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HPE Chassis
Network Choice (NC) Both Server come without an emedded LOM on the system board.
Mixing of 2 different processor models is not supported.
Processors with TDP equal to or greater than 150W require High Performance Heatsink (P26479-B21).
Processors with TDP equal to or greater than 205W require High Performance Fan Kit (P26477-B21).
Processors with TDP up to 140W, or starting at 230W -both included- require DIMM blanks kit (P07818-B21).
DIMM blanks kit (P07818-B21) recommended with processor TDPs ranging from 150W to 225W -both included- as enhance cooling.
Please read the Specs Manual PDF at the bottom for all the Processor Rules
Intel Xeon Gen3
Supports up to (2) Processors
Bezel and SID and more (Optional)
Bezel Lock Kit needs the Bezel installed as well.
If you install a System Insight Display (SID) it will remove the iLO Service port on the front of the chassis
DIMM Blank Required by processors with TDP up to 140W, or starting at 230W
DIMM Blank Recommended with processor TDPs ranging from 150W to 225W -both included- as enhance cooling.
Cable Kit (Optional)
Please read the names of the Cable kits carefully.
For more detail on which cable to use. Please refer to the Spec Manual at the bottom of the page.
Memory RDIMM LRDIMM (Optional)
Supports up to 32 DIMMS on a 2 Socket configuration
Mixing of 3DS and non-3DS DIMMs not allowed.
3DS Memory Requires High Performance Fan Kit (P26477-B21) and DIMM blanks kit (P07818-B21)
3DS Memory Not supported with HPE IB HDR\/EN 200Gb 2p QSFP56 OCP3 Adapter.
Presistent Memory (Optional)
A maximum of 16 HPE Persistent Memory supported on the following 3rd Generation Intel Xeon Scalable Processor series (Platinum 8300, Gold 6300 and Silver 4310).
Supported on quantities of 1, 2, 4 or 8 per socket.
Cannot be used with HPE 800W FlexSlot 48VDC Hot Plug Low Halogen Power Supply (865434-B21.
512GB requires High Performance Fan Kit (P26477-B21) and DIMM blanks kit (P07818-B21).
Drive Options (Optional)
No optional backplanes are available for LFF models, 4-bay 12G x1 SAS\/SATA is already included with the server.
All backplanes below support Basic Carrier Drives and Include cabling.
Please view each backplane to learn more details about supported drive, cabling, and limitations.
HPE LFF Drives SAS (3.5in) (Optional)
Supports up to (4) Drives
HPE LFF Drives SATA (3.5in) (Optional)
Supports up to (4) Drives
HPE SFF Drives SAS (2.5in) (Optional)
Supports up to (8 or 10) Drives
All 24G SAS drives require the High Performance Fan Kit (P26477-B21).
HPE SFF Drives SATA (2.5in) (Optional)
Supports up to (8 or 10) Drives
All 24G SAS drives require the High Performance Fan Kit (P26477-B21).
PCI Riser Options (Optional)
Not all Risers are avaible for the LFF chassis.
A Secondary Riser requires a second Processor
If an FH Card is installed in the secondary riser, Slot 2 of the primary riser is not usable.
If a FH card is installed in Slot 2 of the Primary riser, the secondary riser is not able to be installed.
The Low Height (LH) controller is required when a PCIe card that exceeds half-length is used in slots 2 or 3.
M.2 (Optional)
The M.2 NS204i-r Riser Kit requires 2 M.2 Drives and a High Performance Fan Kit (P26477-B21).
Cooling (Optional)
High-Performance Heatsink Required for processors with a TDP equal or greater than 150W.
Standard Fan supports processors with a TDP equal or lower than 195W.
High-Performance Fan required by processors with a TDP equal or greater than 205W, and select options.
DIMM Blank Kit is required by processors with TDP up to 140W, or starting at 230W.
DIMM Blank Kit is recommended with processor TDPs ranging from 150W to 225W as enhance cooling.
Networking Adapters (Optional)
Network Adapters, OCP 3.0, InfiniBand Adapters, Omni-Path
100GbE or greater NICs, 24G SAS drives require high-performance fans.
If you select an OCP 3.0, the OCP x16 Enablement Kit (P36661-B21) is required.
FlexibleLOM Adapters (Optional)
None of the cards below can be used in conjunction with the OCP x16 Enablement Kit (P36661-B21) or the Smart Array-NVMe Adapter Kit (P38585-B21).
SR series and MR series Tri Mode controllers cannot be mixed in the same configuration.
If selected along a 2 SFF x4 U.3 or x4 U.2 backplane, the 2 SFF Tri-Mode Cable (P36657-B21) is required
Host Bus Adapters (HBAs) (Optional)
Storage Controller (Optional)
If you select a Performance Smart Array you will need one of the Energy Packs.
96 W Battery Supports up to 6 storage controllers.
The Capacitor Supports up to 3 storage controllers (except SR932i-p, which limits the system at 2 controllers max).
Software RAID (Optional)
Requires UEFI, not supported on Legacy Mode.
GPU (Optional)
Requires the selection of a 2nd Processor
Only installed in x16 FH Slots. If installed in the secondary riser slot 3. Slot 2 of the primary riser will be obsolete.
Rail Kit, Optical Drives, USB (Optional)
Optical Drive, Rail Kits and USB Devices
ODD Requires cable for optical drive (P26459-B21) to install on 4 LFF models.
ODD Requires Universal Media Bay Kit (P40003-B21) to install on 8 SFF models.
Server Management (Optional)
iLO, FIO Settings, Trusted Platform Settings
HPE iLO with Intelligent Provisioning (standard)
Power Supply Unit (PSU)
Mixing of 2 different power supplies is NOT supported.
Helpful Tip: Once desired configuration is selected click "Add to Cart". From the cart page you can submit a submit a quote request for best pricing
Do you need to efficiently expand or refresh your IT infrastructure to propel the business? Adaptable for diverse workloads and environments, the compact 1U HPE ProLiant DL360 Gen10 Plus server delivers enhanced performance with the right balance of expandability and density. Designed for supreme versatility and resiliency while backed by a comprehensive warranty, the HPE ProLiant DL360 Gen10 Plus server is ideal for IT infrastructure, either physical, virtual, or containerized.
The HPE ProLiant DL360 Gen10 Plus server supports the 3rd Generation Intel® Xeon® Scalable Processors with up to 40 cores, plus 3200 MT/s HPE DDR4 SmartMemory up to 4.0 TB per socket. Introducing PCIe Gen4 and Intel® Software Guard Extensions (SGX) support on the dual-socket segment, the HPE ProLiant DL360 Gen10 Plus server complements Gen10 reach by delivering premium compute, memory, I/O, and security capabilities for customers focused on performance at any cost.
What’s New for DL360 Gen10
Built for Some of the Most Demanding Workloads
The HPE ProLiant DL360 Gen10 Plus server is powered by 3rd Generation Intel® Xeon® processors and built with foundational intelligence to transform IT with insights that enhance workload performance, placement, and efficiency, delivering better outcomes faster.
HPE ProLiant servers provide real-time operational feedback on server performance plus recommendations for fine-tuning BIOS settings to adjust to better serve changing business needs.
Know your Server - CTO Configuration Support
Need help with the configuration? Contact us today!
HPE DL360 Gen10 Base Knowledge.
The DL360 Gen10 Plus HPE Rack Server is a 1U 2P system with 3 PCIe 4.0 slots on two Riser Cages. The DL360 Gen10 Supports 32 DDR4 DIMMs up to 3200 MHz, the mixing of 2 different processor models is not supported. The DL360 Gen10 Plus includes 5 fans on a Single Socket configuration and 7 Fans on a Dual socket configuration. If the processor’s TDP is 150W or higher, you will need the High-Performance Heatsink (P26479-B21). If the processor’s TDP is 205W or higher you will also need the High-Performance Fan Kit (P26477-B21). The last rule is about the DIMM blank kit (P07818-B21). If the CPU is under TDP 140W or 230W and above, it is required to have a DIMM blank kit. If the TDP is ranging from 140W to 225W the DIMM kit is recommended but not required. Please keep this in mind when selecting a CPU.
Each processor supports up to 2 x8 PCIe 4.0 connectors per socket for NVMe connectivity. On 2P configuration, these provide support for up to 8 direct attach NVMe drives. Options are available to connect 2 additional bays via the Primary NVMe riser which has a 1 x8 NVMe slimline port to connect the additional drive bays 9 and 10. Or the HPE ProLiant DL365 Gen10 Plus Smart Array to NVMe Adapter Kit (P38585-B21) which is installed in the same slot as the Flexible Storage controllers. This NVMe Adapter Kit can’t be used with the OCP x16 or the NVMe riser and is not supported on the 4LFF chassis.
There are some extra rules when it comes to NVMe drives and backplanes. We have to be careful about which NVMe drive we install on which backplane / Tri-Mode controller. When installing the 8SFF x4 NVMe 16G U.2 BC Backplane Kit P26433-B21 you can only install a U.2 SSDs. Likewise, the 8SFF x1 Tri-Mode 24G U.3 BC Backplane Kit P26431-B21 can only install the U.3 NVMe SSDs.
Memory
The memory is not as complex as the backplane installations. Mixing RDIMM and LRDIMM memory is not supported. Mixing of 3DS and non-3DS DIMMs is not allowed. Intel Persistent Memory 200 series is only supported on Gold and Platinum Processors. All processors support up to 6TB of memory per socket. (Up to 8 per socket can be used for Intel Optane Persistent Memory 200 Series). A maximum of 16 HPE Persistent Memory Kits are supported on the following 3rd Generation Intel Xeon Scalable Processor series (Platinum 8300, Gold 6300, and Silver 4310). Cannot be used with HPE 800W FlexSlot 48VDC Hot Plug Low Halogen Power Supply (865434-B21).
HPE DL360 Gen10 Plus Maximum Memory
- DIMM Slots Available 32 16 DIMM slots per processor, 8 channels per processor, 2 DIMMs per channel
- Maximum capacity (LRDIMM) 8.0 TB 32 x 256 GB LRDIMM @ 3200 MT/s
- Maximum capacity (RDIMM) 2.0 TB 32 x 64 GB RDIMM @ 3200 MT/s
- Maximum capacity (Intel Persistent Memory) 8.0 TB 16 x 512 GB Intel Persistent Memory 200 Series for HPE
HPE DL360 Gen10 Plus Maximum Internal Storage
- Hot Plug SFF SAS HDD 24.0 TB 8+2 x 2.4 TB (with optional 2 SFF cage on UMB)
- Hot Plug SFF SATA HDD 20 TB 8+2 x 2.0 TB (with optional 2 SFF cage on UMB)
- Hot Plug SFF SAS SSD 153.0 TB 8+2 x 15.3 TB (with optional 2 SFF cage on UMB)
- Hot Plug SFF SATA SSD 76.8 TB 8+2 x 7.68 TB (with optional 2 SFF cage on UMB)
- Hot Plug SFF NVMe PCIe SSD 6 TB 8+2 x 15.36 TB (with optional 2 SFF cage on UMB)
- Hot Plug LFF SAS HDD 72.0 TB 4 x 18 TB
- Hot Plug LFF SATA HDD 72.0 TB 4 x 18 TB
- Hot Plug LFF SAS SSD 6.40 TB 4 x 1.60 TB
- Hot Plug LFF SATA SSD 72 TB 4 x 7.68 TB
- NVMe M.2 SSD 960 GB 2 x 480 GB (with NS204i-p boot device or NS204i-r Riser)
The DL360 Gen10 Plus has three Software RAIDs that can be enabled. All three are off by default and will only use UEFI Mode. Legacy mode is supported when there is an additional controller installed and the legacy mode setting is selected (758959-B22). Below we will highlight the difference between the three.
Note: Intel VROC NVMe, for legacy support an additional Tri-Mode controller will be needed.
HPE Smart Storage SR100i SR Gen10 Plus SW RAID
All models feature an embedded storage controller, capable of operating on AHCI or SR100i modes, with embedded software supporting RAID for either up to 14 SATA drives or 2 NVMe SSDs. In addition, all models feature 2 x8 PCIe 4.0 connectors per socket for NVMe SSDs, which must be used on SR100i mode. NVMe SSDs are qualified on SFF models only.
Intel Virtual RAID on CPU (VROC) NVMe for HPE ProLiant Gen10 Plus
All models feature 2 x8 PCIe 4.0 connectors per socket for NVMe connectivity. On 2P configurations, these provide support for up to 8 direct attach NVMe bays with support for 2 additional bays. Only supported on SFF models the Intel VROC is an enterprise, hybrid Software RAID solution specifically designed for NVMe SSDs connected directly to the CPU. Intel VROC is a software-based solution utilizing Intel CPU to RAID or HBA direct connected drives and supports both Intel® SFF SSDs and HPE SFF SSDs. RAID Support- 0/1/5/10 for NVMe SSDs only, no PCIe card support.
Intel Virtual RAID on CPU (VROC) SATA for HPE ProLiant Gen10 Plus
All models feature an embedded storage controller, with embedded software SATA RAID support for up to 14 bays. Intel VROC is an enterprise, hybrid Software RAID solution specifically designed for SSDs and is utilizing Intel CPU to RAID or HBA direct connected drives. Intel VROC supports both Intel® SFF SSDs and HPE SFF SSDs with RAID Support for 0/1/5/10.
Chassis Options
Network Choice (NC) Models
Network Choice models do not include embedded LOM. To enable networking capability please select a validated alternative NIC, OCP, or PCIe.
- HPE DL360 Gen10 Plus 4 LFF NC CTO Server (P28947-B21)
- HPE DL360 Gen10 Plus 8 SFF NC CTO Server (P28948-B21)
Each processor feeds 2 x8 front NVMe connectors, supporting up to 8 drives on a 2P configuration. Both sockets must be populated for all NVMe connectors to be usable.
The DL360 Gen10 4LFF NC Chassis (P28947-B21) has very limited options and comes with the 4LFF backplane while the 8SFF NC Chassis has a plethora of options. With the 8SFF Chassis, you can have three types of backplanes/drives supported. The non-NVMe backplane is the simplest in the section. The next option is to have U.2 NVMe or a U.3 NVMe backplane. Each of these NVMe backplanes has additional drive add-ons for each. Do not mix U.2 and U.3 NVMe drives or backplanes together. Below are the Backplane and Add-ons selections grouped together to make things easier.
- 8SFF SAS/SATA 12G BC Backplane Kit P26427-B21
- 2SFF SAS/SATA 12G BC Drive Cage Kit P26435-B21
- --
- 8SFF x1 Tri-Mode 24G U.3 BC Backplane Kit P26431-B21
- 8SFF x4 Tri-Mode 24G U.3 BC Backplane Kit P26429-B21
- 2SFF x4 Tri-Mode 24G U.3 BC Drive Cage Kit P26437-B21
- --
- 8SFF x4 NVMe 16G U.2 BC Backplane Kit P26433-B21
- 2SFF x4 NVMe 16G U.2 BC Drive Cage Kit P26439-B21
- --
- 8SFF Display Port/USB/Optical Drive Blank Kit P40003-B21
- LFF Display Port/USB Kit P26455-B21
HPE DL360 Gen10 M.2 Drives
Below are the 3 ways to install M.2 Drives on the DL360 Gen10 Plus Rack Server by HPE.
NVMe Boot Devices are only supported in UEFI mode.
• HPE DL36X Gen10 Plus x16/x8 M.2 NS204i-r Riser (P26463-B21)
• HPE NS204i-p NVMe PCIe3 OS Boot Device (P12965-B21)
• HPE Universal SATA AIC HHHL M.2 SSD Kit (878783-B21)
For any major release beyond VMware ESXi 7.x, VMware will require M.2 or another local persistent device as the standalone boot option.
HPE DL360 Gen10 PCI Risers
The DL360 Gen10 Plus Rack Server has 2 riser cages and 3 PCIe slots. The first riser cage is a butterfly riser composed of Slots 1 and 2. The secondary slot can only be installed on a 2P configuration and rules apply to the Full Height Secondary Riser when installed.
- Primary Riser Kit x16/x16 GPU P31228-001
- Primary Riser Kit x16/x8 PCIe M.2 NS204i-r P26463-B21
- Primary Riser Kit x16/x8 2NVMe P26465-B21
- Secondary Riser Low Profile Kit P26471-B21
- Secondary Riser Full Height GPU Kit P26467-B21
When the Secondary Riser Full Height Kit is installed, the primary PCIe Slot #2 cannot be used. Only 2 full height slots are supported. Also, when a second full-height card is installed on slots 2 or 3, then an LH storage controller (low-profile heatsink) should be ordered to allow it to fit in the server.
Riser Information |
Part Number |
Description |
Riser Position |
Slot Bus Width (Gen4 Lanes) |
GPU Support |
NVMe Direct Connect |
M.2 Connections |
Primary |
Secondary |
#1 |
#2 |
#2 |
|
Connectors |
Max SSDs |
|
P31228-001 |
HPE DL360 Gen10 Plus x16/x16 Primary GPU Riser |
Default |
N/A |
x16 |
x16 |
N/A |
Y |
N/A |
N/A |
N/A |
P26463-B21 |
HPE DL36X G10 Plus x16/x8 2x M.2 NS204i-r Primary Riser |
Optional |
N/A |
x16 |
x8 |
N/A |
Y (only slot 1, GPU Max 75W) |
N/A |
N/A |
2 |
P26465-B21 |
HPE DL36X G10 Plus 8 SFF x16/x8 2NVMe Primary Riser |
Optional |
N/A |
x16 |
x8 |
N/A |
Y (only slot 1) |
1 |
2 |
N/A |
P26471-B21 |
HPE DL360 Gen10 Plus x16 LP Secondary Riser Kit |
N/A |
Optional |
N/A |
N/A |
x16 |
Y (GPU Max 75W) |
N/A |
N/A |
N/A |
P26467-B21 |
HPE DL36x Gen10 Plus x16 FH GPU Secondary Riser Kit |
N/A |
Optional |
N/A |
N/A |
x16 |
Y |
N/A |
N/A |
N/A |
HPE DL360 Gen10 GPU / Workload Accelerator
All x16 PCIe Slots support GPU’s, The default primary Riser (P31228-001) and the secondary GPU riser (P26467-B21) have power slots on the riser. If the secondary GPU riser is installed and you have a Flexible Storage Controller installed. You must make sure the Flexible Storage Controller is an LH Controller. Otherwise, the card will be touching the controller and they won’t fit.
OCP 3.0
The DL360 Gen10 Plus is a Network Choice (NC) Server meaning it does not have an embedded Network card. So, you have the choice of either an OCP 3.0 or a Stand-in PCI Card. There are some limitations as to when the OCP 3.0 is supported. The OCP 3.0 adds x8 PCIe 4.0 lanes to the OCP slot, recovering from unused AROC connectors on configurations without Flexible Storage controllers. The OCP 3.0 cannot be used in conjunction with the Smart Array-NVMe Adapter Kit (P38585-B21) or any Flexible Storage Controllers. Both these devices use the same Type-A slot on the system board which the OCP uses to provide the x8 PCIe lanes to the OCP port.
HPE DL360 Gen10 Cooling
The options below all require the High-Performance Fan Kit (P26477-B21) which comes with 7 fans.
- Processors with TDP equal to or greater than 205W
- Intel Optane 512GB persistent memory 200 Series for HPE (P23538-B21)
-
Primary Riser x16/x82x M.2 NS204i-r(P26463-B21)
- Primary Riser x16/x8 2x NVMe (P26465-B21)
- 100GbE or greater NICs/HBAs
- Accelerators
- 24G SAS drives
- NVMe SSDs
Processors with TDP equal to or greater than 150W require High-Performance Heatsink (P26479-B21).
DIMM blanks kit (P07818-B21) is recommended with processor TDPs ranging from 150W to 225W and is required by processors that are 140W and below as well as 230W and above. This DIMM Blank kit acts as enhanced cooling not only for the processors but also for the Intel Optane 512GB persistent memory 200 Series for HPE (P23538-B21) as well.
The CTO server includes 5 standard fans. Dual processor configurations require 7 fans, either standard or high performance (dependent on processor model).
Cooling Options Summary |
CPU TDP (Watts) |
85W - 140W |
150W - 195W |
205W - 225W |
230W - 270W |
Heatsink |
Standard (P37863-B21) |
High Performance (P26479-B21) |
High Performance (P26479-B21) |
High Performance (P26479-B21) |
Fans |
Standard (5 included on base server, P37861-B21 for 2P configs) |
Standard (5 included on base server, P37861-B21 for 2P configs) |
High Performance (P26477-B21) |
High Performance (P26477-B21) |
DIMM Blanks |
Required (P07818-B21) |
Recommended (P07818-B21) |
Recommended (P07818-B21) |
Required (P07818-B21) |
HPE DL360 Gen10 Flex Slot your power!
Mixing of 2 different power supplies is NOT supported.
HPE Flexible Slot (Flex Slot) Power Supplies share a common electrical and physical design that allows for hot plug, tool-less installation into HPE ProLiant Gen10 Plus Performance Servers. Flex Slot power supplies are certified for high-efficiency operation and offer multiple power output options, allowing users to "right-size" a power supply for specific server configurations. This flexibility helps to reduce power waste, lower overall energy costs, and avoid "trapped" power capacity in the data center.
More Info
“U” processors (i.e. 6314U, 6312U) only supported in single socket configurations.
Mixing of 3DS and non-3DS DIMMs not allowed.
Load Reduced 3DS Smart Memory P06039-B21 and 512GB persistent memory P23538-B21 Requires High Performance Fan Kit (P26477-B21) and DIMM blanks kit (P07818-B21).
The x1 Tri-Mode 24G U.3 BC Backplane Kit (P26431-B21) does not support Direct Attached NVMe drives.
NVMe Adapter Kit, OCP x16 Enablement kit, and Flexible Storage controllers all use the same system port. Only one of these can be installed at any one time.
HPE DL360 Gen10 Lights Out! iLO
HPE iLO 5 ASIC
HPE Integrated Lights-Out (HPE iLO) - Monitor your servers for ongoing management, service alerting, reporting, and remote management with HPE iLO.
UEFI - Configure and boot your servers securely with industry-standard Unified Extensible
Firmware Interface (UEFI).
RESTful API - iLO RESTful API is Redfish API conformance and offers simplified server management automation such as configuration and maintenance tasks based on modern industry standards..
Intelligent Provisioning – Hassle-free server and OS provisioning for 1 or few servers with Intelligent Provisioning.