Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Additional Backplanes
Rear Drive cage
Risers Options
Memory
Storage Controllers
SFF SAS Drives
SFF SATA Drives
NVMe Drives
EDSFF E3.S NVMe SSD Drives
OCP NIC
Rail Kit
TPM
iDRAC9
Power Supply Units (PSU)
ECS Warranty
The request has been sent.
Thank you.
Price as Configured:
$0
Price as Configured:
$0
2U rack server
Processor | Max: 60 CoreUp to 4x Gen 4 Intel Xeon Scalable
Memory | Max: 16TBUp to 64 DDR5 RDIMM 4800Mhz
Supports registered ECC DDR5 DIMMs only.
8x 2.5” SAS/SATA Max: 122.88 TB
8x 2.5” NVMe Max: N/A
8x EDSFF E3.S Gen5 NVMe Max: 61.44 TB
16x 2.5” SAS/SATA/NVMe Max: 245.76 TB
24x 2.5” SAS/SATA/NVMe Max: 368.34 TB
16x 2.5” SAS/SATA + 8x 2.5” NVMe Max: 368.34 TB
Up to 2 x 2.5” SAS/SATA (HDDs/SSDs)
Only Supported on the 24 Bay SAS/SATA Configuration
BOSS-N1
USB
Slot 1:
- 1 x16 Gen5
- or 1 x8 Gen4 FH, HL
Slot 2:
- 1 x16 Gen5
- or 1 x8 Gen4 FH, HL
Slot 3: 1 x16 Gen5 LP, HL
Slot 4: 1 x16 Gen5 FH, HL
Slot 5: 1 x16 Gen5 FH, HL
Slot 6: 1 x16 Gen5 LP, HL
Slot 7:
- 1 x16 Gen5
- or 1 x8 Gen4 FH, HL
Slot 8:
- 1 x16 Gen5
- or 1 x8 Gen4 FH, HL
Please view the riser Section below for more details.
Remote management:iDRAC9 with Lifecycle Controller
Networking | LOM & OCP 3.0:2 x 1 GbE LOM card (optional)
1 x OCP card 3.0 (optional)
Note: The system allows either LOM card or an OCP card or both to be installed in the system.
S160 (SW)
PERC H355, H755, H965i, HBA355i, HBA355e, H965e
Not Supported
- Artificial Intelligence (AI)
- Database
- Deep Learning
- High-Performance Computing (HPC)
- Machine Learning (ML)
- Virtual Desktop Interface (VDI)
- Virtualization
- Virtual Machines (VM)
The Dell R860 supports 4 Processors on a 2U system by stacking the processors on top of each other. There is a PEM board that gets mounted on top of the 1st and second CPU. This second board holds 2 Processors and 32 DIMMs. This design is highly efficient and will bring a lot of advantages to your configuration needs.
Built for business-critical
Accelerate a wide range of applications with this four-socket 2U air-cooled design. Deliver faster results from your core operations while consolidating into fewer, more powerful servers thanks to the latest 4th generation Intel Xeon scalable processors.
- Take advantage of four powerful Intel® Xeon® processors (up to 60 cores per processor) and up to 64 DDR DIMMs for 16TB of memory, supporting large in-memory databases
- Scale up with support for up to 24 drives and 8 PCIe Gen 5 expansion slots
- Experience fast deployments and high server density in an air-cooled environment thanks to the slim 2U architecture
The R860 with a 2U air-cooled form factor and four (4) Intel Xeon® Scalable Processors enables businesses to accelerate a wide variety of core and business-critical applications including databases, analytics, and other data-driven applications.
- With a maximum CPU core count of 60 cores and the ability to support 64 DDR5 DIMMs for a total of 16TB of memory, the R860 is large enough to run in-memory databases and multiple applications.
- Scale up business needs with support for up to 24 NVMe drives, DIMMs, 8 PCIe Gen5 slots for I/O expansion, LOM, and industry standard OCP to enable customers flexible network connectivity.
- Enable fast 1:1 CPU-I/O communications with PCIe Gen5 adaptor support.
- Harness the latest generation technologies including DDR5 memory, PCIe Gen 5.0, and NVMe SSDs to maximize data transformation, support large in-memory databases, and generate faster insights to drive the business forward.
- Leverage new workload accelerators built into each Intel Xeon processor that are purpose-designed for peak performance in traditional and emerging business applications.
- Deploy quickly with slim 2U form factor, enabling IT organizations to consolidate more operations into fewer, more powerful servers, and high density in air-cooled environments.
The Dell OpenManage™ systems management portfolio delivers a secure, efficient, and comprehensive solution for PowerEdge servers. Simplify, automate and centralize one-to-many management with the OpenManage Enterprise console and iDRAC.
Security is integrated into every phase of the PowerEdge lifecycle, including protected supply chain and factory-to-site integrity assurance. Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor Authentication (MFA) and role-based access controls ensure trusted operations
There is no 16 Drive Backplane. The 16x 2.5" consists of (2) 8x 2.5" SAS/SATA backplanes or (2) of the 8x 2.5" NVMe backplanes. These can be mixed in a single configuration with two PERCs installed to control each set of drives.
The R860 has only a few backplanes that can create all the configurations below.
- 2.5-inch (x 8) NVMe backplane
- 2.5-inch (x 8) SAS, or SATA backplane
- 2.5-inch (x 24) SAS, SATA, or NVMe backplane
- 2.5-inch (x 24) NVMe Passive backplane
- EDSFF E3.S (x8) NVMe backplane
- 8 x 2.5" (SAS/SATA)
- 16 x 2.5" (SAS4/SATA)
- 16 x 2.5" (SAS4/SATA) + 8 x 2.5" NVMe
- 24 x 2.5" (SAS4/SATA)
- 24 x 2.5" (SAS4/SATA) + 2 x 2.5" (NVMe)
- 24 x 2.5" (SAS4/SATA) + 2 x 2.5" (SAS/SATA)
- 24 x 2.5" (SAS4/SATA) - Dual Controller
- 24 x 2.5" + 2 x 2.5" (SAS4/SATA) - Dual Controller
- 24 x 2.5" + 2 x 2.5" (SAS/SATA) - Dual Controller
- 24 x 2.5" (NVMe) passive
- 16 x 2.5" (NVMe RAID)
- 8 x EDSFF E3.S (NVMe) Gen5
The Dell PowerEdge R860 has a 2 or 4 socket configuration. When you install the PEM you gain access to all 64 DIMMs. Without the PEM installed, you can access 32 DIMMs on 2 sockets. Please read the manual for all the memory guidelines and limitations.
| DIMM Type | Rank | Capacity | DIMM rated voltage and speed | Operating Speed | |
|---|---|---|---|---|---|
| 1 DIMM per channel (DPC) | 2 DIMMs per channel (DPC) | ||||
| RDIMM | 1 R | 16 GB | DDR5 (1.1 V), 4800 MT/s | 4800 MT/s | 4400 MT/s |
| 2 R | 32 GB, 64 GB | DDR5 (1.1 V), 4800 MT/s | 4800 MT/s | 4400 MT/s | |
| 4 R | 128 GB | DDR5 (1.1 V), 4800 MT/s | 4800 MT/s | 4400 MT/s | |
| 8 R | 256 GB | DDR5 (1.1 V), 4800 MT/s | 4800 MT/s | 4400 MT/s | |

The PowerEdge R860 system supports up to two 10/100/1000 Mbps Network Interface Controller (NIC) ports embedded onthe LAN on Motherboard (LOM) and integrated on the optional Open Compute Project (OCP) cards.
NOTE: The system allows either LOM card or an OCP card or both to be installed in the system.
| Feature | Specifications |
|---|---|
| LOM card (optional) | 1 GbE x 2 |
| OCP card (OCP 3.0) (optional) | 1 GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4, 100 GbE x 2 |

NOTE: APERC module must be installed in slot 3 of riser 2.
The Dell 860 Rack server can support Dual Controllers on certain configurations. One Front PERC along with One Adapter PERC or Two Front PERCs like on the 16x 2.5" NVMe RAID Option.
| Performance Level | Controller and Description |
|---|---|
| Entry | S160 |
| Value | H355, HBA355 (internal/external) |
| Value Performance | H755 |
| Premium Performance | H965 (internal/external) |

The Dell PowerEdge R860 Rack Server from Dell can hold up to 8 PCIe slots. The risers come with either Gen 4 or Gen 5 PCIe slots. Some of these risers need all 4 sockets installed via the PEM to be supported.

| Configurations | Expansion card risers | PCIe Slots | Form factor | Controlling processor | PCIe Gen / Size |
|---|---|---|---|---|---|
| Config0. 4 x8 FH | R1B | 1 | Full height | Processor 1 | PCIe Gen4 x8 (x16 connector) |
| 2 | Full height | Processor 1 | PCIe Gen4 x8 (x16 connector) | ||
| R4B | 7 | Full height | Processor 2 | PCIe Gen4 x8 (x16 connector) | |
| 8 | Full height | Processor 2 | PCIe Gen4 x8 (x16 connector) | ||
| Config1. 4 x16 FH (Gen5) | R1C | 1 | Full height | Processor 3 | PCIe Gen5 x16 (x16 connector) |
| 2 | Full height | Processor 1 | PCIe Gen5 x16 (x16 connector) | ||
| R4C | 7 | Full height | Processor 2 | PCIe Gen5 x16 (x16 connector) | |
| 8 | Full height | Processor 4 | PCIe Gen5 x16 (x16 connector) | ||
| Config2. 2 x16 LP + 6 x16 FH (Gen5) | R1C | 1 | Full height | Processor 3 | PCIe Gen5 x16 (x16 connector) |
| 2 | Full height | Processor 1 | PCIe Gen5 x16 (x16 connector) | ||
| R2 | 3 | Low profile | Processor 2 | PCIe Gen5 x16 (x16 connector) | |
| 6 | Low profile | Processor 1 | PCIe Gen5 x16 (x16 connector) | ||
| R3 | 4 | Full height | Processor 4 | PCIe Gen5 x16 (x16 connector) | |
| 5 | Full height | Processor 3 | PCIe Gen5 x16 (x16 connector) | ||
| R4C | 7 | Full height | Processor 2 | PCIe Gen5 x16 (x16 connector) | |
| 8 | Full height | Processor 4 | PCIe Gen5 x16 (x16 connector) | ||
| Config3. 2 x16LP + 4 x16FH (Gen5) | R1C | 1 | Full height | Processor 3 | PCIe Gen5 x16 (x16 connector) |
| 2 | Full height | Processor 1 | PCIe Gen5 x16 (x16 connector) | ||
| R2 | 3 | Low profile | Processor 2 | PCIe Gen5 x16 (x16 connector) | |
| 6 | Low profile | Processor 1 | PCIe Gen5 x16 (x16 connector) | ||
| R4C | 7 | Full height | Processor 2 | PCIe Gen5 x16 (x16 connector) | |
| 8 | Full height | Processor 4 | PCIe Gen5 x16 (x16 connector) |
Riser 1B
Riser 1C
Riser 2
Riser 3
Riser 4B
Riser 4C| Wattage | Class | Frequency | Voltage/Current |
|---|---|---|---|
| 1100W | Titanium | 50/60 Hz | 100–240 Vac/12—3.6 A |
| 1400W | Platinum | 50/60 Hz | 100–240 Vac/12—3.6 A |
| 1800W | Titanium | 50/60 Hz | 200–240 Vac/10 A |
| 2400W | Platinum | 50/60 Hz | 100–240 Vac/12—3.6 A |
| 2800W | Titanium | 50/60 Hz | 200–240 Vac/15.6 A |
| NOTE: If a system with AC 2400 W PSUs operates at low line 100-120 Vac, and then the power rating per PSU is degradedto 1400 W. | |||
| NOTE: If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 Vac, and then the power rating per PSU isdegraded to 1050 W. | |||
Dimensions & Weight
- Depth: 884.3 mm (34.50")
- Width: 482.0 mm (18.97")
- Height: 86.8 mm (3.41")
- Weight:
Fully Populated: 42.97 kg (94.73 lbs)
No Drives or PSU: 13.09 kg (28.85 lbs)
Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Additional Backplanes
Rear Drive cage
Risers Options
Memory
Storage Controllers
SFF SAS Drives
SFF SATA Drives
NVMe Drives
EDSFF E3.S NVMe SSD Drives
OCP NIC
Rail Kit
TPM
iDRAC9
Power Supply Units (PSU)
ECS Warranty
The request has been sent.
Thank you.
Price as Configured:
$0
Base Standard Capabilities
| Features | Technical Specifications | |
|---|---|---|
| Processor | Up to four 4th Generation Intel Xeon Scalable processor with up to 60 cores per processor and with optional Intel® QuickAssist Technology | |
| Memory | • 64 DDR5 DIMM slots, supports RDIMM 16 TB max, speeds up to 4800 MT/s • Supports registered ECC DDR5 DIMMs only | |
| Storage controllers | • Internal Controllers: PERC H965i, PERC H755, PERC H355, HBA355i • External Controller: PERC H965e • Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB • External HBA (non-RAID): HBA355e • Software Raid: S160 | |
| Drive Bays | Front bays: • Up to 8 x 2.5-inch SAS/SATA (HDD/SSD) drives max 122.88 TB • Up to 8 x EDSFF E3.S Gen5 NVMe (SSD) max 61.44 TB • Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives max 245.76 TB • Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) drives max 368.34 TB • Up to 16 x 2.5-inch SAS/SATA (HDD/SSD) drives + 8 x 2.5-inch NVMe (SSD) drives max 368.34 TB Rear bays: • Up to 2 x 2.5-inch SAS/SATA (HDD/SSD) max 30.72 TB | |
| Power Supplies | • 1100 W Titanium 100—240 VAC or 240 HVDC, hot swap redundant • 1400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant • 1800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant • 2400 W Platinum 100—240 VAC or 240 HVDC, hot swap redundant • 2800 W Titanium 200—240 VAC or 240 HVDC, hot swap redundant | |
| Cooling Options | • Air cooling • Optional Direct Liquid Cooling (DLC)* Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate. (There is no mention of a DLC in any other manuals. Since this server is so new the manuals might get updated. As of now, you will not see any DLC options untill they do update their manuals. | |
| Fans | • Standard (STD) fans • Up to 6 sets hot plug fans | |
| Dimensions | • Height – 86.8 mm (3.41 inches) • Width – 482 mm (18.97 inches) • Depth – 883.2 mm (34.77 inches) with bezel 869.2 mm (34.22 inches) without bezel | |
| Form Factor | 2U rack server | |
| Embedded Management | • iDRAC9 • iDRAC Direct • iDRAC RESTful API with Redfish • iDRAC Service Module • Quick Sync 2 wireless module | |
| Bezel | Optional LCD bezel or security bezel | |
| OpenManage Software* | • CloudIQ for PowerEdge plug in • OpenManage Enterprise • OpenManage Enterprise Integration for VMware vCenter • OpenManage Integration for Microsoft System Center • OpenManage Integration with Windows Admin Center • OpenManage Power Manager plugin • OpenManage Service plugin • OpenManage Update Manager plugin | |
| Mobility* | OpenManage Mobile | |
| OpenManage Integrations* | • BMC Truesight • Microsoft System Center • OpenManage Integration with ServiceNow • Red Hat Ansible Modules • Terraform Providers • VMware vCenter and vRealize Operations Manager | |
| Security | • Cryptographically signed firmware • Data at Rest Encryption (SEDs with local or external key mgmt) • Secure Boot • Secured Component Verification (Hardware integrity check) • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ | |
| Embedded NIC | 2 x 1 GbE LOM card (optional) | |
| Network Options | 1 x OCP card 3.0 (optional) Note: The system allows either LOM card or an OCP card or both to be installed in the system. | |
| GPU Options | N/A | |
| Ports | Front Ports • 1 x iDRAC Direct (Micro-AB USB) port • 1 x USB 2.0 • 1 x VGA | Rear Ports • 1 x Dedicated iDRAC ethernet port • 1 x USB 3.0 • 1 x USB 2.0 • 1 x Serial (optional) • 1 x VGA (optional for Direct Liquid Cooling configuration) |
| Internal Ports • 1 x USB 3.0 (optional) | ||
| PCIe | Up to eight PCIe slots: • Slot 1: 1 x16 Gen5 or 1 x8 Gen4 Full height, Half length • Slot 2: 1 x16 Gen5 or 1 x8 Gen4 Full height, Half length • Slot 3: 1 x16 Gen5 Low profile, Half length • Slot 4: 1 x16 Gen5 Full height, Half length • Slot 5: 1 x16 Gen5 Full height, Half length • Slot 6: 1 x16 Gen5 Low profile, Half length • Slot 7: 1 x16 Gen5 or 1 x8 Gen4 Full height, Half length • Slot 8: 1 x16 Gen5 or 1 x8 Gen4 Full height, Half length | |
| Operating System and Hypervisors | • Canonical Ubuntu Server LTS • Microsoft Windows Server with Hyper-V • Red Hat Enterprise Linux • SUSE Linux Enterprise Server • VMware ESXi | |
Spec Sheet 4
| Features | PowerEdge R860 | PowerEdge R840 | ||
|---|---|---|---|---|
| Processors | 4 x 4th Gen Intel® Xeon® Scalable Processors | 4 x 2nd Generation Intel® Xeon® Scalable Processor | ||
| Processor interconnect | Intel Ultra Path Interconnect (UPI) | Intel Ultra Path Interconnect (UPI) | ||
| Memory | ● 64 x DDR5 RDIMM ● Up to 4800 MT/s (1 DPC) / 4400 MT/s (2 DPC) |
● 48 x DDR4 DIMM RDIMM /LRDIMM ● 24 x PMem ( Intel Optane Persistent Memory) ● 12 x NVDIMM |
||
| Storage Controllers | ● PERC 11G: H755, H355 ● PERC 12G: H965i, H965e ● HBA 11: HBA355i, HBA355e ● BOSS-N1 ● Software RAID: S160 |
● PERC 9G: H330, H730p ● PERC 10G: H740p, H840 ● HBA 9: HBA330, 12 Gbps SAS HBA ● BOSS adapter ● Software RAID: S140 ● Internal Dual SD Module |
||
| Drive Bays | Front bays: ● 2.5 inches - 24Gb SAS, 6Gb SATA ● 2.5 inches - Gen3/4 NVMe ● EDSFF E3.S - NVMe Gen5 Rear bay: ● 2.5 inches - 24Gb SAS, 6Gb SATA, Gen3/4 NVMe |
Front bays: ● 2.5 inches - 24Gb SAS, 6Gb SATA ● 2.5 inches - Gen3/4 NVMe Rear bay: ● 2.5 inches - 12Gb SAS, 6Gb SATA |
||
| Power Supplies | ● AC (Platinum): 1400 W, 2400 W ● AC (Titanium): 1100 W, 1800 W, 2800 W |
● AC (Platinum): 750 W, 1100 W, 1600 W, 2000 W,
2400 W ● AC (Titanium): 1600 W, 2600 W ● LVDC @-48VDC Input: 1100 W |
||
| Cooling Options | ● Air Cooling | ● Air Cooling | ||
| Fans | Standard (STD) fans | Standard (STD) fans | ||
| Up to 6 sets (dual fan module) hot plug fans | Up to six hot plug fans | |||
| Dimension | Height: 86.8 mm (3.41 inches) | Height: 86.8mm (3.4 inches) | ||
| Width: 482 mm (18.97 inches) | Width: 434.0mm (17.08 inches) | |||
| Depth: 883.2 mm (34.77 inches) with bezel | Depth: 879.8 mm (34.63 inches) with bezel | |||
| Depth: 869.2 mm (34.22 inches) without bezel | Depth: 865.9 mm (34.09 inches) without bezel | |||
| Form Factor | 2U rack server | 2U rack server | ||
| Embedded Management | ● iDRAC9 ● iDRAC Direct ● iDRAC RESTful API with Redfish ● iDRAC Service Manual ● Quick Sync 2 wireless module |
● iDRAC9 ● iDRAC Direct ● Quick Sync 2 BLE/wireless module |
||
| Bezel | Optional LCD bezel or security bezel | Optional LCD bezel or security bezel | ||
| OpenManage Software | ● CloudIQ for PowerEdge plug in ● OpenManage Enterprise ● OpenManage Enterprise Integration for VMware vCenter ● OpenManage Integration for Microsoft System Center ● OpenManage Integration with Windows Admin Center ● OpenManage Power Manager plug-in ● OpenManage Services plug-in ● OpenManage Update Manager plug-in |
● OpenManage Enterprise ● OpenManage Power Center |
||
| Mobility | OpenManage Mobile | OpenManage Mobile | ||
| Integrations and Connections | OpenManage Integrations
● BMC Truesight ● Microsoft System Center ● OpenManage Integration with ServiceNow ● Red Hat Ansible Modules ● Terraform Providers ● VMware vCenter and vRealize Operations Manager |
OpenManage Integrations
● BMC Truesight ® ● Microsoft System Center ● Red Hat Ansible Modules ● VMware vCenter |
OpenManage Connections
● IBM Tivoli Netcool/ OMNIbus ● Micro Focus Operations Manager ● Nagios® Core & Nagios® XI |
|
| Security | ● Cryptographically signed firmware
● Data at Rest Encryption (SEDs with local or external key mgmt) ● Secure Boot ● Secured Component Verification (Hardware integrity check) ● Secure Erase ● Silicon Root of Trust ● System Lockdown (requires iDRAC9 Enterprise or Datacenter) ● TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ |
● Cryptographically signed firmware
● Secure Boot ● Secure Erase ● Silicon Root of Trust ● System Lockdown (requires iDRAC9 Enterprise or Datacenter) ● TPM 1.2/2.0, TCM 2.0 optional |
||
| Embedded NIC | 2 x 1GbE LOM card (optional) | 4 x 1GbE Network Daughter Card (optional) | ||
| Networking Options | OCP x16 (optional) Mezz 3.0 NOTE: The system allows either LOM card or OCP card or both to be installed in the system. |
NA | ||
| GPU Options | NA | Up to 2 doublewidth GPUs or up to 2 full height FPGAs | ||
| Ports | Front Ports ● 1 x USB 2.0 ● 1 x VGA ● 1 x Dedicated iDRAC micro-USB |
Rear Ports ● 1 x USB 2.0 ● 1 x iDRAC Direct/ethernet port ● 1 x USB 3.0 ● 1 x Serial port (optional) ● 1 x VGA |
Front Ports ● 2 x USB 2.0 ● 1 x USB 3.0 (optional) ● 1 x VGA ● 1 x Dedicated iDRAC micro-USB |
Rear Ports ● 2 x USB 3.0 ● 1 x iDRAC Direct/ethernet port ● 1 x Serial port (optional) ● 1 x VGA |
| Internal Port: 1 x USB 3.0 | Internal Port: 1 x USB 3.0 | |||
| PCIe | Up to 8 x PCIe slots ● 8 x PCIe Gen5 slots ● 4 x PCIe Gen4 slots |
Up to 6 x PCIe Gen3 slots | ||
| Operating System and Hypervisors | ● Canonical Ubuntu Server LTS
● Microsoft Windows Server with Hyper-V ● Red Hat Enterprise Linux ● SUSE Linux Enterprise Server ● VMware ESXi |
● Canonical Ubuntu Server LTS
● Citrix Hypervisor ● Microsoft Windows Server LTSC with Hyper-V ● Red Hat Enterprise Linux ● VMware ESXi |
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