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Dell PowerEdge R670 Rack Server CTO

Price: Configure for Price

Brand:

Dell

Type:

CTO Servers

Condition:

ECS Refurbished & Tested

Warranty:

ECS 1 Year Hardware Warranty

-PLEASE CONTACT FOR CUSTOM CONFIGURATIONS. DISK SHELVES, COMPLETE CONFIGURATIONS & TURN KEY SYSTEMS AVAILABLE.

-SPARE PARTS AVAILABLE FOR EACH MODEL. PLEASE ASK FOR PRICING ON SPARE DISK, CONTROLLERS, POWER SUPPLIES, NICs, HBAs, SFPs, Cables, etc.

Quick Specs

Form Factor:

1U rack server

Processor | Max: 144 E-Cores / 88 P-Cores

2x Intel Xeon 6 E-Core / P-Core

Memory | Max: 8TB

32 ECC DDR5 RDIMM 6400Mhz
Supports registered ECC DDR5 DIMMs only

Storage | Max: 307.2TB

8x 2.5" (SAS/SATA/NVMe)
10x 2.5" (SAS/SATA/NVMe)
8x EDSFF E3.S NVMe (G5) Max: 122.88TB
16x EDSFF E3.S NVMe (G5) Max: 245.76TB
20x EDSFF E3.S NVMe (G5) Max: 307.2TB

Rear Drives | Max: 30.72TB

Up to 2 x EDSFF E3.S Gen5 NVMe (20 EDSFF Chassis Only)

Storage Controller:

H365i, H965i, H975i
H965e, HBA465e

Boot Options:

BOSS-N1
BOSS-N1 DC-MHS
USB

Networking Options (NOC):

Front I/O supports 2x OCP 3.0
Rear I/O Supports 2x OCP 3.0 + 2x 1GbE LOM

Remote Management:

iDRAC10

PCIe Slots:

Front I/O, 2 x16 (G5)
3 x16 (G5) or 2 x8 (G5)

GPU:

Up to 3 x 75 W SW

Other Versions:

Ideal for:

Cloud-Native Applications
Database
Virtualization

The Dell PowerEdge R670 is a 1U, dual-socket rack server designed for high-performance computing with optimal power efficiency and balanced performance to boost your data center productivity. It balances advanced computing power with virtualization, cloud-native applications, all-flash SDS, hyperscale workloads, and scale out databases

Max Performance:

The PowerEdge R670, designed for enterprise scalability, integrates seamlessly with existing systems. Powered by two Intel® Xeon® 6 processors with E-cores and P-cores, it delivers 1.69x better performance per watt than previous models, enhancing power efficiency and rack density. GPU support boosts computational power while maintaining low energy consumption.

Air-cooled at peak performance

The PowerEdge R670 offers rear I/O hot aisle and front I/O cold aisle configurations. The front I/O cold aisle enhances serviceability, reduces maintenance time, and improves efficiency, reliability, and uptime, supporting sustainability by optimizing cooling and energy use. Dell’s Smart Power and Cooling Technology, tailored for air cooling, significantly cuts energy consumption for long-term operational savings.

Cyber Resilient Architecture for Zero Trust IT environment & operations

Security is integrated into every phase of the PowerEdge lifecycle, including protected supply chain and factory-to-site integrity assurance. The Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor Authentication (MFA) and role-based access controls safeguard trusted operations.

Intel Xeon 6th Gen

The Intel® Xeon® 6 series of processors offers both E-Core and P-Core processors. Mixing of CPUs is not supported.

Xeon E-Cores

The Intel® Xeon® 6 series single threaded processor stack is comprised entirely of efficiency cores (E-Cores) providing ultra-high core counts optimized for power efficient operations.

• Optimized for single-threaded workloads

• Up to 144 cores at 330 W TDP

• 6400 MT/s DDR5 memory

• Up to four 24 GT/s UPI 2.0

• PCIe 5.0 with up to 88 lanes per CPU

• Security features (SGX)

Xeon P-Cores

The Intel® Xeon® 6 series processor stack is comprised entirely of performance cores (P-Cores), providing high core counts optimized for power and performance.

• Optimized for multi-threaded applications and workloads

• Up to 86 cores at 350 W TDP

• 6400 MT/s DDR5 memory

• Up to four 24 GT/s UPI 2.0

• PCIe 5.0 with up to 88 lanes per CPU

• Security features (SGX)

Cooling Options

1U Heatsink | TDP < 270 W

L-Type Heatsink | TDP >= 270 W

Liquid Cooling (DLC)

Standard Fan

Supports up to 4 set Standard (STD) hot-swappable cooling fans, each consisting of a dual fan module.

High-Performance (Silver) Fan

Supports up to 4 set high-performance silver (HPR SLVR) hot-swappable cooling fans, each consisting of a dual fan module.

Please view the "Table 54. Thermal restriction matrix" in the tech manual below for more details.

Memory Options

The Dell PowerEdge R760 holds up to 32x DDR5 DIMMs

DIMM type	Rank	Capacity	DIMM voltage and speed	E-core processor		P-core processor
				1 DIMM per channel (DPC)	2 DIMM per channel (DPC)	1 DIMM per channel (DPC)	2 DIMM per channel (DPC)
RDIMM	1R	16 GB	DDR5 (1.1 V), 6400 MT/s	N/A	N/A	Up to 6400 MT/s	N/A
RDIMM	2R	32 GB	DDR5 (1.1 V), 6400 MT/s	Up to 6400 MT/s	N/A	Up to 6400 MT/s	Up to 5200 MT/s
RDIMM	2R	64 GB	DDR5 (1.1 V), 6400 MT/s	Up to 6400 MT/s	Up to 5200 MT/s	Up to 6400 MT/s	Up to 5200 MT/s
		96 GB	DDR5 (1.1 V), 6400 MT/s	N/A	N/A	Up to 6400 MT/s	Up to 5200 MT/s
		128 GB	DDR5 (1.1 V), 6400 MT/s	N/A	N/A	Up to 6400 MT/s	Up to 5200 MT/s
		256 GB	DDR5 (1.1 V), 6400 MT/s	N/A	N/A	N/A	Up to 5200 MT/s

Storage Controllers (Internal)

Front H965i DC-MHS

RAID: 0, 1, 5, 6, 10, 50, and 60
Non–RAID: Yes
Host bus type: PCIe 4.0 x16
Processor: Broadcom RAID-on-chip, SAS4116W chipset
Power Backup unit: Battery
Cache memory: 8 GB DDR4 3200 MT/s cache
Cache function: Write-back, read-ahead, write-through, always write-back, no read-ahead
Supported Drive Types: 22.5 Gbps SAS, 12 Gbps SAS, and 6 Gbps SATA/SAS. Gen3 (8 GT/s) and Gen4 (16 GT/s) NVMe
maximum SAS/SATA: w/o SAS Expander: 16 drives per controller
With SAS Expander: 240 SAS/SATA
maximum NVMe: w/o PCIe Switch Expander: 8 drives per controller
With PCIe Switch Expander: 24 NVMe

Front H975i DC-MHS

RAID: 0, 1, 5, 6, 10, 50, and 60
Non–RAID: Yes
Host bus type: PCIe 5.0 x16
Processor: Broadcom RAID-on-chip, SAS5132W chipset
Power Backup unit: Supercapacitor
Cache memory: Integrated RAID cache
Cache function: Write-back, write-through, always write-back, no read-ahead
Supported Drive Types: Gen3 (8 GT/s), Gen4 (16 GT/s), and Gen5 (32 GT/s) NVMe
maximum SAS/SATA: Not supported
maximum NVMe: 32 drives

Front H365i DC-MHS

RAID: 0, 1, and 10
Non–RAID: Yes
Host bus type: PCIe 4.0 x8 @ 16Gbps
Processor: Broadcom RAID-on-chip, SAS4016 chipset
Power Backup unit: No
Cache memory: No
Cache function: Write-through
Supported Drive Types: 22.5 Gbps SAS, 12 Gbps SAS, and 6 Gbps SATA/SAS. Gen3 (8 GT/s) and Gen4 (16 GT/s) NVMe
Maximum SAS/SATA: w/o SAS Expander: 16 drives
w/ SAS Expander: Depends on your PowerEdge server model.
Maximum NVMe: w/o PCIe Switch Expander: 8/16 drives
w/ PCIe Switch Expander: 32 drives

Riser Configurations

The system supports either Front I/O configuration (system with front risers) or Rear I/O configuration (system with rear risers).

RF1a

RF1b

R2b Riser

R2c Riser

R2e Riser

R2f Riser

R2g Riser

R4a Riser

R4b Riser

Riser configurations (RC)	Expansion card risers	PCIe Slots	Form factor	Controlling processor	Slot's electrical physical/bandwidth connector
RC0: 1x8(x16) + OCP(3)x1xBOSS	OCP	5	OCP	Processor 0	PCIe Gen5 x16 (OCP 4C+ connector)
RC0: 1x8(x16) + OCP(3)x1xBOSS	BOSS	3	BOSS	Processor 0	PCIe Gen3 x4 (IC connector)
RC1 (front): 2x16FH(G5)	RF1a	31	Full height	Processor 0	PCIe Gen5 x16 (x16 connector)
	RF1a	32	Full height	Processor 1	PCIe Gen5 x16 (x16 connector)
	BOSS	34	BOSS	Processor 0	PCIe Gen3 x4 4 (1C connector)
RC2 (front): 2x16OCP(G5)	RF1b	31	OCP	Processor 0	PCIe Gen5 x16 (OCP 4C+ connector)
	RF1b	32	OCP	Processor 1	PCIe Gen5 x16 (OCP 4C+ connector)
	BOSS	34	BOSS	Processor 0	PCIe Gen3 x4 (IC connector)
RC5 (rear): 2x16FH(G5) + 1(x8 / x16 OCP)	R2b	1	Full height	Processor 1	PCIe Gen5 x16 (x16 connector)
	R4b	4	Full height	Processor 0	PCIe Gen5 x16 (x16 connector)
	BOSS	3	BOSS	Processor 0	PCIe Gen3 x4 (1C connector)
	OCP	5	OCP	Processor 0	PCIe Gen5 x16 (OCP 4C+ connector)
RC6 (rear): 2x16LP(G5) + 1x16OCP(G5) + 1 x8/x16 OCP(G5)	R2f	1	Low Profile	Processor 1	PCIe Gen5 x16 (x16 connector) )
	R2f	2	OCP	Processor 1	PCIe Gen5 x16 (OCP 4C+ connector)
	R4a	4	Low Profile	Processor 0	PCIe Gen5 x16 (x16 connector)
	BOSS	3	BOSS	Processor 0	PCIe Gen3 x4 (1C connector)
	OCP	5	OCP	Processor 0	PCIe Gen5 x16 (OCP 4C+ connector)
RC8: 3x16LP(G5) + 1x8/x16 OCP(G5) + 1xBOSS	R2c	1	Low Profile	Processor 1	PCIe Gen5 x16 (x16 connector)
	R2c	2	Low Profile	Processor 1	PCIe Gen5 x16 (x16 connector)
	BOSS	3	BOSS	Processor 0	PCIe Gen3 x4 (1C connector)
	R4a	4	Low Profile	Processor 0	PCIe Gen5 x16 (x16 connector)
	OCP	5	OCP	Processor 0	PCIe Gen5 x16 (OCP 4C+ connector)
RC10: 2x16LP(G5) + 1x8/x16 OCP(G5) +1xBOSS	R2e	1	Low Profile	Processor 1	PCIe Gen5 x16 (x16 connector)
	BOSS	3	BOSS	Processor 0	PCIe Gen3 x4 (1C connector)
	R4a	4	Low Profile	Processor 0	PCIe Gen5 x16 (x16 connector)
	OCP	5	OCP	Processor 0	PCIe Gen5 x16 (OCP 4C+ connector)

Open Compute Project (OCP 3.0) PCIe 5.0 x8/x16

Front I/O

Riser RF1b support up to 2x OCP 3.0 slots
Install OCP Blank or Riser Blank if the R1Fb is not installed.

Rear I/O

1 Dedicated Slot
Riser R2f supplys one more OCP 3.0 Slot

Supported Speeds

1 GbE x 4
10 GbE x 2 or 4
25 GbE x 2 or 4
100 GbE x 2
200 GbE x 2

I/O Supports either front or back, not both.

OCP is also supported in front of the system for some configurations, called the Floating OCP Paddle Card (FLOP). Additionally, the Front I/O OCP supports both internal latch and thumbscrew versions, providing flexibility in installation and maintenance.

Boot Options

BOSS-N1 DC-MHS

BOSS-N1 Interposer

Internal USB Boot

Control Panel Options (LCP)

Secondary blank (Default)

Secondary with optional KVM

Secondary with optional Quick Sync 2.0

Power Supply Units (PSU)

Not sure what power supply to use. Dell has a calculator for you - Click Here

Form factor	Output	Power cord
60 mm	800 W mixed mode	C13
	1100 W mixed mode	C13
	1400 W -48 VDC	Lotes RN5T2
	1500 W mixed mode	C13
	1500 W mixed mode 277Vac & HVDC	APP/Saf-D-Grid
	1800 W mixed mode	C13

Dimensions & Weight

Dimensions

Width: 18.98"
Length: 30.95"
Height: 1.69"

Weight

8 x EDSFF E3.S 20.42 kg (45.02 pound)
8 x 2.5-inch SAS/SATA drives 19.26 kg (42.46 pound)
8 x 2.5-inch Universal 19.26 kg (42.46 pound)
10 x 2.5-inch SAS/SATA drives 19.7 kg (43.43 pound)
16 x EDSFF E3.S drives 19.58 kg (43.16 pound)
20 x EDSFF E3.S drives 20.18 kg (44.48 pound)
0 Drive 17.18 kg (37.87 pound)

Feature	Technical Specifications
Processor	Two Intel Xeon 6 Processors with up to 144 E-cores or 86 P-cores per processor
Memory	• 32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 6400 MT/s • Supports registered ECC DDR5 DIMMs only
Storage controllers	• Internal Boot: (BOSS-N1): HWRAID 1, 2 x M.2 NVMe SSDs • (BOSS-N1 DC-MHS): M.2 Interposer board (DC-MHS): 2 x M.2 NVMe SSDs • USB • Internal controllers: Front PERC H965i, Front PERC H975i, Front PERC H365i
Front Bays	• No Backplane configuration • 8 x EDSFF E3.S NVMe max 122.88 TB also with FIO configuration • 16 x EDSFF E3.S Gen5 NVMe max 245.76 TB • 20 x EDSFF E3.S Gen5 NVMe max 307.2 TB • 8 x 2.5 inch SAS/SATA/NVMe Direct/NVMe Raid max 122.88 TB • 8 x 2.5-inch Universal 245.6 TB • 10 x 2.5 inch SAS/SATA max 38.4 TB • 2 x EDSFF E3.S Gen5 NVMe in the rear max 30.72 TB
Hot swap Power Supplies	• 1500 W Titanium 100—240 VAC or 240 VDC • 1100 W Titanium 100—240 VAC or 240 VDC • 800 W Titanium 100—240 VAC or 240 VDC • 1100 W Platinum 100—240 VAC or 240 VDC • 800 W Platinum 100—240 VAC or 240 VDC • 1800 W HLAC Titanium 200—240 VAC or 240 VDC* • 1500 W 277 VAC or 336 VDC* • 1400 W LVDC -48 — -60 VDC*
Cooling Options	• Air cooling and Direct Liquid Cooling • Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
Fans	• High performance Silver (HPR SLVR) or Standard (STD) fans • Up to 4 sets (dual fan module) hot swappable fans
Dimensions and Weight	Height – 42.8 mm (1.69 inches) Width – 482 mm (18.98 inches) Weight – 20.42 kg (45.02 pounds)	Depth (for rear I/O configuration) • 816.92 mm (32.20 inches) with bezel • 815.14 mm (32.09 inches) without bezel Depth (for front I/O configuration) • 829.44 mm (32.66 inches) without bezel Note: The front I/O configuration does not support the bezel.
Form Factor	1U rack server
Embedded Management	• iDRAC • iDRAC Direct • iDRAC RESTful API with Redfish • RACADM CLI • iDRAC Service Module (iSM) • Quick Sync 2 wireless module • NativeEdge Endpoint • NativeEdge Orchestrator
Bezel	Optional security bezel
Security	• Cryptographically signed firmware • Data at Rest Encryption (SEDs with local or external key mgmt) • Secure Boot • Secured Component Verification (Hardware integrity check) • Secure Erase • Silicon Root of Trust • System Lockdown • TPM 2.0 FIPS, CC-TCG certified • Chassis Intrusion Detection
Network options	4 x OCP NIC 3.0 cards (optional) and 1GbE, 10GbE, 25GbE, 100GbE and 400GbE* • Slot 31 1 x 16 OCP 3.0 on front riser • Slot 32 1 x 16 OCP 3.0 on front riser • Slot 2 1 x 16 OCP 3.0 • Slot 5 1 x 8 Gen5 OCP 3.0 or 1 x 16 Gen5 OCP 3.0
BOSS	• Slot 34 1 x 4 BOSS • Slot 3 1 x 4 BOSS
GPU Options	Up to 3 x 75 W SW
Ports	Front Ports: • 1 x USB 2.0 Type C port • 1 x USB 2.0 Type A port (optional) • 1 x Mini-DisplayPort (optional) • 1 x DB9 Serial (with front I/O configuration) • 1 x Dedicated ethernet port for iDRAC management	Rear Ports: • 1 x Dedicated ethernet port for iDRAC management • 1 x VGA • 2 x USB 3.1 Type A ports
Internal Ports: • 1 x USB 3.1 Type A port
PCIe	• Up to 2 x 16 Gen5 PCIe slots • Slot 31 1 x 16 Full Height - Half Length or Full Height - Full Length or 1 x 16 OCP 3.0 on front riser • Slot 32 1 x 16 Full Height - Half Length or Full Height - Full Length or 1 x 16 OCP 3.0 on front riser • Up to 3 x 16 or 2 x 8 Gen5 PCIe slots • Slot 1 1 x 16 Full Height - Half Length or Full Height - Full Length or 3 x 16 or 1 x 8 Low Profile - Half Length • Slot 2 1 x 16 or 1 x 8 Low Profile - Half Length or 1 x 16 OCP 3.0 • Slot 4 1 x 16 Full Height - Half Length or 1 x 16 Low Profile - Half Length
Operating System and Hypervisors	• Canonical Ubuntu Server LTS • Microsoft Windows Server with Hyper-V (P-Core only) • Red Hat Enterprise Linux • SUSE Linux Enterprise Server • VMware ESXi

Feature

Technical Specifications

Processor

Two Intel Xeon 6 Processors with up to 144 E-cores or 86 P-cores per processor

Memory

• 32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 6400 MT/s
• Supports registered ECC DDR5 DIMMs only

Storage controllers

• Internal Boot: (BOSS-N1): HWRAID 1, 2 x M.2 NVMe SSDs
• (BOSS-N1 DC-MHS): M.2 Interposer board (DC-MHS): 2 x M.2 NVMe SSDs
• USB
• Internal controllers: Front PERC H965i, Front PERC H975i, Front PERC H365i

Front Bays

• No Backplane configuration
• 8 x EDSFF E3.S NVMe max 122.88 TB also with FIO configuration
• 16 x EDSFF E3.S Gen5 NVMe max 245.76 TB
• 20 x EDSFF E3.S Gen5 NVMe max 307.2 TB
• 8 x 2.5 inch SAS/SATA/NVMe Direct/NVMe Raid max 122.88 TB
• 8 x 2.5-inch Universal 245.6 TB
• 10 x 2.5 inch SAS/SATA max 38.4 TB
• 2 x EDSFF E3.S Gen5 NVMe in the rear max 30.72 TB

Hot swap Power Supplies

• 1500 W Titanium 100—240 VAC or 240 VDC
• 1100 W Titanium 100—240 VAC or 240 VDC
• 800 W Titanium 100—240 VAC or 240 VDC
• 1100 W Platinum 100—240 VAC or 240 VDC
• 800 W Platinum 100—240 VAC or 240 VDC
• 1800 W HLAC Titanium 200—240 VAC or 240 VDC*
• 1500 W 277 VAC or 336 VDC*
• 1400 W LVDC -48 — -60 VDC*

Cooling Options

• Air cooling and Direct Liquid Cooling
• Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.

Fans

• High performance Silver (HPR SLVR) or Standard (STD) fans
• Up to 4 sets (dual fan module) hot swappable fans

Dimensions and Weight

Height – 42.8 mm (1.69 inches)
Width – 482 mm (18.98 inches)
Weight – 20.42 kg (45.02 pounds)

Depth (for rear I/O configuration)
• 816.92 mm (32.20 inches) with bezel
• 815.14 mm (32.09 inches) without bezel
Depth (for front I/O configuration)
• 829.44 mm (32.66 inches) without bezel
Note: The front I/O configuration does not support the bezel.

Form Factor

1U rack server

Embedded Management

• iDRAC
• iDRAC Direct
• iDRAC RESTful API with Redfish
• RACADM CLI
• iDRAC Service Module (iSM)
• Quick Sync 2 wireless module
• NativeEdge Endpoint
• NativeEdge Orchestrator

Bezel

Optional security bezel

Security

• Cryptographically signed firmware
• Data at Rest Encryption (SEDs with local or external key mgmt)
• Secure Boot
• Secured Component Verification (Hardware integrity check)
• Secure Erase
• Silicon Root of Trust
• System Lockdown
• TPM 2.0 FIPS, CC-TCG certified
• Chassis Intrusion Detection

Network options

4 x OCP NIC 3.0 cards (optional) and 1GbE, 10GbE, 25GbE, 100GbE and 400GbE*
• Slot 31 1 x 16 OCP 3.0 on front riser
• Slot 32 1 x 16 OCP 3.0 on front riser
• Slot 2 1 x 16 OCP 3.0
• Slot 5 1 x 8 Gen5 OCP 3.0 or 1 x 16 Gen5 OCP 3.0

BOSS

• Slot 34 1 x 4 BOSS
• Slot 3 1 x 4 BOSS

GPU Options

Up to 3 x 75 W SW

Ports

Front Ports:
• 1 x USB 2.0 Type C port
• 1 x USB 2.0 Type A port (optional)
• 1 x Mini-DisplayPort (optional)
• 1 x DB9 Serial (with front I/O configuration)
• 1 x Dedicated ethernet port for iDRAC management

Rear Ports:
• 1 x Dedicated ethernet port for iDRAC management
• 1 x VGA
• 2 x USB 3.1 Type A ports

Internal Ports:
• 1 x USB 3.1 Type A port

PCIe

• Up to 2 x 16 Gen5 PCIe slots
• Slot 31 1 x 16 Full Height - Half Length or Full Height - Full Length or 1 x 16 OCP 3.0 on front riser
• Slot 32 1 x 16 Full Height - Half Length or Full Height - Full Length or 1 x 16 OCP 3.0 on front riser
• Up to 3 x 16 or 2 x 8 Gen5 PCIe slots
• Slot 1 1 x 16 Full Height - Half Length or Full Height - Full Length or 3 x 16 or 1 x 8 Low Profile - Half Length
• Slot 2 1 x 16 or 1 x 8 Low Profile - Half Length or 1 x 16 OCP 3.0
• Slot 4 1 x 16 Full Height - Half Length or 1 x 16 Low Profile - Half Length

Operating System and
Hypervisors

• Canonical Ubuntu Server LTS
• Microsoft Windows Server with Hyper-V (P-Core only)
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• VMware ESXi

Dell PowerEdge R670 Rack Server CTO

-PLEASE CONTACT FOR CUSTOM CONFIGURATIONS. DISK SHELVES, COMPLETE CONFIGURATIONS & TURN KEY SYSTEMS AVAILABLE.

-SPARE PARTS AVAILABLE FOR EACH MODEL. PLEASE ASK FOR PRICING ON SPARE DISK, CONTROLLERS, POWER SUPPLIES, NICs, HBAs, SFPs, Cables, etc.

READ ME

Select Chassis

Select Processor

Intel Xeon 6th Gen E-Core

Intel Xeon 6th Gen P-Core

Cooling Options (Optional)

Memory (E-Core) (Optional)

Memory (P-Core) (Optional)

Drives SATA (Optional)

Drives SAS (Optional)

Drives U.2 NVMe (Optional)

Drives E3.S DC NVMe G5 (Optional)

Drives E3.S NVMe G5 (Optional)

Boot Options (Optional)

Storage Controllers (Optional)

GPU Options (Optional)

Open Compute Program (OCP) 3.0 (Optional)

Riser Configurations (Optional)

Left Control Panel Options (Optional)

Power Supply Units

ECS Warranty

Quick Specs

Ideal for:

Current Configuration

Select Chassis

Select Processor

Cooling Options (Optional)

Memory (E-Core) (Optional)

Memory (P-Core) (Optional)

Drives SATA (Optional)

Drives SAS (Optional)

Drives U.2 NVMe (Optional)

Drives E3.S DC NVMe G5 (Optional)

Drives E3.S NVMe G5 (Optional)

Boot Options (Optional)

Storage Controllers (Optional)

GPU Options (Optional)

Open Compute Program (OCP) 3.0 (Optional)

Riser Configurations (Optional)

Left Control Panel Options (Optional)

Power Supply Units

ECS Warranty

Manuals

Manuals

Product Specs

Spec Sheet 4

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ECS Warranty Information

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