Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Direct Liquid Cooling Modules
Memory
Storage Devices
Drive cage
HDD 3.5" Drives
HDD 2.5" Drives
SSD 2.5" Drives
SSD 2.5" NVMe Drives
SSD 2.5" NVMe EDSFF E3.S Drives
Riser Configurations
OCP NIC
GPU
Bezel
Rail Kit
Trusted Platform Module TPM
iDRAC9 Remote Management
Power Supply Unit (PSU)
ECS Warranty
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Price as Configured:
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Price as Configured:
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Specs
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1U rack server
Processor | Max: 128 Cores1x 4th Gen AMD 9004 Series
Memory | Max: 3TB12 ECC DDR5 RDIMM 4800Mhz
Storage | Max: 153.6TB4 LFF SAS/SATA (HDD/SSD) | Max: 80TB
8, 10 SFF SAS/SATA/NVMe (HDD/SSD) | Max: 153.6TB
14, 16 EDSFF E3.S Gen 5 NVMe (SSD) | Max: 122.88TB
2 SFF SAS/SATA (HDD/SSD) NVMe | Max: 30.72TB
2 EDSFF E3.S Gen5 NVMe (SSD) | Max: 15.36TB
S160 (SW RAID)
H965i, H755, H755N, H355, HBA355i, HBA355e, HBA465e, H965e
BOSS-N1 (hot Swap), USB
Networking Options (NOC):1 x OCP card 3.0 + 2 x 1 GbE LOM card
Note: The system allows either LOM card or an OCP card or both to be installed in the system.
iDRAC9 with Lifecycle Controller
PCIe Slots:2x or 3x PCIe 4.0 & 5.0
GPU:Up to 2 x 75 W SW
- Dell PowerEdge R610
- Dell PowerEdge R620
- Dell PowerEdge R630
- Dell PowerEdge R640
- Dell PowerEdge R6415
- Dell PowerEdge R650
- Dell PowerEdge R650XS
- Dell PowerEdge R6515
- Dell PowerEdge R6525
- Dell PowerEdge R660
- Dell PowerEdge R660XS
- Dell PowerEdge R6615
- Dell PowerEdge R6625
- Dell PowerEdge R6715
- Dell PowerEdge R6725
- Hyper-Converged infrastructure (HCI)
- Network Function Virtualization (NFV)
- Virtualization
The Dell PowerEdge R6615 is a 1U single-socket rack server built to maximize value per dollar in enterprise data centers, delivering solid performance and flexible, low-latency storage through air-cooled or Direct Liquid Cooling (DLC) configurations. It supports breakthrough innovation for both traditional and emerging workloads — including dense virtualization, hyper-converged infrastructure (HCI), and Network Function Virtualization (NFV) with OpenStack for Telco — combining top-tier performance, density, and optional acceleration.
The R6615 runs on a single 4th Generation AMD EPYC 9004 Series processor with up to 128 cores, paired with 12 DIMMs of DDR5 memory — registered ECC DDR5 DIMMs only. An optional BOSS-N1 boot device is also available, supporting hardware RAID for 2x M.2 NVMe SSDs.
There are 5 chassis options in this R6615 server with 2 rear drive bay options.
- Up to 4x 3.5" SAS/SATA (HDD/SSD) | Max: 80TB
- Up to 8x 2.5" NVMe (SSD) | Max: 122.88TB
- Up to 10x 2.5" SAS/SATA/NVMe (HDD/SSD) | Max: 153.6TB
- Up to 14x EDSFF E3.S Gen5 NVMe (SSD) | Max: 107.52TB
- Up to 16x EDSFF E3.S Gen5 NVMe (SSD) | Max: 122.88TB
Rear bays:
- Up to 2x 2.5" SAS/SATA (HDD/SSD) | Max: 30.72 TB
- Up to 2x EDSFF E3.S Gen5 NVMe (SSD) | Max: 15.36 TB
One AMD® EPYC 4th Generation Genoa (SP5) processor 9004 Series with up to 128 cores processor.
Processor compatibility varies by chassis, largely due to differences in cooling support. Check the Thermal Restriction Matrix in the spec manual for full details.
Heatsink & Fans
Up to 4 sets of dual-fan hot-plug modules handle cooling, and this system also supports Direct Liquid Cooling (DLC).
| Item | Type | Solution Strategy | |
|---|---|---|---|
| Fan | Standard Fan (STD) | All 3.5" HDD x 4 Configurations | |
| High Performance Gold Fan (HPR Gold) | for Air Cooling | for Liquid Cooling | |
| Either one matched in non 3.5-inch Chassis: 2.5-inch x 10 configuration 2.5-inch x 8 and No BP configurations DDR5 RDIMM >128 GB Rear Drives GPU |
3.5-inch HDD x 4 config. w/ LC part in QB DDR5 RDIMM >128 GB Rear Drives GPU |
||
| CPU HSK | 1U EXT. HSK. | All air cooling configurations. | |
| DLC Module | For all CPU operation at DLC configurations. | ||
| Shroud | Air Shroud | All air cooling configurations require an air shroud. | |
| Air Shroud for 1DPC | New air shroud be required at all air cooling config. w/ 1DPC MB. | ||
| OCP Shroud | System with OCP card but without riser 2 implemented. | ||
| Blank | DIMM Blank | When CPU > 240 W installed, except DLC configurations. | |
12 DDR5 DIMM slots support RDIMMs up to 3TB max, with speeds reaching 4800 MT/s — registered ECC DDR5 DIMMs only.
The R6615 uses registered DIMMs (RDIMMs) to reach maximum platform memory capacity; unbuffered DIMMs (UDIMMs) are not supported.
| DIMM type | Rank | Capacity | DIMM rated voltage and speed | Operating Speed |
|---|---|---|---|---|
| 1 DIMM per channel (DPC) | ||||
| RDIMM | 1R | 16 GB | DDR5 (1.1 V), 4800 MT/s | 4800 MT/s |
| 2R | 32 GB | DDR5 (1.1 V), 4800 MT/s | 4800 MT/s | |
| 2R | 64 GB | DDR5 (1.1 V), 4800 MT/s | 4800 MT/s | |
| 4R | 128 GB | DDR5 (1.1 V), 4800 MT/s | 4800 MT/s | |
| 6R | 256 GB | DDR5 (1.1 V), 4800 MT/s | 4800 MT/s |
Three PCIe slots give this server room for a range of adapter options, with support for up to 2x 75W GPUs per unit.
| Config No. | RSR Configuration | # of CPUs | PERC type supported | Rear Storage Possible |
|---|---|---|---|---|
| 0 | NO RSR | 1 | Front PERC | No |
| 1 | R2A + R3A | 1 | Front PERC | Yes |
| 2 | R2T + R3P | 1 | Front PERC | Yes |
| 3 | R1Q + R4p | 1 | Front PERC | No |
| 4 | R2T | 1 | Front PERC | Yes |
| 5 | R3P | 1 | Front PERC | Yes |
| 6 | R2A | 1 | Front PERC | No |
| 7 | R2U + R3S | 1 | Front PERC | Yes |
| 8 | R2T + R3A | 1 | Front PERC | Yes |
Networking Adapters
An optional 2x 1GbE LOM card and optional 1x OCP 3.0 card can be installed independently or together on this system. The OCP card supports up to 4 ports at speeds up to 25Gb/s, while the LOM is limited to 2 ports.
| Feature | Specifications |
|---|---|
| LOM card (optional) | 1 GB x 2 |
| OCP card (OCP 3.0) (optional) | 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4 |
| NOTE: The system allows either LOM card or an OCP card or both to be installed in the system. | |
| NOTE: On the system board, the supported OCP PCIe width is x8; when x16 PCIe width is installed, it is downgraded to x8. | |
Dell's fPERC solution delivers a base RAID hardware controller without occupying a PCIe slot, using a compact, high-density connector to the base planar. The 16G PERC controller lineup draws heavily from the established 15G family, carrying forward the Value and Value Performance tiers, while introducing the new Harpoon-based Premium Performance tier — a high-end option built to boost IOPS and enhance SSD performance.
PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i,
Internal Boot:Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB
External HBA (non-RAID):HBA355e, HBA465e, H965e
Software Raid:S160
| Performance Level | Controller and Description |
|---|---|
| Entry | S160 |
| Value | H355, HBA355 (Internal/External), HBA465 (External) |
| Premium Performance | H755, H755N, H965 (Internal/External) |
Two redundant AC or DC power supply units are supported, using the same 60mm form factor carried over from 15G to 16G — PSUs should not be mixed.
- Width 482 mm (18.97")
- Height 42.8 mm (1.685")
- Length w/ bezel 822.89 mm (32.39")
- Length w/o bezel 809.05 mm (31.85")
With drives 20.2 kg (44.53 lbs)
Without drives and PSU installed 17.4 kg (38.36 lbs)
Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Direct Liquid Cooling Modules
Memory
Storage Devices
Drive cage
HDD 3.5" Drives
HDD 2.5" Drives
SSD 2.5" Drives
SSD 2.5" NVMe Drives
SSD 2.5" NVMe EDSFF E3.S Drives
Riser Configurations
OCP NIC
GPU
Bezel
Rail Kit
Trusted Platform Module TPM
iDRAC9 Remote Management
Power Supply Unit (PSU)
ECS Warranty
The request has been sent.
Thank you.
Price as Configured:
$0
Base Standard Capabilities
| Feature | Technical Specifications | ||
|---|---|---|---|
| Processors | One AMD EPYC 4th Generation 9004 Series with up to 128 cores | ||
| Memory | • 12 DDR5 DIMM slots, supports RDIMM 3 TB max, speed up to 4800 MT/s • Supports registered ECC DDR5 DIMMs only | ||
| Storage Controllers: | • Internal Controllers (RAID) PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i • Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB • External HBA (non-RAID): HBA355e • Software Raid: S160 | ||
| Drive Bays | Front bays: • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 80 TB • Up to 8 x 2.5-inch NVMe (SSD) max 122.88 TB • Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 153.6 TB • Up to 14 x EDSFF E3.S Gen5 NVMe (SSD) max 107.52 TB • Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) max 122.88 TB Rear bays: • Up to 2 x 2.5-inch SAS/SATA (HDD/SSD) max 30.72 TB • Up to 2 x EDSFF E3.S Gen5 NVMe (SSD) max 15.36 T | ||
| Power Supplies | • 1800 W Titanium 200–240 V AC or 240 HVDC, hot swap redundant • 1400 W Platinum 100–240 V AC or 240 HVDC, hot swap redundant • 1100 W Titanium 100–240 V AC or 240 HVDC, hot swap redundant • 1100 W LVDC -48 – -60 VDC hot swap redundant • 800 W Platinum 100–240 V AC or 240 HVDC, hot swap redundant • 700 W Titanium 200–240 V AC or 240 HVDC, hot swap redundant | ||
| Cooling Options | • Air cooling • Optional Direct Liquid Cooling (DLC) Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate. | ||
| Fans | • Standard (STD) fans/High performance GOLD (VHP) fans • Up to 4 sets (dual fan module) hot plug fans | ||
| Dimensions | • Height – 42.8 mm (1.685 inches) • Width – 482 mm (18.97 inches) • Depth – 822.89 mm (32.39 inches) with bezel -------809.05 mm (31.85 inches) without bezel | ||
| Form Factor | 1U rack server | ||
| Embedded Management | • iDRAC9 • iDRAC Direct • iDRAC RESTful API with Redfish • iDRAC Service Module • Quick Sync 2 wireless module | ||
| Bezel | Optional LCD bezel or security bezel | ||
| OpenManage Software | • OpenManage Enterprise • OpenManage Power Manager plugin • OpenManage Service plugin • OpenManage Update Manager plugin • CloudIQ for PowerEdge plug in • OpenManage Enterprise Integration for VMware vCenter • OpenManage Integration for Microsoft System Center • OpenManage Integration with Windows Admin Center | ||
| Mobility | OpenManage Mobile | ||
| OpenManage Integrations | • BMC Truesight • Microsoft System Center • OpenManage Integration with ServiceNow • Red Hat Ansible Modules • Terraform Providers • VMware vCenter and vRealize Operations Manager | ||
| Security | • AMD Secure Encrypted Virtualization (SEV) • AMD Secure Memory Encryption (SME) • Cryptographically signed firmware • Data at Rest Encryption (SEDs with local or external key mgmt) • Secure Boot • Secured Component Verification (Hardware integrity check) • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ | ||
| Embedded NIC | 2 x 1 GbE LOM card (optional) | ||
| Network Options | 1 x OCP card 3.0 (optional) Note: The system allows either LOM card or an OCP card or both to be installed in the system. | ||
| GPU Options | Up to 2 x 75 W SW | ||
| Ports | Front Ports • 1 x iDRAC Direct (Micro-AB USB) port • 1 x USB 2.0 • 1 x VGA | Rear Ports • 1 x Dedicated iDRAC Ethernet port • 1 x USB 3.0 • 1 x USB 2.0 • 1 x Serial (optional) • 1 x VGA (optional for Direct Liquid Cooling configuration) | |
| Internal Ports • 1 x USB 3.0 (optional) | |||
| PCIe | Up to three PCIe slots: • Slot 1: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length or 1 x8 Gen4 Low profile, Half length • Slot 2: 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length or 1 x8 Gen4 Low profile, Half length • Slot 3: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length | ||
| Operating System and Hypervisors | • Microsoft Windows Server with Hyper-V • Red Hat Enterprise Linux • SUSE Linux Enterprise Server • VMware ESXi | ||
Spec Sheet 4
| Rack Server | R760 | R660 | R7625 | R6625 | R7615 | R6615 |
|---|---|---|---|---|---|---|
| Key attributes | Provides performance and versatility for demanding applications | Provides performance and versatility for demanding applications | Breakthrough performance | Breakthrough performance | Powerful performance and scalability | Peak performance and excellent TCO |
| Target workloads | Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure | High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization | High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization | High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization | Software-Defined Storage (SDS), Virtualization, Data Analytics | Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV) |
| Type of processor | 2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor | 2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor | 1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores | |||
| Memory (DDR5 DIMM slots & max) | 32 (8 TB) | 24 (1.5 TB*) | 12 (768 GB*) | |||
| Disk drives up to: | 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5” (rear) |
8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear) |
4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear) |
4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
| NVMe drives up to: | 24 | 10 | 24 | 10 | 24 | 10 |
| Gen5 PCIe slots up to: | 4 | 2 | 4 | 2 | 4 | 2 |
| Gen4 PCIe slots up to: | 8 | 3 | 8 | 3 | 4 | 3 |
| Accelerator support up to: | 2 x 350 W DW or 6 x 75 W SW | 2** x 75 W SW | 2 x 300 W DW or 6 x 75 W SW | 3 x 75 W SW | 3 x 300 W DW or 6 x 75 W SW | 3 x 75 W SW |
| Rack height (U) | 2 | 1 | 2 | 1 | 2 | 1 |
| Integrated security | TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks. | TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV) | ||||
| * Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615. ** Future releases will include additional GPU slots in R660. |
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