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Home / Dell PowerEdge R-Series Rack Servers / Dell PowerEdge R760 Rack Server (12x 3.5") | Configurable

Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Bezel

Heat sinks / Fans / Cooling Modules

Memory 4800MHz

Memory 5600MHz

Storage Devices

Drive cage and backplane

LFF SAS Drives

LFF SATA Drives

SFF SAS Drives

SFF SATA Drives

NVMe / EDSFF Drives

Riser Card

Networking PCI

OCP Networking NIC

Rail Kit

TPM

iDRAC 9

Power Supply Unit (PSU)

ECS Warranty

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Dell PowerEdge R760 Rack Server (12x 3.5") | Configurable

Dell

| CTO Servers

 

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Select Chassis

Select Processor

Supports up to 2 Processors.
Depending on the TDP and the configuration you desire. The Heatsinks below will change.
Please read up on the different cooling systems below.

4th Gen Intel Scalable Processors

Supports up to 2 Processors.

5th Gen Intel Scalable Processors

Supports up to 2 Processors.

Bezel (Optional)

Heat sinks / Fans / Cooling Modules (Optional)

For most configurations of the 12 LFF Rack Server will require the 2U HPR HSK.
If you install a CPU with a TDP over 270w. The DLC will need to be installed.
DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
Up to six hot swap fans
To know more about the requirements and limitations for the cooling of the system. Please read the manual below.

Memory 4800MHz (Optional)

DDR4 memory are not supported in the R760.
32x DDR5 DIMM slots on a 2 Socket configuration, supports RDIMM 8 TB max

Memory 5600MHz (Optional)

DDR4 memory are not supported in the R760.
32x DDR5 DIMM slots on a 2 Socket configuration

Storage Devices (Optional)

System comes with the Gen16 Software RAID S160.
You can install both fPERC and APERC. View the cabling diagram for a guide.

Drive cage and backplane (Optional)

These Rear Drive cages come with extra fans and air baffles.
The rear drive cages are SFF and can support NVMe drives as well.

LFF SAS Drives (Optional)

Supports up to 12 Drives

LFF SATA Drives (Optional)

Supports up to 12 Drives

SFF SAS Drives (Optional)

Support for 2 or 4 SFF Drives. Depending on the Rear Drive cage installed.

SFF SATA Drives (Optional)

Support for 2 or 4 SFF Drives. Depending on the Rear Drive cage installed.

NVMe / EDSFF Drives (Optional)

Support for 2 or 4 SFF Drives. Depending on the Rear Drive cage installed.
The "DC" Data Center, "RI" Read Intensive
EDSFF Drives are supported as well in the rear drives.

Riser Card (Optional)

Each configuration comes with all the risers in the kit.
Please click on "view item" or see the manual below for all the details about the riser configurations.
x16 Adapters installed in an x8 PCIe slot will see downgrading. Please keep this in mind when selecting the riser configuration.

Networking PCI (Optional)

The LOM section of the R760 is limited to only two ports.
If you install a DPU then the LOM will be replaced with a MIC card.

OCP Networking NIC (Optional)

LOM and OCP can be installed together.
MIC Cards get installed in the same slot as the LOM.

Rail Kit (Optional)

TPM (Optional)

iDRAC 9 (Optional)

Deafult iDRAC9 Express

Power Supply Unit (PSU)

Supports up to 2 PSU
Mixing of PSU is not supported.

ECS Warranty

Helpful Tip: Once desired configuration is selected click "Add to Cart".
From the cart page you can submit a submit a quote request for best pricing

Quick Specs

Form Factor:

2U rack server

Processor | Max: 56 Cores

2x Gen 4 / 5th Gen Intel Xeon Scalable

Memory | Max: 8TB

32 ECC DDR5 RDIMM 4800Mhz

Storage | Max: 240TB

Front bays:
Up to 12 x 3.5-inch SAS/SATA (HDD/SSD)
Rear bays:
Up to 2 x 2.5" SAS/SATA/NVMe (HDD/SSD) Max 30.72 TB
Up to 4 x 2.5" SAS/SATA/NVMe (HDD/SSD) Max 61.44 TB
Up to 4x EDSFF E3.S Max N/A

Boot Options

Boot Optimized Server Storage (BOSS-N1) Hot-Swap
Internal USB

RAID Controller: (fPERC)

S160 (SATA/NVMe SW RAID)
H355i, H755, H755N, H965i, HBA355i, H355e, HBA355e, H965e

Networking Options LOM/MIC

2 x 1GE LOM
MIC - 25 GbE or 100 GbE (DPU Must be Installed)

Networking Options OCP 3.0

OCP 3.0 x8 Mezz 3.0

Remote Management:

iDRAC9 with Lifecycle Controller

PCIe Slots:

Up to 8 x PCIe Gen5 or Gen 4 slots

SNAP Support | Slot 7 SNAPI: 1 x16 Gen5 FH, HL

GPU:

Not Supported
12x 3.5" and rear drive configuration systems do not support a GPU card.

Other Versions

(Click to View)

Ideal for:

  • Artificial Intelligence (AI)
  • Data Analytics
  • Database
  • Machine Learning (ML)
  • Virtual Desktop Interface (VDI)

Rack space stays efficient with the 2U dual-socket Dell PowerEdge R760, a full-featured enterprise server tuned for demanding workloads such as AI and machine learning. It's built to be cyber-resilient and mainstream-ready, delivering solid performance for everyday data center demands.

Dell PowerEdge R760 Drive Options
12 LFF Configuration Options
  • 12 x 3.5" (SAS/SATA)
  • 12 x 3.5" (SAS/SATA) w/ rear 2 x 2.5" (SAS/SATA)
  • 12 x 3.5" (SAS/SATA) w/ rear 2 x 2.5" NVMe Direct
  • 12 x 3.5" (SAS/SATA) w/ rear 4 x 2.5" (SAS/SATA)
  • 12 x 3.5" (SAS/SATA) w/ rear 4 x 2.5" (NVMe Direct)
The Universal Backplane supports HW RAID for SAS/SATA with direct attach NVMe, and does not support HW RAID for NVMe.
Looking for more drive?

There are so many options we had to split them up to make it easier to understand the scale the R760 can perform.

Dell R760 12x 3.5 SAS/SATA Backplane 12x 3.5" SAS/SATA
Dell R760 8x 2.5 SAS/SATA/NVMe Backplane 8x 2.5" SAS/SATA/NVMe
Dell R760 8x 2.5 NVMe Backplane 8x 2.5" NVMe
Dell R760 8x 2.5 EDSFF E3.S Backplane 8x 2.5" EDSFF E3.S
Dell R760 24x 2.5 Universal Backplane 24x 2.5" SAS/SATA/NVMe
Dell R760 24x 2.5 NVMe Passive Backplane 24x 2.5" NVMe Passive
Dell R760 24x 2.5 NVMe Switched Backplane 24x 2.5" NVMe Switched
Processor, Heatsink & Fans
Processors & Heatsink

Up to 2 x 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors with up to 56 cores

Heat sink choice on the Dell PowerEdge R760 comes down to three variants, matched to system configuration and CPU TDP, with any processor above 250W TDP requiring liquid cooling instead.

  • STD HSK - N/A ≤ 165 W (supports only 2.5-inch drives and non-GPU configuration)
  • 2U HPR HSK - RNTKY 165 W–350 W (supports 2.5-inch drives and non-GPU configuration)
  • L-type HSK - J8C66 Supports all GPU/FPGA configurations
Liquid Cooling

Any Processors TPD above 250W will need the liquid-cooled system installed.
CPUs 9480, 9470, 8470Q and 6458Q are supported only in liquid cooling configuration.

Two cooling paths exist for this Dell Gen16 server — air-cooled or Direct Liquid Cooled — with DLC on the CPUs removing the rear VGA port. Replacement is possible at the front or rear, though the rear option comes at the cost of a PCIe slot.

Fans

All GPU/FGPA cards require 1U L-type HSK and GPU shroud.
GPU configuration supports only High performance Gold (HPR Gold) fan.

Every system ships with 6 hot-swap fans as a baseline, with type selection tied to CPU TDP and configuration in the same way heat sinks are chosen. Fan options are listed below.

Up to six hot-swap fans
  • Standard (STD) fans
  • High-performance Silver (HPR Silver) fans
  • High-performance Gold (HPR Gold) fans - 2X4XN
  • For TDP that are 250W+ requires DLC
Rear Drive Fans

The High-Performance Gold fan becomes necessary when adding a rear drive to the Dell PowerEdge R760, unless the CPU already operates at 270W TDP or higher.

Each rear drive cage arrives with a supplemental fan and airflow baffle for cooling purposes — both automatically included with rear drive orders.

Rear drives supported on the 12 LFF and the 24 SFF Chassis.

Supported Memory

In-memory workload performance scales with up to 32 DDR5 RDIMMs at 4400 MT/s (2DPC), or up to 4800 MT/s when scaled back to 16 DDR5 RDIMMs (1DPC).

DIMM Type DIMM Rank DIMM Capacity Single Processor Dual Processor
Minimum system capacity Maximum system capacity Minimum system capacity Maximum system capacity
DDR5 RDIMM Single Rank 16 GB 16 GB 256 GB 32 GB 512 GB
Dual Rank 32 GB 32 GB 512 GB 64 GB 1 TB
Dual Rank 64 GB 64 GB 1 TB 128 GB 2 TB
Quad Rank 128 GB 128 GB 2 TB 256 GB 4 TB
Octa Rank 256 GB 256 GB 4 TB 512 GB 8 TB
Storage Controllers Options
Storage Controllers

Dell's RAID controller lineup features the fPERC solution, which delivers a base RAID hardware controller entirely without occupying a PCIe slot, thanks to its compact form factor and high-density connector to the base planar.

PERC11 and PERC12 controllers are both supported here, and dual-controller configurations — combining one fPERC with one APERC card — are also possible. Refer to the manual's cabling section for the full range of supported setups.

Image of the R760 with an fPERC being installed.
Supported storage controller cards
Internal controllers PERC H965i
PERC H755
PERC H755N
PERC H355
External controllers HBA355e
PERC H965e
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD
USB
Software RAID S160
SAS Host Bus Adapters (HBA) HBA355i
NOTE: PowerEdge does not support Tri-Mode, the mixing of SAS, SATA, and NVMe behind the same controller.
NOTE: The Universal Backplane supports HW RAID for SAS/SATA with direct attach NVMe, and does not support HW RAID for NVMe.
BOSS-N1 Hot-Swap Boot Options

Boot capability arrives via 2x M.2 NVMe drives on the optional BOSS-N1 card, consistent with most Dell servers, though its physical position depends on the risers or rear drives configured.

No power-down is needed to install the BOSS-N1 card carrier — a shutdown only applies when installing the BOSS-N1 controller card module.

The BOSS-N1 Boot option for Dells R760 Rack Server
Components in kit R760 (quantity)
BOSS-N1 controller card module 1
BOSS-N1 card carrier 1 or 2*
M.2 NVMe SSD 1 or 2*
M.2 NVMe SSD capacity label 1 or 2†
BOSS-N1 card carrier blank 1
M3 x 0.5 x 4.5 mm screws 1
BOSS-N1 power cable for Riser 1 (220 mm) 1
BOSS-N1 signal cable for Riser 1 (170 mm) 1
BOSS-N1 power cable for x4 rear drive module (260 mm) 1
BOSS-N1 signal cable for x4 rear drive module (240 mm) 1
Networking Adapters Options

NIC options on this Dell Gen16 R760 rack server boil down to the LOM card or the MIC card, with only one installable at a time — separately, the OCP 3.0 slot can still be populated no matter which of the two is chosen.

Image of the R760 System board LOM, MIC, and OCP Slots
LAN on Motherboard (LOM)
  • 1 GbE x 2

The Dell PowerEdge R760's standard LOM is an optional add-on, supporting 2x 1Gb ports through a BCM5720 LAN controller.

Management Interface card (MIC)
  • 25 GbE x 2
  • 100 GbE x 2

A Dell Data Processing Unit (DPU) card can't go in without the MIC also being installed, and because the MIC claims the LOM ports for itself, no separate LOM card can be added.

Open Compute Project (OCP) 3.0
  • 1GbE x 4
  • 10 GbE x 2
  • 10 GbE x 4
  • 25 GbE x 2
  • 25 GbE x 4

One limitation worth knowing: an x16 card in the OCP 3.0 slot gets stepped down to x8 because of this board's constraints. Port capacity also sets the two apart — LOM tops out at two ports, OCP 3.0 handles cards with up to 4.

Expansion Slots

Up to 8x PCIe Gen4 or 4x PCIe Gen5 slots are available across 4 riser slots, with 15 riser cards enabling 14 configuration variations. Take your time working through the options in the table below, and get in touch for support whenever the riser setup needs clarification.

Config No. Riser configuration No. of Processors PERC type supported Rear storage possible
0 NO RSR 2 Front PERC No
1 R1B+R2A+R3B+R4B 2 Front PERC/PERC Adapter No
2 R1Q+R2A+R3B+R4Q 2 Front PERC/PERC Adapter No
3-1 R1P+R2A+R3B+R4P (HL) 2 Front PERC/PERC Adapter No
3-2 R1P+R2A+R3B+R4P (FL) 2 Front PERC/PERC Adapter No
4-1 R1P+R2A+R3B+R4R (HL) 2 Front PERC/PERC Adapter No
5-1 R1R+R2A+R3A+R4P (HL) 2 Front PERC/PERC Adapter No
5-2 R1R+R2A+R3A+R4P (FL) 2 Front PERC/PERC Adapter No
6 R2A+R4Q 2 Front PERC/PERC Adapter Yes
7 R1Q+R2A+R4Q 2 Front PERC/PERC Adapter Yes
8 R1B+R2A 1 PERC Adapter No
9 R1Q+R2A+R4R 1 Front PERC No
10-1 R1P+R2A+R4R (HL) 1 Front PERC No
10-2 R1P+R2A+R4R (FL) 1 Front PERC No
11 R1 Paddle + R2A + R3B + R4 Paddle 2 N/A No
12 R1Q+R2A+R4Q 2 Front PERC/PERC Adapter Yes

Riser Cards

Dell PowerEdge R760 Riser 1B Riser 1B 2x16 (R1B)
Dell PowerEdge R760 Riser 1R 2x16 (R1R) Riser 1R 2x16 (R1R)
Dell PowerEdge R760 Riser 1R-FL 2x16 (R1R-FL) Riser 1R-FL 2x16 (R1R-FL)
Dell PowerEdge R760 Riser 1P 1x16 (R1P) Riser 1P 1x16 (R1P)
Dell PowerEdge R760 Riser 1P-FL 1x16 (R1P-FL) Riser 1P-FL 1x16 (R1P-FL)
Dell PowerEdge R760 Riser 1Q 2x16 (R1Q) Riser 1Q 2x16 (R1Q)
Dell PowerEdge R760 Riser 2A 2x16 (R2A) Riser 2A 2x16 (R2A)
Dell PowerEdge R760 Riser 3A 1x16 (R3A) Riser 3A 1x16 (R3A)
Dell PowerEdge R760 Riser 3A-FL 1x16 (R3A-FL) Riser 3A-FL 1x16 (R3A-FL)
Dell PowerEdge R760 Riser 3B 2x8 (R3B) Riser 3B 2x8 (R3B)
Dell PowerEdge R760 Riser 4P 1x16 (R4P) Riser 4P 1x16 (R4P)
Dell PowerEdge R760 Riser 4P-FL 1x16 (R4P-FL) Riser 4P-FL 1x16 (R4P-FL)
Dell PowerEdge R760 Riser 4B 2x16 (R4B) Riser 4B 2x16 (R4B)
Dell PowerEdge R760 Riser 4Q 2x16 (R4Q) Riser 4Q 2x16 (R4Q)
Dell PowerEdge R760 Riser 4R 2x16 (R4R SNAPI) Riser 4R 2x16 (R4R SNAPI)
Dell PowerEdge R760 Paddle Card Kit Paddle Card Kit
GPU Options

Up to two double-wide 350W or six single-wide 75W accelerators can be installed, requiring a swap from the default air shroud to the GPU-specific version. A filler piece rounds out the setup whenever a single-width GPU card or an open riser slot is involved.
All GPU/FGPA cards require 1U L-type HSK and GPU shroud.

  • Double Width (DW) GPU only supported on Riser Configurations 3-2, 5-2, or 10-2
  • RC 5-2: Supports DW GPU only on slot 7
  • RC 10-2: Only supports a single processor configuration.
  • RC 10-2: Supports DW GPU only on slot 2.
Components GPU FL Kit
Details Quantity
Risers Riser configuration (RC) 3-2, 5-2*, or, 10-2* RC 3-2: R1P^ (FL) + R2A (HL) + R3B (HL) + R4P^ (FL)
RC 5-2: R1R (FL) + R2A (HL) + R3A (FL) + R4P^ (FL)
RC 10-2: R1P^ (FL) + R2A (HL) + R4R (FL)
Shroud GPU shroud 1
Fans HPR GOLD fan 6
Heat sinks L-type heat sink for processor 1 and processor 2 RC 3-2, 5-2: 2
RC 10-2: 1
Cables Power cable 2 x 4 (8-position) or 2 x 6 + 1 x 4 (12-position + 4-sideband)
FL - Full Length, HL - Half Length, HPR - High Performance, RC - Riser configuration
12 x 3.5-inch and rear drive configuration systems do not support a GPU card.
Power, Dimensions & Weight:
Power

Two redundant Hot-Swap AC or DC power supply units.

  • 2800 W Titanium 200—240 VAC or 240 HVDC,
  • 2400 W Platinum 100—240 VAC or 240 HVDC,
  • 1800 W Titanium 200—240 VAC or 240 HVDC,
  • 1400 W Platinum 100—240 VAC or 240 HVDC,
  • 1100 W Titanium 100—240 VAC or 240 HVDC,
  • 1100 W LVDC -48 — -60 VDC,
  • 800 W Platinum 100—240 VAC or 240 HVDC,
  • 700 W Titanium 200—240 VAC or 240 HVDC,
Dimensions & Weight:

Width with Ears: 482.0 mm (18.97")
Width without Ears: 434.0 mm (17.08")
Height: 86.8 mm (3.41")
Length: 736.29 mm (28.98") Ear to PSU handle
Weight: A server with fully populated drives 36.1 kg (79.58 lbs)
A server without drives and PSU installed 25.1 kg (55.33 lbs)

Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Bezel

Heat sinks / Fans / Cooling Modules

Memory 4800MHz

Memory 5600MHz

Storage Devices

Drive cage and backplane

LFF SAS Drives

LFF SATA Drives

SFF SAS Drives

SFF SATA Drives

NVMe / EDSFF Drives

Riser Card

Networking PCI

OCP Networking NIC

Rail Kit

TPM

iDRAC 9

Power Supply Unit (PSU)

ECS Warranty

The request has been sent.
Thank you.

Price as Configured:
$0

Error Submitting Cart. Please get in touch with us for support.

Please select all the mandatory items in the configuration list before submitting the cart.

One or more items in your cart has no price. This will be submitted as a "Request for a Quote".

Base Standard Capabilities

FeaturesTechnical Specifications
ProcessorUp to two 4th Generation Intel Xeon Scalable processor with up to 56 cores per processor and with optional Intel® QuickAssist Technology
Memory
  • 32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 4800 MT/s
  • Supports registered ECC DDR5 DIMMs only
Storage controllers
  • Internal Controllers: PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i
  • Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB
  • External HBA (non-RAID): HBA355e
  • Software RAID: S160
Drive BaysFront bays:
  • Up to 12 x 3.5-inch SAS/SATA (HDD/SSD) max 240 TB
  • Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 122.88 TB
  • Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 245.76 TB
  • Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 368.64 TB
Rear bays:
  • Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 30.72 TB
  • Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 61.44 TB
Power Supplies
  • 2800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
  • 2400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant
  • 1800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
  • 1400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant
  • 1100 W Titanium 100—240 VAC or 240 HVDC, hot swap redundant
  • 1100 W LVDC -48 — -60 VDC, hot swap redundant
  • 800 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant
  • 700 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant
Cooling Options
  • Air cooling
  • Optional Direct Liquid Cooling (DLC)
Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
Fans
  • Standard (STD) fans/High performance Silver (HPR) fans/ High performance Gold (VHP) fans
  • Up to 6 hot plug fans
Dimensions
  • Height – 86.8 mm (3.41 inches)
  • Width – 482 mm (18.97 inches)
  • Depth – 772.13 mm (30.39 inches) with bezel
    758.29 mm (29.85 inches) without bezel
Form Factor2U rack server
Embedded Management
  • iDRAC9
  • iDRAC Direct
  • iDRAC RESTful API with Redfish
  • iDRAC Service Module
  • Quick Sync 2 wireless module
BezelOptional LCD bezel or security bezel
OpenManage Software
  • CloudIQ for PowerEdge plug in
  • OpenManage Enterprise
  • OpenManage Enterprise Integration for VMware vCenter
  • OpenManage Integration for Microsoft System Center
  • OpenManage Integration with Windows Admin Center
  • OpenManage Power Manager plugin
  • OpenManage Service plugin
  • OpenManage Update Manager plugin
MobilityOpenManage Mobile
OpenManage Integrations
  • BMC Truesight
  • Microsoft System Center
  • OpenManage Integration with ServiceNow
  • Red Hat Ansible Modules
  • Terraform Providers
  • VMware vCenter and vRealize Operations Manager
Security
  • Cryptographically signed firmware
  • Data at Rest Encryption (SEDs with local or external key mgmt)
  • Secure Boot
  • Secure Erase
  • Secured Component Verification (Hardware integrity check)
  • Silicon Root of Trust
  • System Lockdown (requires iDRAC9 Enterprise or Datacenter)
  • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
Embedded NIC2 x 1 GbE LOM card (optional)
Network options1 x OCP card 3.0 (optional)
Note: The system allows either LOM card or an OCP card or both to be installed in the system.
GPU OptionsUp to 2 x 350 W DW and 6 x 75 W SW
PortsFront Ports
  • 1 x iDRAC Direct (Micro-AB USB) port
  • 1 x USB 2.0
  • 1 x VGA
Rear Ports
  • 1 x Dedicated iDRAC Ethernet port
  • 1 x USB 2.0
  • 1 x USB 3.0
  • 1 x VGA
  • 1 x Serial (optional)
  • 1 x VGA (optional for Direct Liquid Cooling configuration)
Internal Ports
  • 1 x USB 3.0 (optional)
PCIeUp to eight PCIe slots:
  • Slot 1: 1 x8 Gen5 or 1 x8/1 x16 Gen4 Full height, Half length or 1 x16 Gen4 Full height, Full length
  • Slot 2: 1 x8/1 x16 Gen5 or 1 x8 Gen4 Full height, Half length or 1 x16 Gen5 Full height, Full length
  • Slot 3: 1 x16 Gen4 Low profile, Half length
  • Slot 4: 1 x8 Gen4 Full height, Half length
  • Slot 5: 1 x8/1 x16 Gen4 Full height, Half length or 1 x16 Gen4 Full height, Full length
  • Slot 6: 1 x16 Gen4 Low profile, Half length
  • Slot 7: 1 x8/1 x16 Gen5 or 1 x8 Gen4 Full height, Half length
  • Slot 7 SNAPI: 1 x16 Gen5 Full height, Half length
  • Slot 8: 1 x8 Gen5 or 1 x8 Gen4 Full height, Half length
Operating System and Hypervisors
  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi
*Future releases will include additional capacity/form factor.

Spec Sheet 4

Rack Server R760 R660 R7625 R6625 R7615 R6615
Key attributes Provides performance and versatility for demanding applications Provides performance and versatility for demanding applications Breakthrough performance Breakthrough performance Powerful performance and scalability Peak performance and excellent TCO
Target workloads Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization Software-Defined Storage (SDS), Virtualization, Data Analytics Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV)
Type of processor 2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor 2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor 1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores
Memory (DDR5 DIMM slots & max) 32 (8 TB) 24 (1.5 TB*) 12 (768 GB*)
Disk drives up to: 12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5” (rear)		 8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)		 8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)		 4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear) 		8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)		 4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
NVMe drives up to: 24 10 24 10 24 10
Gen5 PCIe slots up to: 4 2 4 2 4 2
Gen4 PCIe slots up to: 8 3 8 3 4 3
Accelerator support up to: 2 x 350 W DW or 6 x 75 W SW 2** x 75 W SW 2 x 300 W DW or 6 x 75 W SW 3 x 75 W SW 3 x 300 W DW or 6 x 75 W SW 3 x 75 W SW
Rack height (U) 2 1 2 1 2 1
Integrated security TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks. TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV)
* Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615.
** Future releases will include additional GPU slots in R660.

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