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Base Standard Capabilities
| Feature | Technical Specifications | ||
|---|---|---|---|
| Processors | One AMD EPYC 4th Generation 9004 Series with up to 128 cores | ||
| Memory | • 12 DDR5 DIMM slots, supports RDIMM 3 TB max, speed up to 4800 MT/s • Supports registered ECC DDR5 DIMMs only | ||
| Storage Controllers: | • Internal Controllers (RAID) PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i • Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB • External HBA (non-RAID): HBA355e • Software Raid: S160 | ||
| Drive Bays | Front bays: • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 80 TB • Up to 8 x 2.5-inch NVMe (SSD) max 122.88 TB • Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 153.6 TB • Up to 14 x EDSFF E3.S Gen5 NVMe (SSD) max 107.52 TB • Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) max 122.88 TB Rear bays: • Up to 2 x 2.5-inch SAS/SATA (HDD/SSD) max 30.72 TB • Up to 2 x EDSFF E3.S Gen5 NVMe (SSD) max 15.36 T | ||
| Power Supplies | • 1800 W Titanium 200–240 V AC or 240 HVDC, hot swap redundant • 1400 W Platinum 100–240 V AC or 240 HVDC, hot swap redundant • 1100 W Titanium 100–240 V AC or 240 HVDC, hot swap redundant • 1100 W LVDC -48 – -60 VDC hot swap redundant • 800 W Platinum 100–240 V AC or 240 HVDC, hot swap redundant • 700 W Titanium 200–240 V AC or 240 HVDC, hot swap redundant | ||
| Cooling Options | • Air cooling • Optional Direct Liquid Cooling (DLC) Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate. | ||
| Fans | • Standard (STD) fans/High performance GOLD (VHP) fans • Up to 4 sets (dual fan module) hot plug fans | ||
| Dimensions | • Height – 42.8 mm (1.685 inches) • Width – 482 mm (18.97 inches) • Depth – 822.89 mm (32.39 inches) with bezel -------809.05 mm (31.85 inches) without bezel | ||
| Form Factor | 1U rack server | ||
| Embedded Management | • iDRAC9 • iDRAC Direct • iDRAC RESTful API with Redfish • iDRAC Service Module • Quick Sync 2 wireless module | ||
| Bezel | Optional LCD bezel or security bezel | ||
| OpenManage Software | • OpenManage Enterprise • OpenManage Power Manager plugin • OpenManage Service plugin • OpenManage Update Manager plugin • CloudIQ for PowerEdge plug in • OpenManage Enterprise Integration for VMware vCenter • OpenManage Integration for Microsoft System Center • OpenManage Integration with Windows Admin Center | ||
| Mobility | OpenManage Mobile | ||
| OpenManage Integrations | • BMC Truesight • Microsoft System Center • OpenManage Integration with ServiceNow • Red Hat Ansible Modules • Terraform Providers • VMware vCenter and vRealize Operations Manager | ||
| Security | • AMD Secure Encrypted Virtualization (SEV) • AMD Secure Memory Encryption (SME) • Cryptographically signed firmware • Data at Rest Encryption (SEDs with local or external key mgmt) • Secure Boot • Secured Component Verification (Hardware integrity check) • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ | ||
| Embedded NIC | 2 x 1 GbE LOM card (optional) | ||
| Network Options | 1 x OCP card 3.0 (optional) Note: The system allows either LOM card or an OCP card or both to be installed in the system. | ||
| GPU Options | Up to 2 x 75 W SW | ||
| Ports | Front Ports • 1 x iDRAC Direct (Micro-AB USB) port • 1 x USB 2.0 • 1 x VGA | Rear Ports • 1 x Dedicated iDRAC Ethernet port • 1 x USB 3.0 • 1 x USB 2.0 • 1 x Serial (optional) • 1 x VGA (optional for Direct Liquid Cooling configuration) | |
| Internal Ports • 1 x USB 3.0 (optional) | |||
| PCIe | Up to three PCIe slots: • Slot 1: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length or 1 x8 Gen4 Low profile, Half length • Slot 2: 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length or 1 x8 Gen4 Low profile, Half length • Slot 3: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length | ||
| Operating System and Hypervisors | • Microsoft Windows Server with Hyper-V • Red Hat Enterprise Linux • SUSE Linux Enterprise Server • VMware ESXi | ||
Compare Servers
| Rack Server | R760 | R660 | R7625 | R6625 | R7615 | R6615 |
|---|---|---|---|---|---|---|
| Key attributes | Provides performance and versatility for demanding applications | Provides performance and versatility for demanding applications | Breakthrough performance | Breakthrough performance | Powerful performance and scalability | Peak performance and excellent TCO |
| Target workloads | Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure | High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization | High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization | High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization | Software-Defined Storage (SDS), Virtualization, Data Analytics | Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV) |
| Type of processor | 2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor | 2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor | 1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores | |||
| Memory (DDR5 DIMM slots & max) | 32 (8 TB) | 24 (1.5 TB*) | 12 (768 GB*) | |||
| Disk drives up to: | 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5” (rear) | 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) | 8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear) | 4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) | 8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear) | 4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
| NVMe drives up to: | 24 | 10 | 24 | 10 | 24 | 10 |
| Gen5 PCIe slots up to: | 4 | 2 | 4 | 2 | 4 | 2 |
| Gen4 PCIe slots up to: | 8 | 3 | 8 | 3 | 4 | 3 |
| Accelerator support up to: | 2 x 350 W DW or 6 x 75 W SW | 2** x 75 W SW | 2 x 300 W DW or 6 x 75 W SW | 3 x 75 W SW | 3 x 300 W DW or 6 x 75 W SW | 3 x 75 W SW |
| Rack height (U) | 2 | 1 | 2 | 1 | 2 | 1 |
| Integrated security | TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks. | TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV) | ||||
| * Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615. ** Future releases will include additional GPU slots in R660. | ||||||
