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SKU: DPE-R660-NO-BP-Chassis

Dell PowerEdge R660 Rack Server No Backplane

Dell

| Chassis
$4,150.00

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Quick Specs

Form Factor:

1U rack server

Processor | Max: 56 Cores

2x 4th Gen Intel Xeon Scalable

Memory | Max: 8TB

32 ECC DDR5 RDIMM 4800Mhz

Storage | Max: N/A

No Backplane

Rear Drives | Max: N/A

No Backplane

Storage Controller:

S160 (SW RAID)
H965i, H755, H755N, H355, HBA355i, HBA355e

Boot Options:

BOSS-N1
USB

Networking Options (NOC):

1x OCP card 3.0 + 2x 1 GbE LOM with BCM5720 LAN controller
Note: The system allows either LOM card or an OCP card or both to be installed in the system.

Remote Management:

iDRAC9 with Lifecycle Controller

PCIe Slots:

2x PCIe Gen5 slots
3x PCIe Gen4 slots

GPU:

Up to 3 x 75 W SW

Other Versions

Ideal for:

  • Data Analytics
  • Virtualization

The new Dell PowerEdge R660 is a 1U, two-socket rack server. Gain the performance you need with this full-featured enterprise server, designed to optimize even the most demanding workloads like dense database analytics and high-density virtualization.

Max Performance:
  • Add up to two Next Generation Intel® Xeon® Scalable processors with up to 56 cores for faster and more accurate processing performance.
  • Accelerate in-memory workloads with up to 32 DDR5 RDIMMS up to 4400 MT/sec (2DPC) or 4800 MT/sec for 1DPC (16 DDR5 RDIMMs max).
  • Support for GPUs including 2* x single-wide for workloads requiring acceleration.
Air-cooled at peak performance
  • New Smart Flow chassis optimizes airflow to support the highest core count CPUs in an air-cooled environment within the current IT infrastructure.
  • Support for up to 8 x 2.5” drives and 2 x 350 watt processors.
Cyber Resilient Architecture for Zero Trust IT environment & operations

Security is integrated into every phase of the PowerEdge lifecycle, including protected supply chain and factory-to-site integrity assurance. Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor Authentication (MFA) and role-based access controls ensure trusted operations.

Gain agility
  • Achieve maximum efficiency with multiple chassis designs that are tailored to your desired workloads and business objectives.
  • Storage options include up to 8 x 2.5” NVMe/SAS4/SATA, plus up to 10 x 2.5” NVMe/SAS4/SATA, 14/16 x NVME E3.S Gen5*.
  • Multiple Gen4 and Gen5 riser configurations (up to 3 x PCIe slots) with interchangeable components that seamlessly integrate to address customer needs over time.
Dell PowerEdge R660 Base Knowledge

The Dell R660 is a 1U 2 Socket 32 DIMM server with 3 PCIe slots, 1 OCP, and 1 LOM. This server has 3 chassis options and supports SAS/SATA/NVMe and EDSFF drives. Below you will see more details about each chassis storage option and the drives supported.

Chassis Options
Chassis Supported Configurations
No Drive Chassis Zero drives (no backplane)
8SFF
  • 2.5" (NVMe)
  • 2.5" (NVMe RAID)
  • 2.5" (SAS4/SATA)
  • 2.5" Universal
10SFF + Optional Rear 2SFF Drive
  • 2.5" (SAS4/SATA)
  • 2.5" (SAS4/SATA) + 2x2.5" (SAS4/SATA)
  • 2.5" (SAS4/SATA w/ 4 Universal
  • 2.5" (NVMe)
  • 2.5" (NVMe) + 2x2.5" (NVMe)
  • 2.5" (SAS4/SATA w/ 2 Universal
NOTE: The Rear drive option is only shown in the 10SFF.
Supported Drives
Form Factor Type Speed Rotational Speed Capacities
2.5" vSAS 12 Gb SSD 1.92 TB, 3.84 TB, 960 GB, 7.62 TB
2.5" SAS 24 Gb SSD 1.92 TB, 1.6 TB, 800 GB, 3.84 TB, 960 GB, 7.68 TB
2.5" SATA 6 Gb SSD 1.92 TB, 480 GB, 960 GB, 3.84 TB
2.5" NVMe Gen4 SSD 1.6 TB, 3.2 TB, 6.4 TB, 1.92 TB, 3.84 TB, 15.63 TB, 7.68 TB, 800 GB, 400 GB
2.5" DC NVMe Gen4 SSD 3.84 TB, 960 GB
2.5" SAS 12 Gb 10 K 600 GB, 1.2 TB, 2.4 TB
Processor | 4th Generation Intel Xeon Scalable

Up to two 4th Generation Intel Xeon Scalable processors, with up to 56 cores and optional Intel® QuickAssist Technology. 8470Q and 6458Q are supported only in liquid cooling configuration. Mixing of the processors is not recommended. If a liquid-cooled processor is installed in one socket, then the second processor used must be of the same type.

  • Faster UPI with up to four Intel Ultra Path Interconnect (Intel UPI) at up to 16 GT/s, increasing multi socket bandwidth
  • More, faster I/O with PCI Express 5 and up to 80 lanes (per socket)
  • Enhanced Memory Performance with DDR5 support and memory speed up to 4800 MT/s in one DIMM per channel (1DPC) and 4400 MT/s in two DIMM per channel (2DPC)
  • New built-in accelerators for data analytics, networking, storage, crypto, and data compression
Image of the Dell 4th Gen Intel Xeon Processor
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Base Standard Capabilities

FeatureTechnical Specifications
ProcessorUp to two 4th Generation Intel Xeon Scalable processors, with up to 56 cores and optional Intel® QuickAssist Technology.
Memory
  • 32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 4800 MT/s
  • Supports registered ECC DDR5 DIMMs only
Storage controllers
  • Internal Controllers (RAID): PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i
  • Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD drives, or USB
  • External HBAs (non-RAID): HBA355e
  • Software RAID: S160
Drive BaysFront bays:
  • Up to 10 x 2.5-inch, SAS/SATA/NVMe (HDD/SSD) max 153.6 TB
  • Up to 8 x 2.5-inch, SAS/SATA/NVMe, (HDD/SSD) max 122.88 TB
Rear bays:
  • Up to 2 x 2.5-inch, SAS/SATA/NVMe, max 30.72 TB
Power Supplies
  • 1800W Titanium 200—240 VAC or 240 HVDC, hot swap with full redundant
  • 1400W Platinum 100—240 VAC or 240 HVDC, hot swap with full redundant
  • 1100W Titanium 100—240 VAC or 240 HVDC, hot swap with full redundant
  • 1100W LVDC -48 — -60 VDC, hot swap with full redundancy
  • 800W Platinum 100—240 VAC or 240 HVDC, hot swap with full redundant
  • 700 W Titanium 200—240 VAC or 240 HVDC, hot swap with full redundant
Cooling Options
  • Air cooling
  • Optional Direct Liquid Cooling (DLC)
Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
Fans
  • Standard (STD) fans/High performance Gold (VHP) fans
  • Up to 4 sets (dual fan module) hot plug fans
Dimensions
  • Height – 42.8 mm (1.68 inches)
  • Width – 482 mm (18.97 inches)
  • Depth – 822.88 mm (32.39 inches) with bezel
  • -809.04 mm (31.85 inches) without bezel
Form Factor1 U rack server
Embedded Management
  • iDRAC9
  • iDRAC Direct
  • iDRAC RESTful API with Redfish
  • iDRAC Service Module
  • Quick Sync 2 wireless module
BezelOptional LCD bezel or security bezell
OpenManage Software
  • OpenManage Enterprise
  • OpenManage Power Manager plugin
  • OpenManage Service plugin
  • OpenManage Update Manager plugin
  • CloudIQ for PowerEdge plug in
  • OpenManage Enterprise Integration for VMware vCenter
  • OpenManage Integration for Microsoft System Center
  • OpenManage Integration with Windows Admin Center
MobilityOpenManage Mobile
OpenManage Integrations
  • BMC Truesight
  • Microsoft System Center
  • OpenManage Integration with ServiceNow
  • Red Hat Ansible Modules
  • Terraform Providers
  • VMware vCenter and vRealize Operations Manager
Security
  • Cryptographically signed firmware
  • Data at Rest Encryption (SEDs with local or external key mgmt)
  • Secure Boot
  • Secure Erase
  • Secured Component Verification (Hardware integrity check)
  • Silicon Root of Trust
  • System Lockdown (requires iDRAC9 Enterprise or Datacenter)
  • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
Embedded NIC2 x 1 GbE LOM card (optional)
Network options1 x OCP card 3.0 (optional)
Note: The system allows either LOM card or an OCP card or both to be installed in the system.
GPU OptionsUp to 2* x 75 W SW
PortsFront Ports
  • 1 x iDRAC Direct (Micro-AB USB) port
  • 1 x USB 2.0
  • 1 x VGA
Rear Ports
  • 1 x Dedicated iDRAC Ethernet port
  • 1 x USB 2.0
  • 1 x USB 3.0
  • 1 x Serial (optional)
  • 1 x VGA (optional for Direct Liquid Cooling configuration)
Internal Ports
  • 1 x USB 3.0 (optional)
PCIeUp to three PCIe slots :
  • Slot 1 : 1 x16 Gen5 Full height, 3/4 length, Half length or 1 x8/ 1 x16 Gen 5 or 1 x16 Gen 4 Low profile, Half length
  • Slot 2 : 1 x16 Gen5 Full height, 3/4 length, Half length or 1 x16 Gen 5 or 1 x16 Gen 4 Low profile, Half length
  • Slot 3 : 1 x8/ 1 x16 Gen 5 or 1 x16 Gen 4 Low profile, Half length
Operating System and Hypervisors
  • Canonical Ubuntu Server LTS
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi

Spec Sheet 4

Rack Server R760 R660 R7625 R6625 R7615 R6615
Key attributes Provides performance and versatility for demanding applications Provides performance and versatility for demanding applications Breakthrough performance Breakthrough performance Powerful performance and scalability Peak performance and excellent TCO
Target workloads Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization Software-Defined Storage (SDS), Virtualization, Data Analytics Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV)
Type of processor 2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor 2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor 1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores
Memory (DDR5 DIMM slots & max) 32 (8 TB) 24 (1.5 TB*) 12 (768 GB*)
Disk drives up to: 12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5” (rear)		 8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)		 8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)		 4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear) 		8 x 3.5”
12 x 3.5”
8 x 2.5”
16 x 2.5”
24 x 2.5”
2 x 2.5” or 4 x 2.5”(rear)		 4 x 3.5”
8 x 2.5”
10 x 2.5”
2 x 2.5” (rear)
NVMe drives up to: 24 10 24 10 24 10
Gen5 PCIe slots up to: 4 2 4 2 4 2
Gen4 PCIe slots up to: 8 3 8 3 4 3
Accelerator support up to: 2 x 350 W DW or 6 x 75 W SW 2** x 75 W SW 2 x 300 W DW or 6 x 75 W SW 3 x 75 W SW 3 x 300 W DW or 6 x 75 W SW 3 x 75 W SW
Rack height (U) 2 1 2 1 2 1
Integrated security TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks. TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV)
* Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615.
** Future releases will include additional GPU slots in R660.

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