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Base Standard Capabilities
| Feature | Technical Specification | |
|---|---|---|
| Processor | Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor | |
| Memory |
| |
| Storage controllers |
| |
| Drive bays | Front bays:
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| Power supplies |
| |
| Cooling options | Air cooling, optional processor liquid cooling | |
| Fans |
| |
| Dimensions | Height – 86.8 mm (3.41 inches) Width – 482 mm (18.97 inches) Depth – 758.3 mm (29.85 inches) - without bezel 772.14 mm (30.39 inches) - with bezel | |
| Form Factor | 2U rack server | |
| Embedded mgmt |
| |
| Bezel | Optional LCD bezel or security bezel | |
| OpenManage™ Software |
| |
| Mobility | OpenManage Mobile | |
| Integrations and Connections | OpenManage Integrations
| OpenManage Connections
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| Security |
| |
| Embedded NIC | 2 x 1 GbE LOM | |
| Network Options | 1 x OCP 3.0 (x8 PCIe lanes) | |
| GPU Options | Up to two double-width 300 W, Or, Four single-width 150 W, Or, Six single-width 75 W accelerators | |
| Ports | Front Ports:
| Rear Ports
|
| PCIe | Up to 8 x PCIe Gen4 slots (up to 6 x16) with support for SNAP I/O modules | |
| Operating System and Hypervisors |
| |
Spec Sheet 4
| Feature | PowerEdge R750 | PowerEdge R740 |
|---|---|---|
| Processor | 2x 3rd Generation Intel® Xeon® Processor Scalable Family | 2x 2nd Generation Intel® Xeon® Processor Scalable Family |
| CPU Interconnect | Intel Ultra Path Interconnect (UPI) | Intel Ultra Path Interconnect (UPI) |
| Memory | 32 x DDR4 RDIMM, LRDIMM 16 x PMem ( Intel Optane Persistent Memory 200 Series) | 24 x DDR4 RDIMM, LRDIMM 12 x NVDIMM 12 x PMem (Intel Optane Apache Pass) |
| Storage Drives | 3.5 inches, 2.5 inches- 12 Gb SAS, 6 Gb SATA, NVMe | 3.5 inches, 2.5 inches- 12 Gb SAS, 6 Gb SATA, NVMe |
| Storage Controllers | Adapters: HBA355I, HBA355E, H345, H745, H755, H755N, H840 BOSS S1 BOSS S2 SW RAID: S150 | Adapters: HBA330, H330, H730P, H740P, H840, 12G SAS HBA Mini Mono: HBA330, H330, H730P, H740P SW RAID: S140 |
| NVMe | Up to 24 x NVMe drives | Up to 24 x NVMe drives |
| PCIe Slots | Max 8 PCIe 4.0 (up to 6 x16 slots) | Max 8 PCIe 3.0 (up to 4 x16 slots) |
| LOM | 2 x 1 Gb | N/A |
| Networking | OCP 3.0 (x8 PCIe) | rNDC |
| USB Ports | Front: 1 ports (USB 2.0), 1 dedicated (microUSB) Rear: 2 ports (Bottom: USB 3.0, Top: USB 2.0) Internal: 1 port (USB 3.0) for IDSDM/internal USB cards up-sell option | Front: 2 ports (USB 2.0), 1 managed
(micro-USB) Rear: 2 ports (USB 3.0) Internal: 1 port (USB 3.0) Optional Upsell: 1 Front port (USB 3.0) - Not offered on xd |
| Rack Height | 2U | 2U |
| Power Supplies | AC (Platinum): 800 W, 1400 W, 2400 W AC (Titanium): 1100 W AC mixed mode/HLAC (Titanium): 700 W, 1800 W, 2800 W DC (Mixed Mode): 700 W, 800 W, 1100 W, 1400 W, 1800 W, 2400 W, 2800W DC -48V~-60V: 1100 W | AC (Platinum): 495 W, 750 W, 1100 W,
1600 W, 2000 W, 2400 W AC(Titanium): 750 W DC: 1100 W Mix Mode/HVDC: 750 W, 1100 W |
| System Management | LC 3.x, OpenManage, QuickSync2.0, OMPC3, Digital License Key, iDRAC Direct (dedicated micro-USB port), Easy Restore | LC 3.x, OpenManage, QuickSync 2.0, OMPC3, Digital License Key, iDRAC Direct (dedicated micro-USB port), Easy Restore, vFlash |
| Internal GPU | Up to 2 x double width, FH, FL (300 W each) Up to 4 x16 single width, FH, FL (150 W each) or 6x8 PCIe single width FH, FL (75W each) Up to 6 x single width, LP/FH, HL (75 W each) | 3x 300 W (DW) or 6x 75 W (SW) |
| Availability | Hot-plug Drives Hot-plug Redundant Cooling Hot-plug Redundant Power Supplies IDSDM Hot-plug BOSS S2 BOSS S1 | Hot-plug Drives Hot-plug Redundant Cooling Hot-plug Redundant Power Supplies BOSS IDSDM |
