-Defined Storage (SDS), Virtualization, Data Analytics Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV)
Type of processor 2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor 2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor 1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores
Memory (DDR5 DIMM slots & max) 32 (8 TB) 24 (1.5 TB*) 12 (768 GB*)
Disk drives up to: 12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5” (rear)
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)
4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)
4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
NVMe drives up to: 24 10 24 10 24 10
Gen5 PCIe slots up to: 4 2 4 2 4 2
Gen4 PCIe slots up to: 8 3 8 3 4 3
Accelerator support up to: 2 x 350 W DW or 6 x 75 W SW 2** x 75 W SW 2 x 300 W DW or 6 x 75 W SW 3 x 75 W SW 3 x 300 W DW or 6 x 75 W SW 3 x 75 W SW
Rack height (U) 2 1 2 1 2 1
Integrated security TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks. TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV)
* Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615.
** Future releases will include additional GPU slots in R660.