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Home / Dell PowerEdge R-Series Rack Servers / Dell PowerEdge R550 Rack Server | Configurable

Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Bezel

Memory

3.5" HDD

2.5" HDD

2.5" SSD

1x OCP 3.0

Optical Drive

RAID Controllers

Boot Optimized Storage Subsystem (BOSS S2)

Internal Dual SD Card Module (IDSDM)

Internal USB Module

Trusted Platform Module (TPM)

iDRAC9 Lifecycle controller

Power Supplies

Select Warranty

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Price as Configured:
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Dell PowerEdge R550 Rack Server | Configurable

Dell

| CTO Servers

 

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Select Chassis

Select Processor

Intel 3rd Generation Xeon series processor, PCI-e 4 up to 64 lanes per socket.

Intel 3rd Generation Xeon

Supports up to (2) Processors
If (2) PCI-e cards are selected you must install (2) Processors.

Bezel (Optional)

Memory

Supports up to (16) RDIMM 2933 MT/s

3.5" HDD (Optional)

Supports up to (8) Drives

2.5" HDD (Optional)

Supports up to (8) Drives with the (8) 2.5" Chassis
If the (8) 3.5" Chassis was selected, these drive will be installed in a 3.5" HD Carrier

2.5" SSD (Optional)

Supports up to (8) Drives with the (8) 2.5" Chassis
If the (8) 3.5" Chassis was selected, these drive will be installed in a 3.5" HD Carrier

1x OCP 3.0 (Optional)

Optical Drive (Optional)

RAID Controllers (Optional)

Embedded S150 software RAID

Boot Optimized Storage Subsystem (BOSS S2) (Optional)

Supports up to (2) M.2 SSD Drives
Comes with a BOSS S2 Riser Card
Please select the controller and (1) or (2) M.2 SSD's

Internal Dual SD Card Module (IDSDM) (Optional)

The Interal USB and IDSDM use the same slot. Only one can be installed

Internal USB Module (Optional)

The Interal USB and IDSDM use the same slot. Only one can be installed

Trusted Platform Module (TPM) (Optional)

iDRAC9 Lifecycle controller (Optional)

Power Supplies

Supports (2) PSU

Select Warranty

Helpful Tip: Once desired configuration is selected click "Add to Cart".
From the cart page you can submit a submit a quote request for best pricing

Quick Specs
Form Factor:

2U rack server

Processor | Max: 24 Cores

2x 3rd Gen Intel Xeon Scalable

Memory | Max: 1TB

16 ECC DDR4 RDIMM 2933Mhz

Networking NIC:

2x 1GbE LOM BCM5720 LAN controller

Networking OCP:

1x OCP 3.0 (optional)

Storage | Max: 128TB

16 x 2.5-inch SAS/SATA (HDD/SSD) Max: 122.88TB
8 x 3.5-inch SAS/SATA (HDD/SSD) Max: 128TB
8 x 2.5-inch SAS/SATA (HDD) Max: 61.44TB

Storage Controller:

S150 (SW RAID) SATA
Internal: H345, H355, HBA355i, H745, H755
External: H840, HBA355e

PCIe Slots:

3 x16 Gen4 low profile
1 x8 Gen3 (x4 lane) low profile

GPU:

None

Boot Options:

BOSS-S2
IDSDM
Internal USB 3.0

Remote Management:

iDRAC9

Other Versions

(Click to View)

Ideal for:
  • Corporate IT
  • Virtualization

Built on 3rd Generation Intel® Xeon® Scalable processors, the Dell EMC PowerEdge R550 delivers added configuration flexibility for organizations prioritizing exceptional value.

Supported Memory Options

The PowerEdge R550 supports up to 16 DIMMs, reaching up to 1TB of total memory at speeds up to 3200 MT/s. It uses registered DIMMs (RDIMMs), which reduce memory loading via a buffer and enable greater density for maximum platform memory capacity.

Capacity DIMM Type Config DRAM DIMM Max Speed Rated Voltage
8GB RDIMM 1R x 8 8GB 3200 MT/s 1.2 V
16GB RDIMM 2R x8 8 GB 3200 MT/s 1.2 V
32GB RDIMM 2R x8 16GB 3200 MT/s 1.2 V
64GB RDIMM 2R x4 16 GB 3200 MT/s 1.2 V
Expansion Configurations Options

The Dell PowerEdge R550 rack server supports PCIe cards that plug directly into the system board, with no riser card support in this configuration. Check the PCI table below to find the right slot for the adapter you're installing.

See the manuals for details on slot priority and the types of adapters and expanders supported.

Image of the PCIe slots on the Dell R550 Rack Server
Configurations Expansion card risers PCIe Slots Controlling processor Height Length Slot width
Config 0 N/A 1 Processor 1 Low profile Half length x16
2 PCH Low profile Half length x4
5 Processor 2 Low profile Half length x16
6 Processor 2 Low profile Half length x16
Config 0-1 N/A 1 Processor 1 Low profile Half length x16
2 PCH Low profile Half length x4
Networking LOM + OCP 3.0

The Dell PowerEdge R550 includes an embedded LOM board with 2x 1Gb ports via a BCM5720 LAN controller, plus the option to expand networking further with an Open Compute Project 3.0 card

Below are the specs for the OCP 3.0

OCP 3.0
- OCP 3.0
Form factor SFF and LFF
PCIe Gen Gen4
Max PCIe width X16
Max of ports 4
Port type BT/SFP/SFP+/SFP28/SFP56
Max port speed 100Gbe
NC-SI Yes
WoL Yes
Power consumption 15 W – 150 W
Image of the OCP networking slot in the Dell R550 Rack Server
External storage

Dell's RAID controller lineup includes the fPERC solution, offering a base RAID hardware controller that bypasses PCIe slot usage through a compact, high-density connector to the base planar.

The 15G PERC controller lineup leans heavily on the prior family, carrying forward the Value Performance tiers. New to the lineup is the Harpoon-based Premium tier, a high-end option built to drive stronger IOPS and enhanced SSD performance.

Image of the Front PERC Storage Controller on the R550 Dell Rack Server
Performance Level Controller & Description
Entry S150 (SATA)
SWRAID
Value H345, H355, HBA355 (Internal/External)
Value Performance H745, H755
External Expansions H840, HBA355e
Boot Options
The Interal Dual SD Module for the R550 Rack Server by Dell
IDSDM

The IDSDM and internal USB module can't be used together — only one can be installed, requiring a choice between the two. The IDSDM works well for booting a hypervisor OS.

Internal USB for the R550 Rack Server by Dell
Internal USB

The internal USB and IDSDM share a single slot, so only one can be installed at a time — a choice between the two is necessary.

BOSS Riser Kit and Card.
BOSS

The BOSS M.2 drives use a dedicated BOSS riser kit supporting one riser card with 2 M.2 SATA drives — built to boot a full OS system without needing to allocate a separate drive.

Power & Dimensions
Power Supply Units (PSU)
Form factor Output Class
Redundant 60 mm 600 W AC Platinum
700 W Mixed Mode Titanium
800 W AC Platinum
1100 W Mixed Mode Titanium
1100 W -48V N/A
1400 W Mixed Mode Platinum
Dimensions & Weight
  • Length: 721.72 mm (27.40")
  • Width: 482.0mm (18.97")
  • Height: 86.8mm (3.41")
  • Weight:
    • 16x 2.5" - 23.84 kg (52.55 lbs)
    • 8x 2.5" - 20.44 kg (45.06 lbs)
    • 8x 3.5" - 24.80 kg (54.67 lbs)

Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Bezel

Memory

3.5" HDD

2.5" HDD

2.5" SSD

1x OCP 3.0

Optical Drive

RAID Controllers

Boot Optimized Storage Subsystem (BOSS S2)

Internal Dual SD Card Module (IDSDM)

Internal USB Module

Trusted Platform Module (TPM)

iDRAC9 Lifecycle controller

Power Supplies

Select Warranty

The request has been sent.
Thank you.

Price as Configured:
$0

Error Submitting Cart. Please get in touch with us for support.

Please select all the mandatory items in the configuration list before submitting the cart.

One or more items in your cart has no price. This will be submitted as a "Request for a Quote".

Base Standard Capabilities

FeatureTechnical Specification
ProcessorUp to two 3rd Generation Intel Xeon Scalable processors with up to 24 cores per processor
Memory
  • 16 DDR4 DIMM slots, supports RDIMM 1 TB max, speeds up to 2933 MT/s
  • Supports registered ECC DDR4 DIMMs only
Storage controllers
  • Internal Controllers: PERC H345, PERC H355, HBA355i, PERC H745, PERC H755, S150
  • Internal Boot: Internal Dual SD Module, USB, Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2x M.2 SSDs
  • External PERC (RAID): PERC H840
  • External HBA (non-RAID): HBA355e
Drive baysFront bays:
  • Up to 16 x 2.5-inch SAS/SATA (HDD/SSD) max 122.88 TB
  • Up to 8 x 3.5-inch SAS/SATA (HDD/SSD) max 128 TB
  • Up to 8 x 2.5-inch SAS/SATA (HDD) max 61.44 TB
Power supplies
  • 600W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant
  • 800W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant
  • 1100W -48Vdc hot swap redundant (CAUTION: only works with -48Vdc to -60Vdc power input)
Cooling optionsAir Cooling
Fans
  • Standard (STD) fans
  • Up to five cabled fans
DimensionsHeight – 86.8 mm (3.41 inches)
Width – 482 mm (18.97 inches)
Depth – 721.69 mm (28.72 inches) with bezel
685.78 mm (27.00 inches) without bezel
Form Factor2U rack server
Embedded mgmt
  • iDRAC9
  • iDRAC Direct
  • iDRAC RESTful API with Redfish
  • iDRAC Service Manual
  • Quick Sync 2 wireless module
BezelOptional LCD bezel or security bezel
OpenManage™ Software
  • OpenManage Enterprise
  • OpenManage Power Manager plugin
  • OpenManage SupportAssist plugin
  • OpenManage Update Manager plugin
MobilityOpenManage Mobile
Integrations and ConnectionsOpenManage Integrations
  • BMC Truesight
  • Microsoft System Center
  • Red Hat Ansible Modules
  • VMware vCenter and vRealize Operations Manager
OpenManage Connections
  • IBM Tivoli Netcool/OMNIbus
  • IBM Tivoli Network Manager IP Edition
  • Micro Focus Operations Manager
  • Nagios Core
  • Nagios XI
Security
  • Cryptographically signed firmware
  • Secure Boot
  • Secure Erase
  • Silicon Root of Trust
  • System Lockdown (requires iDRAC9 Enterprise or Datacenter)
  • TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
Embedded NIC2 x 1 GbE LOM
Network Options1 x OCP 3.0 (optional)
GPU OptionsNot supported
PortsFront Ports:
  • 1 x USB 2.0
  • 1 x VGA
  • 1 x iDRAC Direct (Micro-AB USB) port
Internal Ports
  • 1 x USB 3.0 (optional)
Rear Ports
  • 1 x USB 2.0
  • 1 x USB 3.0
  • 1 x VGA
  • 1 x Serial port (Optional)
  • 1 x iDRAC ethernet port
PCIe3 x PCIe Gen4 slots + 1 x PCIe Gen3 slot
  • 3 x16 Gen4 low profile
  • 1 x8 Gen3 (x4 lane) low profile
Operating System and Hypervisors
  • Canonical Ubuntu Server LTS
  • Citrix Hypervisor
  • Microsoft Windows Server with Hyper-V
  • SUSE Linux Enterprise Server
  • Red Hat Enterprise Linux
  • VMware ESXi

Spec Sheet 4

Feature PowerEdge R550 PowerEdge R540
Processor Maximum two 3rd Generation Intel® Xeon® Scalable processors with maximum 24 cores per processor. Maximum two 2nd Generation Intel® Xeon® Scalable processors with maximum 20 cores per processor.
Processor Interconnect Intel Ultra Path Interconnect (UPI) Intel Ultra Path Interconnect (UPI)
Memory 16 DDR4 DIMM slots, Supports RDIMM 1 TB, up to 3200 MT/s 16 DDR4 DIMM slots, Supports registered ECC DDR4 DIMMs only, Up to 2666 MT/s
Storage Drives Front bays:
● Up to 16 x 2.5-inch SAS/SATA (HDD/SSD)
● Up to 8 x 2.5-inch SAS/SATA(HDD/SSD)
● Up to 8 x 3.5-inch SAS/SATA (HDD/SSD)		 Front bays:
● Up to 12 x 3.5-inch SAS/SATA HDD max 168 TB
● DVD-ROM, DVD+RW (optional) Rear bays:
● Up to 2 x 3.5-inch SAS/SATA HDD max 28 TB
Storage Controllers Internal Controllers: PERC H345, PERC H355, PERC H745, PERC H755, HBA355i
External Controllers: PERC H840, HBA355e
Internal Boot: Internal Dual SD Module, Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs, USB
Software RAID: S150		 Internal Controllers: PERC H330, H730P, H740P, HBA330
External Controllers: H840, 12 Gbps SAS HBA
Software RAID: S140
Internal Boot: Boot Optimized Storage Subsystem (BOSS): HWRAID 2 x M.2 SSDs 240GB, 480 GB,
Internal Dual SD Module
PCIe Slots 3 x Gen 4 PCIe slots
1 x Gen 3 PCIe slot		 Non-rear storage configuration
● 1 x full height/full length
● 1 x half height/half length (2U Right riser) slots
● 3 x half height/half length slots Rear storage config
● 1 x half height/half length (1U left riser)
● 1 x half height/half length or 1full height/half length (1U right riser)
Embedded NIC (LOM) 2 x 1GbE LOM 2 x 1GbE LOM
Networking options (OCP 3.0) OCP 3.0 2 x 1GbE LOM+ (optional) LOM Riser 2 x 1GbE, or 2 x 10GE SFP+, or 2 x 10GE BaseT
USB Ports Front Ports
● 1 x iDRAC Direct (Micro-AB USB) port
● 1 x USB 2.0
● 1 x VGA Rear Ports
● 1 x USB 2.0
● 1 x Dedicated iDRAC ethernet port
● 1 x Serial (optional)
● 1 x USB 3.0
● 1 x VGA Internal Ports
● 1 x USB 3.0 (optional)		 Front Ports
● 1 x Dedicated iDRAC direct USB
● 1 x USB 2.0
● 1 x Video Rear Ports
● 1 x Dedicated iDRAC network port
● 1 x Serial
● 2 x USB 3.0
● 1 x Video
Rack Height 2U 2U
Power Supplies ● 600 W Platinum 100–240 VAC/ 240 VDC
● 700 W Titanium 200–240 VAC/240 VDC
● 800 W Platinum 100–240 VAC/ 240 VDC
● 1100 W DC/-48–(-60) V
● 1100 W Titanium 100–240 VAC/ 240 VDC		 ● 495 W Platinum
● 750 W Platinum
● 750 W 240HVDC Platinum
● 1100 W Platinum
● 1100 W 380 V HDC Platinum
● Hot plug power supplies with full redundancy option
System Management ● iDRAC9
● iDRAC Direct
● iDRAC Service Module
● Quick Sync 2 wireless module		 ● iDRAC9
● iDRAC RESTful API with Redfish
● iDRAC Direct
● Quick Sync 2 BLE/wireless module
Availability ● Hot-plug Drives
● Hot-plug Redundant Power Supplies
● Internal Dual SD Module (IDSDM)		 ● Hot-plug Drives
● Hot-plug Redundant Power Supplies
● Internal Dual SD Module (IDSDM)

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