HPE ProLiant DL360 Gen11 20 EDSFF CTO Rack Server

The HPE ProLiant DL360 Gen11 server is a rack-optimized 1U dense solution that delivers exceptional compute performance, upgraded high-speed data transfer rate, and memory depth with 2P compute capability. Powered by 4th Gen Intel® Xeon® Scalable processors with up to 60 cores, increased memory bandwidth, up to 8 TB of memory, and high-speed PCIe Gen5 I/O, the HPE ProLiant DL360 Gen11 server is a perfect rack-optimized, 1U 2P, dense solution for general-purpose virtualization workloads that require increased compute density with built-in security and flexibility.

The silicon root of trust anchors the server firmware to an HPE-exclusive ASIC, creating an immutable fingerprint for the Secure Intel Processor that must be matched exactly before the server will boot. The HPE ProLiant DL360 Gen11 server is an excellent choice for EDA, CAD, and VDI.

There are Three Chassis to choose from.

• 4 LFF
• 8 SFF (+ 2 SFF or ODD)
• 20 EDSFF

HPE ProLiant DL360 Gen11 Base Knowledge
Since this Server is so large and has so many configurations, we have broken it up by chassis to make this information a little easier for you to digest.

Chassis

• 20 EDSFF Carrier 1T (EC1) drive bays: 32G x4 NVMe (PCIe5.0 E3.s 1T)
• 20EDSFF backplane and cage are pre-selected, in CTO server.

Processor
The DL360 Gen11 supports the 4 ^th Gen Intel Xeon Processor with up to 80 cores. CTO server will populate necessary fan kits per system thermal requirements and processor models, minimum of 5 standard fans. Dual processor configurations require 7 fans, either standard or high-performance.

If 350W Processor (excluding lntel Open-loop Liquid Cooling CPU 6458Q/ 8470Q) is selected with Closed Loop Liquid cooling , then Maximum 10x SFF NVMe drive or 20x EDSFF can be selected. Or DLC module must be selected for SFF or EDSFF drives models.

EDSFF CTO Model: If 350W CPU is selected with Closed Loop Liquid cooling, then 256GB DIMM cannot be selected.

If 8470Q Processor is selected with Closed-loop Liquid Cooling, then 4LFF and 20EDSFF CTO Server cannot be selected as backplane is embedded as default. Or DLC module with Performance Fan Kit must be selected.

Some Processors can only be installed in a single socket configuration.

• Gold 6421N Processor
• Gold 6414U Processor
• Gold 5411N Processor

Heatsink & Fans
This DL360 Gen11 20 EDSFF Rack Server Choice of Performance Fan Kits and Closed-loop Liquid Cooling Heatsink Fan FIO Bundle Kit Below is a table showing you the TDP and which Heatsink / Fan system will be supported.

EDSFF Model: If 256GB DIMM and Rear NS204i-u are selected, then DLC Module must be selected.

Max 1 of the Liquid cooling bundle kit below can be selected:

• Closed Loop Liquid Cooling (P48906-B21)
• DLC Module from NS204i-u Cage (P62026-B21)
• DLC Module from PCIe slot (P62029-B21)
  • Required for all DLC in order to function: HPE Rack, Rack Manifold, CDU, Primary Hose Kit, and Secondary Hose Kit

If the DLC Module from NS204i-u Cage (P62026-B21) is selected then both the following are not supported.

• HPE DL360 Gen11 NS204i-u Rear Cbl Kit
• Secondary FH Riser

If the DLC Module from PCIe slot (P62029-B21) is selected then one of the Secondary Risers must be installed and the PCIe slot# 3 cannot be used.

Options listed below would require a Performance Fan kit or Direct Liquid Cooling bundle kit to be implemented.

• CPU TDP (as above table shows)
• 256GB DIMM
• NIC and InfiniBand adapters and OCP cards that go beyond 100GbE/200GbE
• NVMe storage (even Qty 1)
• With GPU
• With hot-plug (external) OS Boot Device NS204i-u

Memory
Maximum capacity (RDIMM) 8.0 TB 32 x 256 GB RDIMM @ 4800 MT/s

Mixing of DIMM types (UDIMM, RDIMM, and LRDIMM) is not supported.

EDSFF Model: If 256GB DIMM and Rear NS204i-u are selected, then DLC Module must be selected.

This DL360 Gen 11 can hold up to a total of 8TB of DDR5 memory on 32 DIMMs in a 2-socket configuration. 16 DIMMs per processor.

All DIMMs in a Processor socket must have the same number of ranks (unless explicitly specified otherwise). x8 DIMMs and x4 DIMMs cannot be mixed in the same channel or same Processor socket.

Mixing vendor is allowed for RDIMMs, but it is not allowed for 3DS RDIMMS

If a 350W CPU is selected with Closed Loop Liquid cooling, then 256GB DIMM cannot be selected.
If 256GB of Memory is selected, and without DLC Module. Then a high-speed Networking/ InfiniBand card (PCIe and OCP) that is 100G or more cannot be selected.
If 256GB Memory is selected, will be limited using 7x performance fan or Closed Loop Liquid Cooling fan (not allow standard fan)

All empty DIMM slots must have a HPE DDR4 DIMM Blank Kit (P07818-B21) installed.

RAID Controller
Choice of Intel® VROC Software RAID or HPE ProLiant Gen11 MR and SR PCIe or OCP plug-in Controller. If any of these controllers are selected, then "HPE 96W Smart Stg Li-ion Batt 145mm Kit (P01366-B21 )" or "HPE Smart Hybrid Capacitor w/ 145mm Cbl (P02377-B21 )" must be selected. Vice versa. Now if any of these Storage Batteries get selected. They also need the HPE ProLiant DL360 Gen11 Storage Controller Enablement Cable Kit (P48918-B21).

If "HPE FIO No Smart Storage Battery (P06141-B21 )" is selected, then SR932/ MR416/ MR408 controller must be selected.

If RAID is selected and both SAS AND SATA drives are configured, then only the SAS drives will be used in the RAID set. (SAS drives must be the same part number; SATA drives can vary in part numbers).

If RAID is being selected in a configuration with Intel® VROC and an internal controller, then Customer Defined RAID Setting (389692-B21) must be selected.

There are a lot of rules with RAID in the PDF Manual. I recommend you reading the manual to understand all the requirements and limitations of RAID in this system.

Software RAID Controller (VROC) SATA

• RAID Support- 0/1/5/10.
• Intel® VROC SATA is off by default and must be enabled.

Expansion Slots

If Closed Loop Liquid cooling is selected with specific high speed Networking/ InfiniBand, then EDSFF or SFF NVMe drive cannot be selected.

EDSFF CTO Model: If 256GB DIMM and Rear NS204i-u are selected, then DLC Module must be selected.
EDSFF CTO Model: If “HPE IB NDR200 1p OSFP MCX75310AAS Adptr” is selected with Closed Loop Liquid cooling, then EDSFF drives cannot be selected.

The HPE DL360 Gen 11 has advanced data transfer rates and higher network speeds from the PCIe Gen5 serial expansion bus, with up to 3 x16 PCIe Gen5 and 2 OCP slots.

The system can hold up to 3 PCIe 5.0 slots on two risers. The first riser is a default butterfly riser that comes with the chassis. The default riser is controlled by the first CPU and has two PCIe 5.0 x16 slots. Slot 1 is a full-height while slot 2 is a half-height slot.

The second riser has two options to choose from. One option is the FH Riser makes Slot 2 on Riser 1 not available while the LP Riser does make slot 2 available. With the second option, you are able to get all 3 PCIe 5.0 slots integrated.

If you install the NS204i-u Rear Cable Kit (P54702-B21), then slot 2 of riser 1 will not be available since this is where that card can be installed. You do have another option of installing this Ns204i-u internally (P48920-B21). This OS Boot device includes 2x 480GB M.2 NVMe SSDs, with preconfigured hardware RAID1.

GPU
Supports up to 2 single wide (SW) GPUs to accelerate graphic intense workloads. Mixing of different Graphics Option is not allowed. Requires high performance fans.

EDSFF CTO Model: If the Graphics Option is selected with Processor Wattage is more than 270W, then DLC Module & Performance Fan Kit must be selected.
EDSFF CTO Model: If the Nvidia Graphics Option is selected with Closed Loop Liquid cooling, then EDSFF drives cannot be selected.

Integrated Lights-Out 6 (iLO 6)
Software that enables you to securely configure, monitor, and update your HPE ProLiant Gen11 servers seamlessly, from anywhere.

Embedded in Hewlett Packard Enterprise servers, HPE Integrated Lights-Out 6 (iLO 6) is an exclusive core intelligence that monitors server status, providing the means for reporting, ongoing management, service alerting, and local or remote management to quickly identify and resolve issues.

Fan Units
Supports Smart Cooling Modules for highest thermal design points (TDPs)

The DL360 Gen11 will support up to 7 fans with fan redundancy built in. One fan rotor failure will place server in degraded mode but fully functional. Two fan rotor failures could provide warning and imminent server shutdown.

Standard Fan Kit: Dual rotor hot plug Standard Fan kit (includes 5 fans) for processors below 185W TDP.

Optional 2P standard Fan Kit: Dual rotor hot plug 2P Standard Fan Kit (includes 2 fans) for second processor.

Performance Fan Kit (P48908-B21): Dual rotor hot plug High Performance Fan Kit available (includes 7 fans), for one or two processors from 186W to 270W TDP. Or one processor with 300W TDP.

Closed-loop Liquid Cooling Heat Sink Fan FIO Bundle Kit (P48906-B21) supports one or two processors go beyond 271W TDP, as a factory installation kit only. Customer self-repair or self-field upgrade is not allowed. If Closed-loop Liquid Cooling HeatSink Fan FIO Bundle Kit is selected, then any Fans (Standard Fan Kit or High Performance Fan Kit) cannot be selected.

Direct Liquid Cooling Heatsink Fan FIO Bundle Kit supports two processors go beyond 271W TDP, with enhanced thermal condition.

Power
HPE Flexible Slot (Flex Slot) Power Supplies share a common electrical and physical design that allows for hot plug, tool-less installation into HPE ProLiant Gen11 Performance Servers. Flex Slot power supplies are certified for high-efficiency operation and offer multiple power output options, allowing users to "right-size" a power supply for specific server configurations. This flexibility helps to reduce power waste, lower overall energy costs, and avoid "trapped" power capacity in the data center.

Mixing of 2 different power supplies is NOT supported.

HPE 1600W Flex Slot -48VDC Hot Plug Power Supply Kit (P17023-B21). If 1600W DC Power supply is selected, then either "HPE 1600W DC PSU Power Cable Kit (P22173-B21)" or "HPE 1600W DC PSU Power Lug Option Kit (P36877-B21)" must be selected and the quantity must match. vice versa. Both "HPE 1600W DC PSU Power Lug Option Kit" and "HPE 1600W DC PSU Power Cable Kit" cannot be selected together.

Dimensions & Weight:

SFF Drives (Height x Width x Depth)

• 29 x 43.46 x 75.31 cm
• 69 x 17.11 x 29.65 in

EDSFF Drives (Height x Width x Depth)

• 29 x 43.46 x 77.31 cm
• 69 x 17.11 x 30.43 in

Weight (approximate)

14.56 kg (32.1 lb)

• SFF minimum: One drive, one processor, one power supply, two heatsinks, one Smart Array controller, and five fans.

20.44 kg (45.07 lb)

• SFF maximum: Ten drives, two processors, two power supplies, two heatsinks, one Smart Array controller, and seven fans.

14.75kg (32.51lb)

• EDSFF minimum: One drive, two processors, one power supply, two heatsinks, one Smart Array controller, and seven fans.

21.19kg (46.71lb)

• EDSFF maximum: Twenty drives, two processors, two power supplies, two heatsinks, one Smart Array controller, and seven fans.