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SKU: DPE-R760-0BAY

Dell PowerEdge R760 Rack Server Chassis (Diskless)

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Quick Specs

Form Factor:

2U rack server

Processor Max: 56 Cores

2x Gen 4 Intel Xeon Scalable

Memory Max: 8TB

32 ECC DDR5 RDIMM 4800Mhz

Storage Max: 240TB

Front bays:
Up to 12 x 3.5-inch SAS/SATA (HDD/SSD)
Rear bays:
Up to 2 x 2.5" SAS/SATA/NVMe (HDD/SSD) Max 30.72 TB
Up to 4 x 2.5" SAS/SATA/NVMe (HDD/SSD) Max 61.44 TB

Boot Options

Boot Optimized Server Storage (BOSS-N1) Hot-Swap
Internal USB

RAID Controller: (fPERC)

S160 (SATA/NVMe SW RAID)
H355i, H755, H755N, H965i, HBA355i, H355e, HBA355e, H965e

LOM/MIC

2 x 1GE LOM / 25 or 100 GbE x 2 (DPU Must be Installed)

Networking Options

OCP 3.0 x8 Mezz 3.0

Remote Management:

iDRAC9 with Lifecycle Controller

PCIe Slots:

Up to 8 x PCIe Gen5 or Gen 4 slots

SNAP Support Slot 7 SNAPI: 1 x16 Gen5 FH, HL

GPU:

Up to 2 x 350 W DW
6 x 75 W SW
12 x 3.5-inch and rear drive configuration systems do not support a GPU card.


Ideal for:

  • Artificial Intelligence (AI)
  • Data Analytics
  • Database
  • Machine Learning (ML)
  • Virtual Desktop Interface (VDI)

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Base Standard Capabilities

FeaturesTechnical Specifications
ProcessorUp to two 4th Generation Intel Xeon Scalable processor with up to 56 cores per processor and with optional Intel® QuickAssist Technology
Memory
  • 32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 4800 MT/s
  • Supports registered ECC DDR5 DIMMs only
Storage controllers
  • Internal Controllers: PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i
  • Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB
  • External HBA (non-RAID): HBA355e
  • Software RAID: S160
Drive BaysFront bays:
  • Up to 12 x 3.5-inch SAS/SATA (HDD/SSD) max 240 TB
  • Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 122.88 TB
  • Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 245.76 TB
  • Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 368.64 TB
Rear bays:
  • Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 30.72 TB
  • Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 61.44 TB
Power Supplies
  • 2800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
  • 2400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant
  • 1800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
  • 1400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant
  • 1100 W Titanium 100—240 VAC or 240 HVDC, hot swap redundant
  • 1100 W LVDC -48 — -60 VDC, hot swap redundant
  • 800 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant
  • 700 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
Cooling Options
  • Air cooling
  • Optional Direct Liquid Cooling (DLC)
Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
Fans
  • Standard (STD) fans/High performance Silver (HPR) fans/ High performance Gold (VHP) fans
  • Up to 6 hot plug fans
Dimensions
  • Height – 86.8 mm (3.41 inches)
  • Width – 482 mm (18.97 inches)
  • Depth – 772.13 mm (30.39 inches) with bezel
    758.29 mm (29.85 inches) without bezel
Form Factor2U rack server
Embedded Management
  • iDRAC9
  • iDRAC Direct
  • iDRAC RESTful API with Redfish
  • iDRAC Service Module
  • Quick Sync 2 wireless module
BezelOptional LCD bezel or security bezel
OpenManage Software
  • CloudIQ for PowerEdge plug in
  • OpenManage Enterprise
  • OpenManage Enterprise Integration for VMware vCenter
  • OpenManage Integration for Microsoft System Center
  • OpenManage Integration with Windows Admin Center
  • OpenManage Power Manager plugin
  • OpenManage Service plugin
  • OpenManage Update Manager plugin
MobilityOpenManage Mobile
OpenManage Integrations
  • BMC Truesight
  • Microsoft System Center
  • OpenManage Integration with ServiceNow
  • Red Hat Ansible Modules
  • Terraform Providers
  • VMware vCenter and vRealize Operations Manager
Security
  • Cryptographically signed firmware
  • Data at Rest Encryption (SEDs with local or external key mgmt)
  • Secure Boot
  • Secure Erase
  • Secured Component Verification (Hardware integrity check)
  • Silicon Root of Trust
  • System Lockdown (requires iDRAC9 Enterprise or Datacenter)
  • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
Embedded NIC2 x 1 GbE LOM card (optional)
Network options1 x OCP card 3.0 (optional)
Note: The system allows either LOM card or an OCP card or both to be installed in the system.
GPU OptionsUp to 2 x 350 W DW and 6 x 75 W SW
PortsFront Ports
  • 1 x iDRAC Direct (Micro-AB USB) port
  • 1 x USB 2.0
  • 1 x VGA
Rear Ports
  • 1 x Dedicated iDRAC Ethernet port
  • 1 x USB 2.0
  • 1 x USB 3.0
  • 1 x VGA
  • 1 x Serial (optional)
  • 1 x VGA (optional for Direct Liquid Cooling configuration)
Internal Ports
  • 1 x USB 3.0 (optional)
PCIeUp to eight PCIe slots:
  • Slot 1: 1 x8 Gen5 or 1 x8/1 x16 Gen4 Full height, Half length or 1 x16 Gen4 Full height, Full length
  • Slot 2: 1 x8/1 x16 Gen5 or 1 x8 Gen4 Full height, Half length or 1 x16 Gen5 Full height, Full length
  • Slot 3: 1 x16 Gen4 Low profile, Half length
  • Slot 4: 1 x8 Gen4 Full height, Half length
  • Slot 5: 1 x8/1 x16 Gen4 Full height, Half length or 1 x16 Gen4 Full height, Full length
  • Slot 6: 1 x16 Gen4 Low profile, Half length
  • Slot 7: 1 x8/1 x16 Gen5 or 1 x8 Gen4 Full height, Half length
  • Slot 7 SNAPI: 1 x16 Gen5 Full height, Half length
  • Slot 8: 1 x8 Gen5 or 1 x8 Gen4 Full height, Half length
Operating System and Hypervisors
  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
*Future releases will include additional capacity/form factor.

Spec Sheet 4

Rack Server R760 R660 R7625 R6625 R7615 R6615
Key attributes Provides performance and versatility for demanding applications Provides performance and versatility for demanding applications Breakthrough performance Breakthrough performance Powerful performance and scalability Peak performance and excellent TCO
Target workloads Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization Software-Defined Storage (SDS), Virtualization, Data Analytics Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV)
Type of processor 2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor 2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor 1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores
Memory (DDR5 DIMM slots & max) 32 (8 TB) 24 (1.5 TB*) 12 (768 GB*)
Disk drives up to: 12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5” (rear)
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)
4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)
4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
NVMe drives up to: 24 10 24 10 24 10
Gen5 PCIe slots up to: 4 2 4 2 4 2
Gen4 PCIe slots up to: 8 3 8 3 4 3
Accelerator support up to: 2 x 350 W DW or 6 x 75 W SW 2** x 75 W SW 2 x 300 W DW or 6 x 75 W SW 3 x 75 W SW 3 x 300 W DW or 6 x 75 W SW 3 x 75 W SW
Rack height (U) 2 1 2 1 2 1
Integrated security TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks. TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV)
* Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615.
** Future releases will include additional GPU slots in R660.


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