Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Direct Liquid Cooling

Bezel

Memory

Drive cage

Storage Devices

HDD 3.5" Drives

HDD 2.5" Drives

SSD 2.5" Drives

SSD 2.5" NVMe Drives

SSD 1.8" EDSFF E3.S Drives

Riser Configurations

OCP NIC

GPU

Rail Kit

Boot Optimized Storage Subsystem (BOSS)

Internal USB

Trusted Platform Module (TPM)

iDRAC9

Power

ECS Warranty

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Dell PowerEdge R6625 Rack Server | Configurable

 

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Select Chassis

Select Processor

Supports up to 2 Processor

AMD 4th Gen 9004

Supports up to 2 Processor

Direct Liquid Cooling (Optional)

DLC does not support single processor configuration
If the DLC is not selected, the correct Heatsink and Fans will be installed based off your CPU choice..

Bezel

Memory

Supports up to 24 DIMMs
DIMM Blank is required to be installed in all empty DIMM slots.
DIMM blank is not required for liquid cooling configuration. DLC does not support single processor configuration
Mixing different DIMM capacities is not supported.
All DIMMs populated must be RDIMM
Mixing different widths (x4 & x8) is not supported
256 GB RDIMM is not supported in 4 x 3.5-inch chassis configuration.

Drive cage (Optional)

These Rear Drive Cages do not come with drives. You will have to select those as well in this CTO.

Storage Devices (Optional)

Max 3 PCIe Slots with support for PERC 11 and PERC 12 controllers.

HDD 3.5" Drives (Optional)

Supports up to 4 Drives

HDD 2.5" Drives (Optional)

Supports up to 10 Front drives and 2 Rear drives depending on the configuration.

SSD 2.5" Drives (Optional)

Supports up to 10 front drives or 2 Rear drive depending on the configuration.

SSD 2.5" NVMe Drives (Optional)

Max 10 NVMe Drives with the correct controller and Chassis Selected.

SSD 1.8" EDSFF E3.S Drives (Optional)

Supports up to 16 Front drives or 2 Rear drives

Riser Configurations (Optional)

Please view each confiuration for more details.

OCP NIC (Optional)

The system allows either LOM card or an OCP card or both to be installed in the system.

GPU (Optional)

Supports up to 3 x 75W GPUs

Rail Kit (Optional)

Boot Optimized Storage Subsystem (BOSS) (Optional)

Internal USB (Optional)

Trusted Platform Module (TPM) (Optional)

iDRAC9 (Optional)

iDRAC9 Express (Default)

Power

Supports up to 2 PSU
Mixing of PSUs is not supported.

ECS Warranty

Helpful Tip: Once desired configuration is selected click "Add to Cart".
From the cart page you can submit a submit a quote request for best pricing

Quick Specs
Form Factor:

1U rack server

Processor | Max: 128 Cores

2x 4th Gen AMD 9004 Series

Memory | Max: 6TB

24 ECC DDR5 RDIMM 4800Mhz

Storage | Max: 153.6TB

4x LFF SAS/SATA (HDD/SSD) | Max: 80TB,
8x SFF NVMe SSD | Max: 122.88TB,
10x SFF SAS/SATA/NVMe (HDD/SSD) | Max: 153.6TB,
14x EDSFF E3.S Gen 5 NVMe (SSD) | Max: 89.6TB
16x EDSFF E3.S Gen 5 NVMe (SSD) | Max: 102.4TB

Rear Drives | Max: 30.72TB

2x SFF SAS/SATA (HDD/SSD) NVMe | Max: 30.72TB
2x EDSFF E3.S Gen5 NVMe (SSD) | Max: 12.8TB

Storage Controller:

S160(SW RAID)
H965i, H755, H755N, H355, HBA355i, HBA355e, HBA465e, H965e

Boot Options:

BOSS-N1 (hot Swap)
Internal USB

Networking Options (NOC):

1 x OCP card 3.0 (supported by x8 PCIe lanes)
2x 1Gb with BCM5720 LAN controller
Note: The system allows either LOM card or an OCP card or both to be installed in the system.

Remote Management:

iDRAC9 with Lifecycle Controller

PCIe Slots:

2x or 3x PCIe 4.0 & 5.0

GPU:

Up to 3 x 75 W SW


Ideal for:
  • High-Performance Computing (HPC)
  • Virtual Desktop Interface (VDI)
  • Virtualization

The Dell PowerEdge R6625 is a 1U dual-socket rack server engineered as a foundation for modern data centers, delivering strong compute performance alongside flexible, low-latency storage — packed into a dense footprint with air-cooled or Direct Liquid Cooling (DLC) options.

Drive Bay Options

Configuration-wise, the R6625 packs 2 processors and 24 DIMMs of DDR5 memory, with room for up to 3 PCIe slots plus dedicated LOM and OCP slots. Cooling flexes between air and Direct Liquid Cooling depending on build and CPU TDP, and this Gen16 Dell rack server can accommodate up to 3 single-width 75W GPUs.

Chassis Options

Front bays:

  • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 80 TB
  • Up to 8 x 2.5-inch NVMe max 122.88 TB
  • Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 153.6 TB (Universal)
  • Up to 14 x E3.S (NVMe Gen5 ) max 89.6 TB
  • Up to 16 x E3.S (NVMe Gen5 ) max 102.4 TB
Rear bays:

Only the 4 LFF and the 10 Universal Chassis support rear drive cages.

  • Up to 2 x 2.5-inch SAS/SATA (HDD/SSD) max 30.72 TB
  • Up to 2 x E3.s (NVMe Gen5) max 12.8 TB
Processors and Heatsinks
Processor

Two 4th Generation AMD EPYC 9004 series processors, offering up to 128 cores, power this configuration. Any CPU exceeding 240W requires DIMM blanks in all unpopulated DIMM slots.

Heatsink & Fans

Cooling capacity comes from up to four sets of dual-fan modules, offered in Standard or High-Performance Gold hot-plug variants. When an OCP card is present in a no-riser configuration (RC0), an OCP shroud is required, and air-cooled builds with a 2x 2.5" rear-drive configuration need a Rear Drive Shroud installed as well.

Memory

Memory tops out at 24 RDIMMs, supporting up to 6TB total capacity and speeds up to 4800 MT/s. Note that 256GB RDIMMs aren't compatible with the 4x 3.5" chassis configuration, and mixing DIMM types isn't supported.

DIMM type Rank Capacity Operating Speed
1 DIMM per channel (DPC)
DDR5 RDIMM 1 R 16 GB 4800 MT/s
2 R 32 GB, 64 GB 4800 MT/s
4 R 128 GB 4800 MT/s
8 R 256 GB 4800 MT/s
Expansion Slots

Three PCIe 4.0/5.0 expansion slots support up to 2x 75W single-wide GPUs, per the configurations outlined below. Keep in mind that installing rear drive cages will occupy most of these PCIe slots.

Config # RSR Configuration # of CPUs /
# of PCIe Slots
PERC type supported Rear Storage Possible
0 NO RSR 2 / 0 Front PERC No
1 R2A + R3A 2 / 3 Front PERC No
2 R2P + R3P 2 / 3 Front PERC No
3 R1P + R4P 2 / 2 Front PERC No
4 R2Q 2 / 2 Front PERC No
5 R3P 2 / 1 Front PERC Yes
6 R2S+R3S 2 / 2 Front PERC Yes
7 R2A 1 / 1 Front PERC No
8 R2A+ R4-E3 Paddle card 2 / 2 Front PERC No
Networking Adapters (LOM + OCP 3.0)

The Dell PowerEdge R6625 offers three paths for network expansion: PCIe slots, the onboard LOM, or the OCP 3.0 slot.

With only 3 PCIe slots available, the R6625 fills up quickly — which is why two additional network adapter options exist. The LOM slot supports up to 2 ports at 1Gb speeds (LOM board, 2x 1Gb with BCM5720 LAN controller), while the OCP slot handles up to 4 ports reaching speeds of 25Gb/s.

NOTE: Both the LOM card and OCP can be installed at the same time.
Feature OCP 3.0
Form factor SFF
PCIe Gen Gen4
Max PCIe width x8
Max no.of ports 2
Port type BT/SFP+/SFP28
Max port speed 25 GbE
NC-SI Yes
WoL Yes
Power consumption 35 W
Storage Controllers
New to 16G

The Harpoon-based Premium Performance tier is a new addition to 16G, engineered to boost IOPS and enhance SSD performance at the high end..


fPERC Solution

The fPERC solution rounds out Dell's RAID controller lineup, providing a base RAID hardware controller that skips PCIe slot consumption via a compact, high-density connector to the base planar.


8 SFF NVMe Chassis

Opting for the 8 SFF NVMe chassis with RAID means installing the H755N storage controller, which is built to support NVMe drives.


BOSS-N1

The BOSS-N1 hot-swap boot device includes 2x M.2 480GB NVMe SSD drives and occupies a dedicated motherboard slot to manage OS booting. If it's not installed, that slot must be filled with a BOSS blank instead.

Performance Level Controller and Description
Entry S160 (SATA, NVMe), SW RAID SATA, NVMe
Value H355, HBA355 (internal/External), HBA465 (external)
Premium Performance H755, H755N, H965 (internal/external)
Power & Dimensions


Base Standard Capabilities

FeatureTechnical Specifications
ProcessorUp to two AMD EPYC 4th Generation 9004 Series with up to 128 cores per processor
Memory• 24 DDR5 DIMM slots, supports RDIMM 6 TB max, speeds up to 4800 MT/s
• Supports registered ECC DDR5 DIMMs only
Storage controllers• Internal Controllers: PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i
• Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB
• External HBAs (non-RAID): HBA355e
• Software RAID: S160
Drive BaysFront bays:
• Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 80 TB
• Up to 8 x 2.5-inch NVMe (SSD) max 122.88 TB
• Up to 10 x 2.5-inchSAS/SATA/NVMe (HDD/SSD) max 153.6 TB
• Up to 14 x E3.S NVMe direct drives max 89.6 TB
• Up to 16 x E3.S NVMe direct drives max 102.4 TB
Rear bays:
• Up to 2 x 2.5-inch SAS/SATA (HDD/SSD) max 30.72 TB
• Up to 2 x E3.S NVMe direct drives max 12.8 TB
Power Supplies• 1800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
• 1400 W Mixed mode 100—240 VAC or 240 HVDC, hot swap redundant
• 1100 W Mixed mode 100—240 VAC or 240 HVDC, hot swap redundant
• 1100 W LVDC -48 — -60 VDC, hot swap redundant
• 800 W Platinum 100—240 VAC or 240 HVDC , hot swap redundant
Cooling Options• Air cooling
• Optional Direct Liquid Cooling (DLC)
Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
Fans• Standard (STD) fans/High performance Gold (VHP) fans
• Up to 4 sets (dual fan module) hot plug fans
Dimensions• Height – 42.8 mm (1.685 inches)
• Width – 482.0 mm (18.97 inches)
• Depth – 822.89 mm (32.4 inches) with bezel
- 809.05 (31.85 inches) without bezel
Form Factor1U Rack server
Embedded Management• iDRAC9
• iDRAC Direct
• iDRAC RESTful API with Redfish
• iDRAC Service Manual
• Quick Sync 2 wireless module
BezelOptional LCD bezel or security bezel
OpenManage Software• OpenManage Enterprise
• OpenManage Power Manager plugin
• OpenManage Service plugin
• OpenManage Update Manager plugin
• CloudIQ for PowerEdge plug in
• OpenManage Enterprise Integration for VMware vCenter
• OpenManage Integration for Microsoft System Center
• OpenManage Integration with Windows Admin Center
MobilityOpenManage Mobile
OpenManage Integrations• BMC Truesight
• Microsoft System Center
• OpenManage Integration with ServiceNow
• Red Hat Ansible Modules
• Terraform Providers
• VMware vCenter and vRealize Operations Manager
Security• AMD Secure Encrypted Virtualization (SEV)
• AMD Secure Memory Encryption (SME)
• Cryptographically signed firmware
• Data at Rest Encryption (SEDs with local or external key mgmt)
• Secure Boot
• Secured Component Verification (Hardware integrity check)
• Secure Erase
• Silicon Root of Trust
• System Lockdown (requires iDRAC9 Enterprise or Datacenter)
• TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
Embedded NIC2 x 1 GbE LOM card (optional)
Network options1 x OCP 3.0 card (optional)
Note: The system allows either LOM card or an OCP card or both to be installed in the system.
GPU Options3 x 75 W SW
PortsFront Ports
• 1 x iDRAC Direct (Micro-AB USB) port
• 1 x USB 2.0
• 1 x VGA
Rear Ports
• 1 x Dedicated iDRAC Ethernet port
• 1 x USB 3.0
• 1 x USB 2.0
• 1 x Serial (optional)
• 1 x VGA (optional for Direct Liquid Cooling configuration)
Internal Ports
• 1 x USB 3.0 (optional)
PCIeUp to three PCIe slots
• Slot 1: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length
• Slot 2: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length
• Slot 3: 1 x16 Gen5 or1 x16 Gen4 Low profile, Half length
Operating System and Hypervisors• Canonical Ubuntu Server LTS
• Microsoft Windows Server with Hyper-V
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• VMware ESXi

Specs 1

Rack ServerR760R660R7625R6625R7615R6615
Key attributesProvides performance and versatility for demanding applicationsProvides performance and versatility for demanding applicationsBreakthrough performanceBreakthrough performancePowerful performance and scalabilityPeak performance and excellent TCO
Target workloadsMixed Workload Standardization Database and Analytics Virtual Desktop InfrastructureHigh Density Virtualization, Dense Database Analytics, Mixed Workload StandardizationHigh Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), VirtualizationHigh Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), VirtualizationSoftware-Defined Storage (SDS), Virtualization, Data AnalyticsVirtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV)
Type of processor2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores
Memory (DDR5 DIMM slots & max)32 (8 TB)24 (1.5 TB*)12 (768 GB*)
Disk drives up to:12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5” (rear)
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)
4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)
4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
NVMe drives up to:241024102410
Gen5 PCIe slots up to:424242
Gen4 PCIe slots up to:838343
Accelerator support up to:2 x 350 W DW or 6 x 75 W SW2** x 75 W SW2 x 300 W DW or 6 x 75 W SW3 x 75 W SW3 x 300 W DW or 6 x 75 W SW3 x 75 W SW
Rack height (U)212121
Integrated securityTPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks.TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV)
* Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615.
** Future releases will include additional GPU slots in R660.

Spec Sheet 4

Features PowerEdge R6625 (2S1U) PowerEdge R6525 (2S1U)
Processors Two AMD® EPYC 4th Generation Genoa (SP5) processors Two AMD® EPYC™ Generation 2 or Generation 3 processors.
Processor interconnect Inter-chip global memory interconnect (xGMI) 32GT/sec Inter-chip global memory interconnect (xGMI) 16GT/sec
Memory 24x DDR5 RDIMM, 3DS DIMM DDR5 with ECC, bandwidth up to 4800 MT/s 32x DDR4 RDIMM, LRDIMM, 3DS
Storage Controllers
● PERC 11: HBA355i, H355, H755, H755N
● PERC 12: H965i
● Software RAID: S160
● BOSS-N1

● PERC: H755N, H840, H745, HBA345, H345, HBA355, HBA355e
● Software RAID: S150
● BOSS-S1
● BOSS-S2
PCIe SSD
● Up to 12 (10+2) NVMe direct attach
● Up to 16 x E.3 Gen.5
Up to 10+2 PCIe SSD
Drive Bays Front bays:
● Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 80 TB
● Up to 8 x 2.5-inch NVMe max 122.88 TB
● Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 153.6 TB
● Up to 14 x E3.S (NVMe Gen5 ) max 89.6 TB
● Up to 16 x E3.S (NVMe Gen5 ) max 102.4 TB
Rear bays:
● Up to 2 x 2.5-inch SAS/SATA (HDD/SSD) max 30.72 TB
● Up to 2 x E3.s (NVMe Gen5) max 12.8 TB
Front bays:
● Up to 4 x 3.5-inch SAS/SATA drives
● Up to 8 x 2.5-inch SAS/SATA drives
● Up to 10 x 2.5-inch SAS/SATA/NVMe drives
Rear bays:
● Up to 2 x 2.5-inch SAS/SATA/NVMe drives
Power Supplies
● 1800 W Mixed Mode 100-240 VAC or 240 HVDC, hot swap redundant
● 1400 W Mixed Mode 100-240 VAC or 240 HVDC, hot swap redundant
● 1100 W Mixed Mode 100-240 VAC or 240 HVDC, hot swap redundant
● 1100 W LVDC -48 - -60 VDC, hot swap redundant
● 800 W Platinum 100-240 VAC or 240 HVDC , hot swap redundant

● 1400 W Mixed Mode 100-240 VAC or 240 HVDC, hot swap redundant
● 1100 W Mixed Mode 100-240 VAC or 240 HVDC, hot swap redundant
● 1100 W LVDC -48 - -60 VDC, hot swap redundant
● 800 W Platinum 100-240 VAC or 240 HVDC , hot swap redundant
Cooling Options
● Air Cooling
● Optional Direct Liquid Cooling (DLC)

● Air Cooling
Fans Up to four sets (dual fan module) Standard (STD) / High Performance Gold (HPR Gold) hot plug fans Up to four Standard (STD)/ High performance silver grade (HPR Gold (Silver)), or high performance gold grade (HPR Gold (Gold))
Dimension Height - 42.8 mm (1.685 inches) Height - 42.8 mm (1.685 inches)
Width - 482.0 mm (18.97 inches) Width - 482.0 mm (18.97 inches)
Depth - 822.89 mm (32.4 inches) with bezel Depth - 822.89 mm (32.4 inches) with bezel
Depth - 809.05 (31.85 inches) without bezel Depth - 809.05 (31.85 inches) without bezel
Form Factor 1U rack server 1U rack server
Embedded Management
● iDRAC9
● iDRAC Direct
● iDRAC RESTful API with Redfish
● iDRAC Service Manual
● Quick Sync 2 wireless module

● iDRAC9
● iDRAC Direct
● iDRAC RESTful API with Redfish
● iDRAC Service Manual
● Quick Sync 2 wireless module
Bezel Optional LCD bezel or security bezel Optional LCD bezel or security bezel
OpenManage Software
● OpenManage Enterprise
● OpenManage Power Manager plug-in
● OpenManage Services plug-in
● OpenManage Update Manager plug-in

● OpenManage Enterprise
● LC 3.x
● OpenManage Power Manager plug-in
● OpenManage Services plug-in
● OpenManage Update Manager plug-in
Mobility OpenManage Mobile OpenManage Mobile
Integrations and Connections OpenManage Integrations
● BMC Truesight
● Microsoft System Center
● OpenManage Integration with ServiceNow
● Red Hat Ansible Modules
● Terraform Providers
● VMware vCenter and vRealize Operations Manager
OpenManage Integrations
● Microsoft System Center
● Windows Admin Center (WAC)
● ServiceNow
● Red Hat Ansible Modules
● VMware vCenter

● OM Integration with Microsoft System Center (OMIMSC)
● OM Integration with Vcenter/vROps
Security
● AMD Secure Encrypted Virtualization (SEV)
● AMD Secure Memory Encryption (SME)
● Cryptographically signed firmware
● Data at Rest Encryption (SEDs with local or external key mgmt
● Secure Boot
● Secured Component Verification (Hardware integrity check)
● Secure Erase
● Silicon Root of Trust
● System Lockdown (requires iDRAC9 Enterprise or Datacenter)
● TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ

● Cryptographically signed firmware
● Secure Boot
● Secure Erase
● Silicon Root of Trust
● System Lockdown (requires iDRAC9 Enterprise or Datacenter)
● TPM 1.2/2.0 (optional), TCM 2.0 optional
● AMD Secure Memory Encryption (SME)
● AMD Secure Encrypted Virtualization (SEV)
Embedded NIC 2 x 1GbE LOM (optional) No LOM riser supported on R6525.
Networking Options 1 x OCP card 3.0 (optional)
NOTE: The system allows either LOM card or an OCP card or both to be installed in the system.
OCP 3.0 SCFF (Small Card Form Factor)
GPU Options 2 x 75 W (SW)
● 2 x 75 W (SW/FH)
● 1 x 75 W (SW/FH)
● 3 x 75 W (SW/LP)
Ports Front Ports
● 1 x iDRAC Direct (Micro-AB USB) port
● 1 x USB 2.0
● 1 x VGA
Rear Ports
● 1 x Dedicated iDRAC Ethernet port
● 1 x USB 2.0
● 1 x USB 3.0
● 1 x Serial (optional)
● 1 x VGA (optional for Direct Liquid Cooling configuration)
Front Ports
● 1 x iDRAC USB (Micro-AB USB)
● 1 x USB 2.0
Rear Ports
● 1 x USB 3.0
● 2 x USB 2.0
Internal Port: 1 x USB 3.0 Internal Port: 1 x USB 3.0
PCIe Up to three PCIe slots on Riser cards
● 2 x PCIe Gen5 slots
● 3 x PCIe Gen4 slots
Up to three PCIe slots (4.0 x16)
Operating System and Hypervisors
● Canonical Ubuntu Server LTS
● Microsoft Windows Server with Hyper-V
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● VMware ESXi

● Canonical Ubuntu Server LTS
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● VMware ESXi
● Cent OS