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1U rack server
Processor | Max: 144 E-Cores / 88 P-Cores2x Intel Xeon 6 E-Core / P-Core
Memory | Max: 8TB32 ECC DDR5 RDIMM 6400Mhz
Supports registered ECC DDR5 DIMMs only
8x 2.5" (SAS/SATA/NVMe)
10x 2.5" (SAS/SATA/NVMe)
8x EDSFF E3.S NVMe (G5) Max: 122.88TB
16x EDSFF E3.S NVMe (G5) Max: 245.76TB
20x EDSFF E3.S NVMe (G5) Max: 307.2TB
Up to 2 x EDSFF E3.S Gen5 NVMe (20 EDSFF Chassis Only)
Storage Controller:H365i, H965i, H975i
H965e, HBA465e
BOSS-N1
BOSS-N1 DC-MHS
USB
Front I/O supports 2x OCP 3.0
Rear I/O Supports 2x OCP 3.0 + 2x 1GbE LOM
iDRAC10
PCIe Slots:Front I/O, 2 x16 (G5)
3 x16 (G5) or 2 x8 (G5)
Up to 3 x 75 W SW
(Click to View)
The Dell PowerEdge R670 is a 1U, dual-socket rack server designed for high-performance computing with optimal power efficiency and balanced performance to boost your data center productivity. It balances advanced computing power with virtualization, cloud-native applications, all-flash SDS, hyperscale workloads, and scale out databases
The PowerEdge R670, designed for enterprise scalability, integrates seamlessly with existing systems. Powered by two Intel® Xeon® 6 processors with E-cores and P-cores, it delivers 1.69x better performance per watt than previous models, enhancing power efficiency and rack density. GPU support boosts computational power while maintaining low energy consumption.
The PowerEdge R670 offers rear I/O hot aisle and front I/O cold aisle configurations. The front I/O cold aisle enhances serviceability, reduces maintenance time, and improves efficiency, reliability, and uptime, supporting sustainability by optimizing cooling and energy use. Dell’s Smart Power and Cooling Technology, tailored for air cooling, significantly cuts energy consumption for long-term operational savings.
Security is integrated into every phase of the PowerEdge lifecycle, including protected supply chain and factory-to-site integrity assurance. The Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor Authentication (MFA) and role-based access controls safeguard trusted operations.
The Intel® Xeon® 6 series of processors offers both E-Core and P-Core processors. Mixing of CPUs is not supported.
Xeon E-CoresThe Intel® Xeon® 6 series single threaded processor stack is comprised entirely of efficiency cores (E-Cores) providing ultra-high core counts optimized for power efficient operations.
• Optimized for single-threaded workloads
• Up to 144 cores at 330 W TDP
• 6400 MT/s DDR5 memory
• Up to four 24 GT/s UPI 2.0
• PCIe 5.0 with up to 88 lanes per CPU
• Security features (SGX)
Xeon P-CoresThe Intel® Xeon® 6 series processor stack is comprised entirely of performance cores (P-Cores), providing high core counts optimized for power and performance.
• Optimized for multi-threaded applications and workloads
• Up to 86 cores at 350 W TDP
• 6400 MT/s DDR5 memory
• Up to four 24 GT/s UPI 2.0
• PCIe 5.0 with up to 88 lanes per CPU
• Security features (SGX)
1U Heatsink | TDP < 270 W
L-Type Heatsink | TDP >= 270 W
Liquid Cooling (DLC)
Please view the "Table 54. Thermal restriction matrix" in the tech manual below for more details.
The Dell PowerEdge R760 holds up to 32x DDR5 DIMMs
| DIMM type | Rank | Capacity | DIMM voltage and speed | E-core processor | P-core processor | ||
|---|---|---|---|---|---|---|---|
| 1 DIMM per channel (DPC) | 2 DIMM per channel (DPC) | 1 DIMM per channel (DPC) | 2 DIMM per channel (DPC) | ||||
| RDIMM | 1R | 16 GB | DDR5 (1.1 V), 6400 MT/s | N/A | N/A | Up to 6400 MT/s | N/A |
| 2R | 32 GB | DDR5 (1.1 V), 6400 MT/s | Up to 6400 MT/s | N/A | Up to 6400 MT/s | Up to 5200 MT/s | |
| RDIMM | 2R | 64 GB | DDR5 (1.1 V), 6400 MT/s | Up to 6400 MT/s | Up to 5200 MT/s | Up to 6400 MT/s | Up to 5200 MT/s |
| 96 GB | DDR5 (1.1 V), 6400 MT/s | N/A | N/A | Up to 6400 MT/s | Up to 5200 MT/s | ||
| 128 GB | DDR5 (1.1 V), 6400 MT/s | N/A | N/A | Up to 6400 MT/s | Up to 5200 MT/s | ||
| 256 GB | DDR5 (1.1 V), 6400 MT/s | N/A | N/A | N/A | Up to 5200 MT/s | ||
Front H965i DC-MHS
Front H975i DC-MHS
Front H365i DC-MHSThe system supports either Front I/O configuration (system with front risers) or Rear I/O configuration (system with rear risers).
RF1a
RF1b
R2b Riser
R2c Riser
R2e Riser
R2f Riser
R2g Riser
R4a Riser
R4b Riser| Riser configurations (RC) | Expansion card risers | PCIe Slots | Form factor | Controlling processor | Slot's electrical physical/bandwidth connector |
|---|---|---|---|---|---|
| RC0: 1x8(x16) + OCP(3)x1xBOSS |
OCP | 5 | OCP | Processor 0 | PCIe Gen5 x16 (OCP 4C+ connector) |
| BOSS | 3 | BOSS | Processor 0 | PCIe Gen3 x4 (IC connector) | |
| RC1 (front): 2x16FH(G5) |
RF1a | 31 | Full height | Processor 0 | PCIe Gen5 x16 (x16 connector) |
| 32 | Full height | Processor 1 | PCIe Gen5 x16 (x16 connector) | ||
| BOSS | 34 | BOSS | Processor 0 | PCIe Gen3 x4 4 (1C connector) | |
| RC2 (front): 2x16OCP(G5) |
RF1b | 31 | OCP | Processor 0 | PCIe Gen5 x16 (OCP 4C+ connector) |
| 32 | OCP | Processor 1 | PCIe Gen5 x16 (OCP 4C+ connector) | ||
| BOSS | 34 | BOSS | Processor 0 | PCIe Gen3 x4 (IC connector) | |
| RC5 (rear): 2x16FH(G5) + 1(x8 / x16 OCP) |
R2b | 1 | Full height | Processor 1 | PCIe Gen5 x16 (x16 connector) |
| R4b | 4 | Full height | Processor 0 | PCIe Gen5 x16 (x16 connector) | |
| BOSS | 3 | BOSS | Processor 0 | PCIe Gen3 x4 (1C connector) | |
| OCP | 5 | OCP | Processor 0 | PCIe Gen5 x16 (OCP 4C+ connector) | |
| RC6 (rear): 2x16LP(G5) + 1x16OCP(G5) + 1 x8/x16 OCP(G5) |
R2f | 1 | Low Profile | Processor 1 | PCIe Gen5 x16 (x16 connector) ) |
| 2 | OCP | Processor 1 | PCIe Gen5 x16 (OCP 4C+ connector) | ||
| R4a | 4 | Low Profile | Processor 0 | PCIe Gen5 x16 (x16 connector) | |
| BOSS | 3 | BOSS | Processor 0 | PCIe Gen3 x4 (1C connector) | |
| OCP | 5 | OCP | Processor 0 | PCIe Gen5 x16 (OCP 4C+ connector) | |
| RC8: 3x16LP(G5) + 1x8/x16 OCP(G5) + 1xBOSS |
R2c | 1 | Low Profile | Processor 1 | PCIe Gen5 x16 (x16 connector) |
| 2 | Low Profile | Processor 1 | PCIe Gen5 x16 (x16 connector) | ||
| BOSS | 3 | BOSS | Processor 0 | PCIe Gen3 x4 (1C connector) | |
| R4a | 4 | Low Profile | Processor 0 | PCIe Gen5 x16 (x16 connector) | |
| OCP | 5 | OCP | Processor 0 | PCIe Gen5 x16 (OCP 4C+ connector) | |
| RC10: 2x16LP(G5) + 1x8/x16 OCP(G5) +1xBOSS |
R2e | 1 | Low Profile | Processor 1 | PCIe Gen5 x16 (x16 connector) |
| BOSS | 3 | BOSS | Processor 0 | PCIe Gen3 x4 (1C connector) | |
| R4a | 4 | Low Profile | Processor 0 | PCIe Gen5 x16 (x16 connector) | |
| OCP | 5 | OCP | Processor 0 | PCIe Gen5 x16 (OCP 4C+ connector) |

I/O Supports either front or back, not both.
OCP is also supported in front of the system for some configurations, called the Floating OCP Paddle Card (FLOP). Additionally, the Front I/O OCP supports both internal latch and thumbscrew versions, providing flexibility in installation and maintenance.
BOSS-N1 DC-MHS
BOSS-N1 Interposer
Internal USB Boot
Secondary blank (Default)
Secondary with optional KVM
Secondary with optional Quick Sync 2.0Not sure what power supply to use. Dell has a calculator for you
| Form factor | Output | Power cord |
|---|---|---|
| 60 mm | 800 W mixed mode | C13 |
| 1100 W mixed mode | C13 | |
| 1400 W -48 VDC | Lotes RN5T2 | |
| 1500 W mixed mode | C13 | |
| 1500 W mixed mode 277Vac & HVDC | APP/Saf-D-Grid | |
| 1800 W mixed mode | C13 |
(List below serves as quick links to each section)