Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Cooling Options
E-Core Memory
P-Core Memory
LFF SATA
SFF SATA
SFF U.2 NVMe G4
EDSFF E3.S G5
Boot Options
Storage Controllers
GPU Options
Open Compute Program (OCP) 3.0
Riser Configurations
Left Control Panel Options
Power Supply Units
ECS Warranty
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Price as Configured:
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Price as Configured:
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Dell PowerEdge R470 Rack Server | Configurable
Quick Specs
1U rack server
Processor | Max: 144 E-Cores / 88 P-Cores1x Intel Xeon 6 E-Core / P-Core
Memory | Max: 8TB16 ECC DDR5 RDIMM 6400Mhz
Supports registered ECC DDR5 DIMMs only
4x 3.5" (SATA)
8x 2.5" (SAS/SATA/NVMe)
10x 2.5" (SAS/SATA/NVMe)
8x EDSFF E3.S NVMe (G5) Max:
491.52TB
16x EDSFF E3.S NVMe (G5) Max: 983.04TB
Up to 2 x EDSFF E3.S Gen5 NVMe (Mandatory for LFF Chassis)
Storage Controller:H365i, H965i,
H965e, HBA465e
BOSS-N1
BOSS-N1 DC-MHS
USB
Front I/O supports 2x OCP 3.0
Rear I/O Supports 2x OCP 3.0 + 2x 1GbE LOM
iDRAC
PCIe Slots:Front I/O, 2 x16 (G5)
4 x16 Gen5 PCIe slots
Up to 4 x 75 W SW
(Click to View)
Ideal for:
- Cloud-Native Applications
- Database
- Virtualization
The Dell PowerEdge R470 is a 1U, single-socket rack server engineered for high-performance computing with optimal power efficiency and balanced performance, driving cost savings and boosting data center productivity. Its advanced design maximizes rack utilization by offering more cores in a single socket enabling better performance in a smaller footprint while minimizing energy consumption. This makes it ideal for workloads like cloud scale web and app microservices, data services, virtualization, and scale-out database
Purpose-built for enterprise and scalable infrastructures, the PowerEdge R470 seamlessly integrates into existing environments. Equipped with an Intel® Xeon® processor with E-cores that are tailored for energy efficiency and performance-per-watt, offering both improved power efficiency and higher rack density. With GPU support, it further enhances computational power while reducing overall operational costs, especially on energy consumption impact.
The server is available in rear I/O hot aisle and front I/O cold aisle configurations, with the front I/O cold aisle improving serviceability, reducing maintenance time, and enhancing overall efficiency, reliability, and uptime. Dell’s Smart Power and Cooling Technology, optimized for air cooling, significantly reduces energy consumption, delivering long-term operational savings and supporting sustainability goals
Security is integrated into every phase of the PowerEdge lifecycle, including protected supply chain and factoryto-site integrity assurance. The Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor Authentication (MFA) and role-based access controls safeguard trusted operations.
The Intel® Xeon® 6 series of processors offers both E-Core and P-Core processors. Mixing of CPUs is not supported.
Xeon E-Cores
The Intel® Xeon® 6 series single threaded processor stack is comprised entirely of efficiency cores (E-Cores) providing ultra-high core counts optimized for power efficient operations.
• Optimized for single-threaded workloads
• Up to 144 cores at 330 W TDP
• 6400 MT/s DDR5 memory
• Up to four 24 GT/s UPI 2.0
• PCIe 5.0 with up to 88 lanes per CPU
• Security features (SGX)
Xeon P-Cores
The Intel® Xeon® 6 series processor stack is comprised entirely of performance cores (P-Cores), providing high core counts optimized for power and performance.
• Optimized for multi-threaded applications and workloads
• Up to 86 cores at 350 W TDP
• 6400 MT/s DDR5 memory
• Up to four 24 GT/s UPI 2.0
• PCIe 5.0 with up to 88 lanes per CPU
• Security features (SGX)
1U Ext Heatsink | TDP < 250 W
Remote Heatsink | TDP >= 350 W
Air Shroud for 1U Air Cooling

- Supports up to 4 set Standard (STD) hot-swappable cooling fans, each consisting of a dual fan module.
- Supports up to 4 set high-performance silver (HPR SLVR) hot-swappable cooling fans, each consisting of a dual fan module.
TDP up to 250w
- Extended heatsink and shroud can support CPU TDP up to 250 W.
TDP 350w
- Remote heatsink and HPR SLVR fan is required for 350 W CPU TDP
The Dell PowerEdge R470 holds up to 16x DDR5 DIMMs
| DIMM type | Rank | Capacity | DIMM voltage and speed | E-core processor | P-core processor | ||
|---|---|---|---|---|---|---|---|
| 1 DIMM per channel (DPC) | 2 DIMM per channel (DPC) | 1 DIMM per channel (DPC) | 2 DIMM per channel (DPC) | ||||
| RDIMM | 1R | 16 GB | DDR5 (1.1 V), 6400 MT/s | N/A | N/A | Up to 6400 MT/s | N/A |
| 2R | 32 GB | DDR5 (1.1 V), 6400 MT/s | Up to 6400 MT/s | N/A | Up to 6400 MT/s | Up to 5200 MT/s | |
| 64 GB | DDR5 (1.1 V), 6400 MT/s | Up to 6400 MT/s | Up to 5200 MT/s | Up to 6400 MT/s | Up to 5200 MT/s | ||
| 96 GB | DDR5 (1.1 V), 6400 MT/s | N/A | N/A | Up to 6400 MT/s | Up to 5200 MT/s | ||
| 128 GB | DDR5 (1.1 V), 6400 MT/s | N/A | N/A | Up to 6400 MT/s | Up to 5200 MT/s | ||
| 8R | 256 GB | DDR5 (1.1 V), 6400 MT/s | N/A | N/A | N/A | Up to 5200 MT/s | |
Front H965i DC-MHS
- RAID: 0, 1, 5, 6, 10, 50, and 60
- Non–RAID: Yes
- Host bus type: PCIe 4.0 x16
- Processor: Broadcom RAID-on-chip, SAS4116W chipset
- Power Backup unit: Battery
- Cache memory: 8 GB DDR4 3200 MT/s cache
- Cache function: Write-back, read-ahead, write-through, always write-back, no read-ahead
- Supported Drive Types: 22.5 Gbps SAS, 12 Gbps SAS, and 6 Gbps SATA/SAS. Gen3 (8 GT/s) and Gen4 (16 GT/s) NVMe
-
maximum SAS/SATA: w/o SAS Expander: 16 drives per controller
With SAS Expander: 240 SAS/SATA -
maximum NVMe: w/o PCIe Switch Expander: 8 drives per controller
With PCIe Switch Expander: 24 NVMe
Front H365i DC-MHS
- RAID: 0, 1, and 10
- Non–RAID: Yes
- Host bus type: PCIe 4.0 x8 @ 16Gbps
- Processor: Broadcom RAID-on-chip, SAS4016 chipset
- Power Backup unit: No
- Cache memory: No
- Cache function: Write-through
- Supported Drive Types: 22.5 Gbps SAS, 12 Gbps SAS, and 6 Gbps SATA/SAS. Gen3 (8 GT/s) and Gen4 (16 GT/s) NVMe
-
Maximum SAS/SATA: w/o SAS Expander: 16 drives
w/ SAS Expander: Depends on your PowerEdge server model. -
Maximum NVMe: w/o PCIe Switch Expander: 8/16 drives
w/ PCIe Switch Expander: 32 drives
The system supports either Front I/O configuration (system with front risers) or Rear I/O configuration (system with rear risers).
RF1c Riser
RF1d Riser
R2k Riser
R2q Riser
R2t Riser
R2u Riser
R2v Riser
R4a Riser
R4b Riser
Rear 2 x E3.S EDSFF
| Config No. | Riser configuration | No. of Processors | PERC type supported | Rear storage possible |
|---|---|---|---|---|
| 0 | NO RSR | 1 | Front PERC | No |
| 1 | R2u + R4a | 1 | Adpt PERC | 2 x E3.S EDSFF |
| 2 | RF1c | 1 | N/A | No |
| 3 | RF1d (front OCP cage) | 1 | N/A | No |
| 4 | Rf1c + R2t + R4b | 1 | N/A | No |
| 5 | Rf1d + R2t + R4b | 1 | N/A | No |
| 6 | R2q + R4b | 1 | Front PERC | No |
| 7 | R2k + R4a | 1 | Front PERC | No |
| 8 | R2v + R4a | 1 | Front PERC | No |
Intel Xeon 6 processor P-core R1S processors provide a higher number of PCIe lanes compared to standard Intel® Xeon 6 processor P-core processors.
Notes:- Risers RC4, RC5, and RC7 support only R1S processors.
- Risers RC0, RC1, RC2, RC3, RC6, and RC8 support both R1S and standard processors.
- Riser F1c and riser R2t supports DPU cards.

- Riser RF1d support up to 2x OCP 3.0 slots
- Install OCP Blank or Riser Blank if the R1Fb is not installed.
- 1 Dedicated Slot
- Riser R2k supplys one more OCP 3.0 Slot
- 1 GbE x 4
- 10 GbE x 2 or 4
- 25 GbE x 2 or 4
- 100 GbE x 2
I/O Supports either front or back, not both.
OCP is also supported in front of the system for some configurations, called the Floating OCP Paddle Card (FLOP). Additionally, the Front I/O OCP supports both internal latch and thumbscrew versions, providing flexibility in installation and maintenance.
BOSS-N1 DC-MHS
BOSS-N1 Interposer
Internal USB Boot
Secondary blank (Default)
Secondary w/ optional KVM
Secondary w/ optional Quick Sync 2.0
Not sure what power supply to use. Dell has a calculator for you
| Form factor | Output | Power cord |
|---|---|---|
| 60 mm | 800 W mixed mode | C13 |
| 1100 W mixed mode | C13 | |
| 1400 W -48 VDC | Lotes RN5T2 | |
| 1500 W mixed mode | C13 | |
| 1500 W mixed mode 277Vac & HVDC | APP/Saf-D-Grid |
- Width: 19"
- Length: 32.09"
- Height: 1.69"
- Diskless 17 kg (37 lbs)
- 4 x 3.5" SATA 18.78 kg (41.40 pound)
- 8 x 2.5" SAS/SATA drives 17.03 kg (37.54 pound)
- 8 x EDSFF E3.S 19.11 kg (42.13 pound)
- 10 x 2.5" SAS/SATA 17.53 kg (38.64 pound)
- 16 x EDSFF E3.S drives 17.66 kg (38.93 pound)
Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Cooling Options
E-Core Memory
P-Core Memory
LFF SATA
SFF SATA
SFF U.2 NVMe G4
EDSFF E3.S G5
Boot Options
Storage Controllers
GPU Options
Open Compute Program (OCP) 3.0
Riser Configurations
Left Control Panel Options
Power Supply Units
ECS Warranty
The request has been sent.
Thank you.
Price as Configured:
$0
Spec Sheet 4
| Feature | Technical Specifications |
|---|---|
| Processor |
One Intel® Xeon 6 E-core processor with up to 144 cores per processor or One Intel® Xeon 6 P-core processor with up to 86 Cores with R1S option |
| Memory |
|
| Storage Controllers |
|
| Drive Bays |
Front bays:
|
| Power Supplies |
|
| Cooling Options | Air cooling |
| Fans | Up to 4 sets (dual fan module) hot swappable fans |
| Dimensions |
|
| Form Factor | 1U rack server |
| Embedded Management |
|
| Bezel | Optional security bezel |
| Security |
|
| OCP Network Options |
Up to two OCP NIC card 3.0: Two slots on the front or two slots on the rear (optional) Slot Numbers: 2, 5, 31, 32 |
| Embedded NIC | 1 Gb dedicated BMC Ethernet port |
| GPU Options | Up to 4 x 75W SW |
| DPU Options | NVIDIA BlueField-3 2 x 200 GbE B3220 |
| Ports |
Front Ports:
|
| PCIe |
Up to 4 Gen5 PCIe slots (x16 connectors)
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