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Home / Dell PowerEdge R-Series Rack Servers / Dell PowerEdge R660 Rack Server | Configurable

Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Liquid Cooling

Bezel

Memory 4800MHz 4th Gen

Memory 5600MHz 5th Gen

Storage Devices

HDD 2.5" Drives

SSD 2.5" Drives

SSD 2.5" NVMe Drives

EDSFF E3.S NVMe Gen 5

Riser Card

OCP Networking NIC

GPU

Trusted Platform Module 2.0

Rail Kit

iDRAC9 Remote Management

Power Cooling

ECS Warranty

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Dell PowerEdge R660 Rack Server | Configurable

Dell

| CTO Servers

 

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Select Chassis

Select Processor

Supports up to 2 Processors.
Depending on the TDP and the configuration you desire. The Heatsinks below will change.
Please read up on the different cooling systems below.

Intel 4th Gen Processors

Support sup to (2) Processors
8470Q and 6458Q are supported only in liquid cooling configuration.
Supports 4800MHz Memory

Intel 5th Gen Processors

Supports 5600MHz Memory

Liquid Cooling (Optional)

DLC required for CPU with a TDP over 300
All Heat Sinks and Fans will be automatically added based on what you add to the CTO.

Bezel (Optional)

Memory 4800MHz 4th Gen (Optional)

32 DIMMS 4800Mhz For 4th Gen Processors

Memory 5600MHz 5th Gen (Optional)

32 DIMMS 5600Mhz For 5th Gen Processors

Storage Devices (Optional)

This system supports a Boot Device BOSS-N1 that its own dedicated slot next to the power supply.
The use of Front PERCs will save a PCIe slot and all the backplanes support at least 1 fPERC.

HDD 2.5" Drives (Optional)

Supports up to 8 or 10 Drives

SSD 2.5" Drives (Optional)

Supports up to 8 or 10 Drives

SSD 2.5" NVMe Drives (Optional)

Supports up to 8-10 Drives

EDSFF E3.S NVMe Gen 5 (Optional)

Supported in the E3.S Chassis

Riser Card (Optional)

The rear drive cage is only supported in the 10SFF Chassis
The rear drive cage is at the bottom of this list and must be selected
Configuration 7 Supports a rear-drive setup, if you want any other risers with these drive. You must select this configuration as well.
Up to 10 Different riser configurations.
Please view each item to see more details or read the manual below.

OCP Networking NIC (Optional)

The OCP Slot supports up to 4x25Gb ports.

GPU (Optional)

The A2 GPU has some limitations as far as what PCIe riser it can go into.
Please read the manual for more directions on how to support a GPU in the R660 Rack Server.

Trusted Platform Module 2.0 (Optional)

Rail Kit (Optional)

iDRAC9 Remote Management (Optional)

iDRAC9 Express (Default)

Power Cooling

Supports up to 2 PSU
Mixing of PSU is not supported.

ECS Warranty

Helpful Tip: Once desired configuration is selected click "Add to Cart".
From the cart page you can submit a submit a quote request for best pricing

Quick Specs
Form Factor:

1U rack server

Processor | Max: 64 Cores

2x 4th or 5th Gen Intel Xeon Scalable

Memory | Max: 8TB

32 ECC DDR5 RDIMM 4800Mhz/5600Mhz
Supports registered ECC DDR5 DIMMs only

Storage | Max: 204.8TB

8x 2.5" SAS4/SATA/NVMe (HDD/SSD) Max: 122.88 TB
10x 2.5" SAS4/SATA/NVMe (HDD/SSD) Max: 153.6 TB
14x EDSFF E3.S NVMe (G5) Max: 179.2 TB
16x EDSFF E3.S NVMe (G5) Max: 204.8 TB

Rear Drives | Max: 30.72TB

2x 2.5" SAS/SATA/NVMe (HDD/SSD)
2x 2.5" EDSFF E3.S Gen5 NVMe (SSD)

Storage Controller:

S160 (SW RAID)
H965i, H755, H755N, H355, HBA355i, HBA355e

Boot Options:

BOSS-N1
USB

Networking Options (NOC):

1x OCP card 3.0 + 2x 1 GbE LOM with BCM5720 LAN controller
Note: The system allows either LOM card or an OCP card or both to be installed in the system.

Remote Management:

iDRAC9 with Lifecycle Controller

PCIe Slots:

3x PCIe (G4 /G5) slots

GPU:

Up to 3 x 75 W SW

Other Versions:

(Click to View)

Ideal For:
  • Data Analytics
  • Virtualization

The Dell PowerEdge R660 is a 1U dual-socket rack server engineered for demanding enterprise workloads like dense database analytics and high-density virtualization. Configuration includes 32 DIMM slots, 3 PCIe slots, 1 OCP slot, and 1 LOM, with 3 available chassis options supporting SAS, SATA, and NVMe drives — details on each storage configuration are outlined below.

Chassis Options
Chassis Supported Configurations
No Drive Chassis Zero drives (no backplane)
8SFF
  • 2.5" (NVMe)
  • 2.5" (NVMe RAID)
  • 2.5" (SAS4/SATA)
  • 2.5" Universal
10SFF + Optional Rear 2SFF Drive
  • 2.5" (SAS4/SATA)
  • 2.5" (SAS4/SATA) + 2x2.5" (SAS4/SATA)
  • 2.5" (SAS4/SATA w/ 4 Universal
  • 2.5" (NVMe)
  • 2.5" (NVMe) + 2x2.5" (NVMe)
  • 2.5" (SAS4/SATA w/ 2 Universal
NOTE: The Rear drive option is only shown in the 10SFF.
Supported Drives
Form Factor Type Speed Rotational Speed Capacities
2.5" vSAS 12 Gb SSD 1.92 TB, 3.84 TB, 960 GB, 7.62 TB
2.5" SAS 24 Gb SSD 1.92 TB, 1.6 TB, 800 GB, 3.84 TB, 960 GB, 7.68 TB
2.5" SATA 6 Gb SSD 1.92 TB, 480 GB, 960 GB, 3.84 TB
2.5" NVMe Gen4 SSD 1.6 TB, 3.2 TB, 6.4 TB, 1.92 TB, 3.84 TB, 15.63 TB, 7.68 TB, 800 GB, 400 GB
2.5" DC NVMe Gen4 SSD 3.84 TB, 960 GB
2.5" SAS 12 Gb 10 K 600 GB, 1.2 TB, 2.4 TB

Processor | 4th / 5th Generation Intel Xeon Scalable

Configurations support up to two 4th or 5th Generation Intel Xeon Scalable processors, offering up to 56 cores each with optional Intel® QuickAssist Technology. The 8470Q and 6458Q models require liquid cooling exclusively, and processor mixing isn't recommended — if one socket uses a liquid-cooled processor, the second must match.

  • Faster UPI with up to four Intel Ultra Path Interconnect (Intel UPI) at up to 16 GT/s, increasing multi socket bandwidth
  • More, faster I/O with PCI Express 5 and up to 80 lanes (per socket)
  • Enhanced Memory Performance with DDR5 support and memory speed up to 4800 MT/s in one DIMM per channel (1DPC) and 4400 MT/s in two DIMM per channel (2DPC)
  • New built-in accelerators for data analytics, networking, storage, crypto, and data compression
Image of the Dell 4th Gen Intel Xeon Processor
Cooling Options

The Dell PowerEdge R660 supports Liquid Cooling and Air Cooling options.

Heatsink & Fans

The Dell PowerEdge R660 supports either four sets of Standard cooling fans or four sets of High-Performance Gold cooling fans, with the choice determined by processor TDP.

Installing rear drives in the 10SFF chassis requires Gold fans.

A processor exceeding 185W TDP requires the Direct Liquid Cooling module to be installed.

Refer to the R660 installation manual for further cooling details.

Air Shroud

Several cooling shrouds apply to specific configurations on this system — a CPU shroud is required for all air-cooled builds, and a PCH shroud is needed when no riser is installed.

An air-cooled build with a 2x 2.5" rear-drive configuration requires the rear drive shroud.

Installing an A2 GPU requires a blank on the R1P riser to maintain proper airflow.

Memory Options

32 DDR5 DIMM slots support up to 8TB of RDIMM capacity, with speeds reaching 4800 MT/s (or 5600 MT/s with 5th Gen CPUs) — registered ECC DDR5 DIMMs only.

DIMM type Rank Capacity DIMM rated voltage and speed Operating Speed
1 DIMM per channel (DPC) 2 DIMMs per channel (DPC)
RDIMM 1 R 16 GB DDR5 (1.1 V), 4800 MT/s 4800 MT/s 4400 MT/s
2 R 32 GB, 64 GB DDR5 (1.1 V), 4800 MT/s 4800 MT/s 4400 MT/s
4 R 128 GB DDR5 (1.1 V), 4800 MT/s 4800 MT/s 4400 MT/s
8 R 256 GB DDR5 (1.1 V), 4800 MT/s 4800 MT/s 4400 MT/s

NOTE: Permanently removing a memory module on a processor with TDP ≥250W requires installing a memory module blank, following a process similar to standard DIMM installation.

Networking OCP 3.0

The Dell PowerEdge R660 supports up to two NIC ports via the embedded LOM card and up to four ports through the OCP card, with the option to install either card independently or both together.

Image of the OCP port on the Dell R660 Rack Server
PCIe Riser Configuration Options

A no-riser configuration is available on the PowerEdge R660; in this setup, the PCH air shroud must be installed to maintain correct airflow.

  • Slot 1
    • 1 x16 Gen5 Full height
    • 1 x8 Gen 5 Low profile
    • 1 x16 Gen 5 Low profile
    • 1 x16 Gen 4 Low profile
  • Slot 2
    • 1 x16 Gen5 Full height
    • 1 x16 Gen 5 Low profile
    • 1 x16 Gen 4 Low profile
  • Slot 3
    • 1 x8 Gen 5 Low profile
    • 1 x16 Gen 5 Low profile
    • 1 x16 Gen 4 Low profile
PCIe Riser Configuration No. Riser configuration No. of Processors PERC type supported Rear Storage Possible
Config 0. No RSR 2 Front PERC No
Config 1. 3 x LP (Gen4) R2A+R3A 2 Front PERC / PERC Adapter No
Config 2. 3 x LP (2x LP Gen5 + 1x LP Gen4) R2P+R3P 2 Front PERC No
Config 3. 2 x 16 FH (Gen5) R1P+R4P 2 Front PERC / PERC Adapter No
Config 4. 3 x LP (2x LP Gen5 + 1x LP Gen4) R2R+R3R 1 N/A No
Config 5. 3 x LP (2x LP Gen4 + 1x LP SANPI Gen5) R2A+R3Q 2 Front PERC / PERC Adapter No
Config 6. 1 R2Q (non A2) 2 Front PERC No
Config 6. 2 x LP (Gen5) R2Q (only for A2) 2 Front PERC No
Config 7. 1 x16 LP (Gen5) R3P 2 Front PERC No
Config 8. 1 x LP (Gen4) R2A 1 Front PERC / PERC Adapter No
Config 9. 2 x 16 LP (Gen5) R2S + R3S
 2 N/A No
GPU

The server's 3 rear PCIe slots can each be filled with a single-wide 75W GPU. Installing an A2 GPU calls for a dedicated air shroud, along with an A2 blank on the R1P riser when using a full-height riser configuration — note that only risers labeled with a "P" support GPU installation.

Image of the GPU on the Dell R660 Rack Server
Storage Controllers - Front PERC

Dell's fPERC solution stands out in the RAID controller lineup by delivering a base RAID hardware controller that doesn't consume a PCIe slot, thanks to its compact form factor and high-density connector to the base planar.

The 16G PERC controller lineup builds substantially on the 15G family, carrying forward the Value and Value Performance tiers. New to 16G is the Avenger-based Premium Performance tier, a high-end option designed to boost IOPS and enhance SSD performance.

Supported storage controller cards
Internal Controllers
  • PERC H965i Premium Performance
  • PERC H755 Value Performance
  • PERC H755N Value Performance
  • PERC H355 Value
External Controllers
  • HBA355e Value
Internal Boot
  • Boot Optimized Storage Subsystem (BOSS N1):
    HWRAID 2 x M.2 NVMe SSDs
  • USB
Software RAID
  • S160 Entry
SAS Host Bus Adapters (HBA)
  • HBA355i Value
Boot Options

The BOSS-N1 offers 2x hot-swappable M.2 NVMe SSDs with hardware RAID, supporting single-drive RAID 0 or dual-drive RAID 1.

The BOSS card isn't supported under all thermal conditions; when it's not installed, a BOSS blank must take its place.

Image of the BOSS-N1 Modules in the rear of the R660 Rack Server
Power, Dimensions, & Weight
Power

Two hot swap with full redundant AC or DC power supply units.

  • 1800W Titanium 200—240 VAC or 240 HVDC
  • 1400W Platinum 100—240 VAC or 240 HVDC
  • 1100W Titanium 100—240 VAC or 240 HVDC
  • 1100W LVDC -48 — -60 VDC
  • 800W Platinum 100—240 VAC or 240 HVDC
  • 700 W Titanium 200—240 VAC or 240 HVDC
Dimensions
  • Width 482 mm (18.97")
  • Height 42.8 mm (1.68")
  • Length
    • 822.88 mm (32.39") w/ bezel
    • 809.04 mm (31.85") w/o bezel
  • Weight
    • w/ drives 22.51 kg (49.62 lbs)
    • w/o drives 18.5 kg (40.78 lbs)

Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Liquid Cooling

Bezel

Memory 4800MHz 4th Gen

Memory 5600MHz 5th Gen

Storage Devices

HDD 2.5" Drives

SSD 2.5" Drives

SSD 2.5" NVMe Drives

EDSFF E3.S NVMe Gen 5

Riser Card

OCP Networking NIC

GPU

Trusted Platform Module 2.0

Rail Kit

iDRAC9 Remote Management

Power Cooling

ECS Warranty

The request has been sent.
Thank you.

Price as Configured:
$0

Error Submitting Cart. Please get in touch with us for support.

Please select all the mandatory items in the configuration list before submitting the cart.

One or more items in your cart has no price. This will be submitted as a "Request for a Quote".

Base Standard Capabilities

FeatureTechnical Specifications
ProcessorUp to two 4th Generation Intel Xeon Scalable processors, with up to 56 cores and optional Intel® QuickAssist Technology.
Memory
  • 32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 4800 MT/s
  • Supports registered ECC DDR5 DIMMs only
Storage controllers
  • Internal Controllers (RAID): PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i
  • Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD drives, or USB
  • External HBAs (non-RAID): HBA355e
  • Software RAID: S160
Drive BaysFront bays:
  • Up to 10 x 2.5-inch, SAS/SATA/NVMe (HDD/SSD) max 153.6 TB
  • Up to 8 x 2.5-inch, SAS/SATA/NVMe, (HDD/SSD) max 122.88 TB
Rear bays:
  • Up to 2 x 2.5-inch, SAS/SATA/NVMe, max 30.72 TB
Power Supplies
  • 1800W Titanium 200—240 VAC or 240 HVDC, hot swap with full redundant
  • 1400W Platinum 100—240 VAC or 240 HVDC, hot swap with full redundant
  • 1100W Titanium 100—240 VAC or 240 HVDC, hot swap with full redundant
  • 1100W LVDC -48 — -60 VDC, hot swap with full redundancy
  • 800W Platinum 100—240 VAC or 240 HVDC, hot swap with full redundant
  • 700 W Titanium 200—240 VAC or 240 HVDC, hot swap with full redundant
Cooling Options
  • Air cooling
  • Optional Direct Liquid Cooling (DLC)
Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
Fans
  • Standard (STD) fans/High performance Gold (VHP) fans
  • Up to 4 sets (dual fan module) hot plug fans
Dimensions
  • Height – 42.8 mm (1.68 inches)
  • Width – 482 mm (18.97 inches)
  • Depth – 822.88 mm (32.39 inches) with bezel
  • -809.04 mm (31.85 inches) without bezel
Form Factor1 U rack server
Embedded Management
  • iDRAC9
  • iDRAC Direct
  • iDRAC RESTful API with Redfish
  • iDRAC Service Module
  • Quick Sync 2 wireless module
BezelOptional LCD bezel or security bezell
OpenManage Software
  • OpenManage Enterprise
  • OpenManage Power Manager plugin
  • OpenManage Service plugin
  • OpenManage Update Manager plugin
  • CloudIQ for PowerEdge plug in
  • OpenManage Enterprise Integration for VMware vCenter
  • OpenManage Integration for Microsoft System Center
  • OpenManage Integration with Windows Admin Center
MobilityOpenManage Mobile
OpenManage Integrations
  • BMC Truesight
  • Microsoft System Center
  • OpenManage Integration with ServiceNow
  • Red Hat Ansible Modules
  • Terraform Providers
  • VMware vCenter and vRealize Operations Manager
Security
  • Cryptographically signed firmware
  • Data at Rest Encryption (SEDs with local or external key mgmt)
  • Secure Boot
  • Secure Erase
  • Secured Component Verification (Hardware integrity check)
  • Silicon Root of Trust
  • System Lockdown (requires iDRAC9 Enterprise or Datacenter)
  • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
Embedded NIC2 x 1 GbE LOM card (optional)
Network options1 x OCP card 3.0 (optional)
Note: The system allows either LOM card or an OCP card or both to be installed in the system.
GPU OptionsUp to 2* x 75 W SW
PortsFront Ports
  • 1 x iDRAC Direct (Micro-AB USB) port
  • 1 x USB 2.0
  • 1 x VGA
Rear Ports
  • 1 x Dedicated iDRAC Ethernet port
  • 1 x USB 2.0
  • 1 x USB 3.0
  • 1 x Serial (optional)
  • 1 x VGA (optional for Direct Liquid Cooling configuration)
Internal Ports
  • 1 x USB 3.0 (optional)
PCIeUp to three PCIe slots :
  • Slot 1 : 1 x16 Gen5 Full height, 3/4 length, Half length or 1 x8/ 1 x16 Gen 5 or 1 x16 Gen 4 Low profile, Half length
  • Slot 2 : 1 x16 Gen5 Full height, 3/4 length, Half length or 1 x16 Gen 5 or 1 x16 Gen 4 Low profile, Half length
  • Slot 3 : 1 x8/ 1 x16 Gen 5 or 1 x16 Gen 4 Low profile, Half length
Operating System and Hypervisors
  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi

Spec Sheet 4

Rack Server R760 R660 R7625 R6625 R7615 R6615
Key attributes Provides performance and versatility for demanding applications Provides performance and versatility for demanding applications Breakthrough performance Breakthrough performance Powerful performance and scalability Peak performance and excellent TCO
Target workloads Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization Software-Defined Storage (SDS), Virtualization, Data Analytics Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV)
Type of processor 2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor 2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor 1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores
Memory (DDR5 DIMM slots & max) 32 (8 TB) 24 (1.5 TB*) 12 (768 GB*)
Disk drives up to: 12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5” (rear)		 8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)		 8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)		 4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear) 		8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)		 4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
NVMe drives up to: 24 10 24 10 24 10
Gen5 PCIe slots up to: 4 2 4 2 4 2
Gen4 PCIe slots up to: 8 3 8 3 4 3
Accelerator support up to: 2 x 350 W DW or 6 x 75 W SW 2** x 75 W SW 2 x 300 W DW or 6 x 75 W SW 3 x 75 W SW 3 x 300 W DW or 6 x 75 W SW 3 x 75 W SW
Rack height (U) 2 1 2 1 2 1
Integrated security TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks. TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV)
* Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615.
** Future releases will include additional GPU slots in R660.

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