Base Standard Capabilities
Feature | Technical Specification | |
---|---|---|
Chassis | Dell EMC PowerEdge C6400 chassis | |
Nodes | 4 hot-swappable dual-socket compute nodes in a 2U chassis | C6520 | |
Processor | Up to two 3rd Generation Intel Xeon Scalable processors per node, with up to 40 cores per processor | |
Memory |
| |
Availability | Hot-plug redundant drives and PSUs | |
Controllers |
| |
Drive bays | Front bays:
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Power supplies | Dual hot-plug redundant 100 - 240 V AC Platinum (2600 W, 2400 W, 2000 W, 1600 W) , 200 - 240 V AC Titanium (2600 W, 1600 W) Power supply units | |
Cooling options | Air cooling, optional processor liquid cooling | |
Fans | Non-Hot plug fans | |
Dimensions | Height: 86.36 mm (3.4 inches) Width: 447.04 mm (17.6 inches) Depth: 802.64 mm (31.6 inches) | Weight: 45.6 kg (100.53 lb) for 12 x 3.5-inch direct backplane chassis 41.4 kg (91.27 lb) for 24 x 2.5-inch direct/NVMe backplane chassis 35 kg (77.16 lb) for system with no backplane |
Sled height (U) | 1U | |
Embedded/At-the-Server |
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Consoles |
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Mobility | OpenManage Mobile | |
Integrations and Connections | OpenManage Integrations
| OpenManage Connections
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Integrated Security |
| |
Embedded NIC | 1 x 1 GbE LOM riser | |
Network cards | 1 x OCP 3.0 x16 Gen4 (for network controller) | |
GPU options | Low-profile (Half-height) 70 W GPU | |
Rear Ports |
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PCIe | Up to 4 x PCIe Gen4 slots (3 x16, 1 x8) with support for SNAP I/O modules | |
Supported Operating Systems |
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Spec Sheet 4
Feature | PowerEdge C6520 | PowerEdge C6420 |
---|---|---|
Chassis | C6400 chassis | C6400 chassis |
Processor | Up to two 3rd Generation Intel® Xeon® Processor Scalable family | Up to two 2nd Generation Intel® Xeon® Processor Scalable family |
Air and direct contact liquid cooling. | Air and direct contact liquid cooling. | |
Configuration restrictions apply due to thermal or power limits. | Configuration restrictions apply due to thermal or power limits. | |
Memory | DDR4: 8 channels per processor | DDR4: 6 channels per processor |
Up to 16x RDIMMs and LRDIMMs | Up to 12x RDIMMs and LRDIMMS | |
Speed: up to 3200 MT/s | Speed: 2900 MT/s | |
Storage | Backplanes: ● 24 x 2.5-inch (direct and NVMe with two universal slots) ● 24 x 2.5-inch all NVMe ● 12 x 3.5-inch ● No backplane | Backplanes: ● 24 x 2.5-inch (direct, expander and NVMe with two universal slots) ● 12 x 3.5-inch direct ● No-backplane |
Internal: uSD card, M.2 SATA BOSS 1.5 | No support for persistent memory | |
Internal: uSD card, M.2 SATA BOSS 1.0 | No support for persistent memory | |
Storage controllers | HW RAID: PERC 10: H350, H345, HBA355i, HBA345, H750 and H745 | HW RAID: PERC 9 Mini (Mini H330, H730P, HBA330) |
Chipset: SATA | Chipset: SATA | |
SW RAID: Yes, S150 | SW RAID: Yes, S140 | |
I/O slots | 2 PCIe Gen4 HH/HL slots, x16 (network, storage, AIC) | 1 PCIe Gen3 HH/HL slot, x16 |
1 OCP3 Gen4 slot x16 | 1 x16 OCP Slot (network) | |
- | 1 MEZZ slot x8 (storage) | |
LOM | Single port 1 Gbe LOM (Broadcom) | Single port 1 Gbe LOM (Intel) |
PSU | Support for 2 x 1600 W, 2000 W, 2400 W, and 2600 W | Support for 2 x 1600 W, 2000 W, and 2400 W |
Support 1+1 with FTR | Support 1+1 with FTR | |
Systems management | iDRAC9 with Lifecycle Controller | iDRAC9 with Lifecycle Controller |
Accelerators | At least one GPU/FPGA/PAC (up to 75W) | NA |
CSIL | Tier-1 + CMT approved exception countries | Tier-1 + CMT approved exception countries |