General Data Center Standardization — The R750's broad 2U configuration matrix — from 8-bay SFF to 24-drive NVMe, from single Silver to dual Platinum CPUs, and from 8 GB DDR4 to 8 TB LRDIMM — makes it a single platform that can serve every departmental workload; consolidate rack space without deploying multiple server models for different functions — configure a refurbished Dell PowerEdge R750 to cover your full workload spectrum from a single 2U platform

High-Density Virtualization and Cloud Applications — Dual 3rd Gen Xeon Scalable sockets deliver up to 80 physical cores and 160 threads in a 2U chassis; 8 TB LRDIMM capacity enables extreme VM consolidation ratios; PCIe Gen 4 double-width GPU slots and up to 8 PCIe expansion slots prevent I/O from becoming a hypervisor bottleneck on busy multi-tenant hosts

Virtual Desktop Infrastructure (VDI) — Up to six 75 W single-width or four 150 W single-width GPUs provides GPU-accelerated VDI at large scale from a single 2U chassis; OCP 3.0 25 GbE connectivity and high core count support large concurrent user session counts; 2U headroom allows FH GPU cards not possible in 1U servers, opening direct-attach vGPU profiles for premium user experience

Database and Analytics (In-Memory) — Intel Optane Persistent Memory 200 Series extends total system memory to up to 6 TB per socket (DDR4 + PMem) for in-memory SQL, Oracle, SAP HANA, and Redis workloads; 8 TB LRDIMM maximum DDR4 capacity meets the largest in-memory analytical tier requirements without requiring PMem; DDR4 at 3200 MT/s across 8 channels per CPU accelerates both OLTP and OLAP query throughput

High-Performance Computing (HPC) — Platinum Xeon processors at up to 270 W TDP with 64 PCIe Gen 4 lanes per socket, 3×UPI inter-socket links at 11.2 GT/s, direct liquid cooling for the highest-TDP options, and up to 24 NVMe Gen 4 drives deliver HPC simulation, CFD, genomics, and finite element analysis throughput within a standard 2U data center footprint

AI/ML Training and Inference — Up to two double-width 300 W GPU accelerators (e.g. NVIDIA A100, A30) or up to four single-width 150 W cards in a 2U chassis provides meaningful AI/ML training headroom; high DDR4 memory bandwidth and PCIe Gen 4 accelerator connectivity enable GPU-to-host data pipeline rates that avoid I/O-bound training stalls on large batch sizes

Software-Defined Storage (SDS) — Up to 24 NVMe Gen 4 front bays plus up to 4 rear bays give vSAN, Storage Spaces Direct, and Ceph deployments the deepest local storage capacity of any Gen 15 Dell 2U platform; Intel Optane PMem caching adds persistent write-caching without consuming NVMe slots; HBA355i pass-through mode supports custom ZFS and Ceph CRUSH map configurations without RAID firmware overhead

SAP HANA and Large In-Memory Platforms — 8 TB LRDIMM maximum DDR4 capacity (32 × 256 GB DIMMs) combined with optional Intel Optane PMem 200 Series meets the memory footprint requirements of mid-to-large SAP HANA scale-up nodes; Xeon Platinum's large last-level cache and 8-channel DDR4 per socket support the sustained memory bandwidth that HANA row-store and column-store operations require at production scale

32 DIMM Slots — 8 Channels per CPU — 32 total DDR4 DIMM slots distributed as 16 per processor across 8 memory channels (2 DIMMs per channel); 8-channel memory architecture provides exceptional aggregate bandwidth for HPC, analytics, and large in-memory database workloads; 2 DPC maintains full 3200 MT/s operating speed for both RDIMM and LRDIMM at all 32-slot configurations

RDIMM — Up to 2 TB — Registered ECC DDR4 DIMMs at 3200 MT/s; available sizes 8 GB (1Rx8), 16 GB, 32 GB, and 64 GB (2Rx4); maximum capacity 2 TB at 32 × 64 GB RDIMMs; standard choice for virtualization, web tiers, databases, and workloads that do not require LRDIMM density or Intel Optane Persistent Memory; ECC protects against single-bit memory errors at all populated configurations

LRDIMM — Up to 8 TB — Load Reduced ECC DDR4 DIMMs with 128 GB (4R) and 256 GB (8R) per-module capacities at 3200 MT/s; maximum 8 TB total system capacity at 32 × 256 GB LRDIMM 8R — the R750's largest DDR4 configuration; load reduction buffer enables 4-rank and 8-rank modules to operate at full DRAM speed; critical for SAP HANA scale-up, Oracle SGA, and large in-memory analytics caches that exceed RDIMM capacity — configure your R750 memory at ECS

Intel Optane Persistent Memory 200 Series — Up to 6 TB Per Socket — Up to 16 dedicated Intel Optane PMem 200 Series (Barlow Pass) module slots (8 per CPU) for 512 GB PMem modules; max 8 TB PMem total system capacity combined with DDR4; PMem delivers persistent byte-addressable storage at near-DRAM speeds; App Direct Mode creates a persistent memory tier for in-memory databases that survive reboots; Memory Mode expands volatile capacity using DDR4 as a transparent last-level cache in front of PMem

Memory Speed by Processor Tier — DDR4 maximum operating speed: 3200 MT/s for Xeon Gold 6 and Platinum (1 and 2 DPC); 2933 MT/s for Xeon Silver; 2666 MT/s for Xeon Gold 4-series; LRDIMM and RDIMM achieve the same maximum speed at matched populations; Intel Optane PMem 200 operates at 3200 MT/s alongside supported DDR4 on Gold 6 and Platinum sockets

Memory Mode vs App Direct (PMem) — Memory Mode: DRAM acts as a last-level cache in front of the PMem capacity pool; the OS sees one large volatile memory region; applications require no modification; App Direct Mode: DRAM and PMem appear as distinct namespaces; applications write directly to persistent storage using PMDK or filesystem-DAX APIs; App Direct enables restartable in-memory databases with zero data loss on power failure

Upgrade from R740 — R740 supported 24 DDR4 DIMMs at 2933 MT/s with 12 Intel Optane Apache Pass slots; R750 raises to 32 DIMMs at 3200 MT/s with 16 PMem 200 Series slots; LRDIMM maximum capacity increases from 3 TB (R740, 24 × 128 GB) to 8 TB (R750, 32 × 256 GB) — a significant density upgrade for SAP HANA and large in-memory deployments — upgrade from R740 to a refurbished Dell R750 at ECS for the full Gen 15 memory density gain

PERC H755 (Premium RAID — SAS/SATA) — 12 Gb/s SAS + SATA on PCIe Gen 4 with NV Flash-Backed write cache; RAID 0, 1, 5, 6, 10, 50, 60; NV cache persists writes through power failure events; highest-endurance RAID option for OLTP databases, ERP transaction logs, and RAID 6 parity configurations under sustained write pressure; validates across all 24-bay 2.5-inch SAS/SATA R750 configurations

PERC H755N (Premium RAID — NVMe) — NVMe-native RAID controller at PCIe Gen 4; supports RAID 0, 1, 5, 6, 10, 50, 60 across NVMe Gen 4 SSDs with NV cache; enables hardware RAID protection on all-NVMe arrays without operating drives in JBOD mode under OS-managed software RAID; dual controller required for 16-drive and 24-drive NVMe RAID configurations on R750

PERC H745 (Value Performance RAID) — 12 Gb/s SAS + SATA controller with write cache on PCIe Gen 4; RAID 0, 1, 5, 6, 10, 50, 60; mid-tier between H755 and H345 for virtualization, moderate-intensity databases, and mixed workloads requiring RAID parity protection with write caching at lower cost than the H755; compatible with all R750 SAS/SATA front and rear bay configurations

fPERC — No PCIe Slot Consumed — Dedicated front PERC (PERC H345 or H745 fPERC) in a small form factor slot on the system planar; RAID 0, 1, 5, 6, 10, 50, 60; zero PCIe slot consumption — all up-to-eight user PCIe slots remain available when fPERC is the only RAID controller; critical for R750 configurations deploying multiple GPU cards, 100 GbE NICs, and FC HBAs simultaneously

PERC H345 (Entry Hardware RAID) — 12 Gb/s SAS + SATA entry RAID controller on PCIe Gen 4; RAID 0, 1, 10; no write cache; appropriate for read-dominant workloads, development environments, and configurations where write-back caching overhead is not justified; available as both adapter and fPERC form factors on R750

HBA355i and HBA355E (Pass-Through) — HBA355i internal 12 Gb/s SAS HBA for OS-managed ZFS, Ceph CRUSH, vSAN, and Storage Spaces Direct configurations; HBA355E external 12 Gb/s SAS connects to JBODs and tape; both provide raw drive pass-through with no RAID layer — OS or application manages parity, mirroring, and data placement directly with full access to raw drive telemetry

PERC S150 (Software RAID) — SATA + NVMe firmware-based RAID; RAID 0, 1, 5, 10; no additional PCIe card; lowest-cost option for non-critical data, lab, and development environments; RAID rebuild activity consumes Xeon Scalable processor cycles — avoid on production systems under sustained load; appropriate for single-drive NVMe OS boot mirror without additional PERC card

Up to 8 × PCIe Gen 4 Expansion Slots — R750 provides up to 8 PCIe Gen 4 slots with up to 6 configured as x16 in dual-socket configurations; PCIe Gen 4 at 16 GT/s per lane delivers 32 GB/s bidirectional bandwidth per x16 slot; the 2U chassis removes the 1U space constraint that limits the R650 to three slots — enabling simultaneous dual GPU, dual 100 GbE, and FC HBA deployment in a single server — shop the Dell R750 at ECS to select your PCIe expansion and GPU profile

Riser Configurations Overview — Multiple riser configurations from Config 0 (2 CPUs, 4 slots, fPERC) to Config 4 (6 x16 FH/FL slots, fPERC) and Config 5–6 (rear storage drives + 4 PCIe expansion slots); riser options span R1A/B/C (1–2 x16 CPU1 slots), R2A/B (1–3 x16 CPU2 slots), R3A/B (1–2 x16 CPU2), R4A/B (1–2 x16 CPU2); paddle cards (R1-paddle, R3-paddle) route CPU PCIe lanes directly to the NVMe backplane for high-density NVMe configurations

Double-Width GPU Support — Up to 2 × 300 W — Two full-height full-length (FHFL) double-width GPU slots support up to 300 W each for NVIDIA A100 PCIe, A30, T4, and similar data center GPU cards; 2U chassis height accommodates dual-slot GPU cards that cannot fit in 1U platforms; GPU presence leads to elevated fan speeds and acoustical output — plan cooling and rack power budgets accordingly for 300 W GPU deployments

Single-Width GPU — Up to 4 × 150 W or 6 × 75 W — Four full-height full-length single-width slots at 150 W each or six FH/LP single-width slots at 75 W each for inference accelerators, display adapters, and light training cards (e.g. NVIDIA T1000, T400); the 6× 75 W configuration provides highest GPU count per server for GPU-dense VDI or inference at scale without requiring double-width slot allocation

OCP 3.0 Integrated Slot — One integrated OCP 3.0 NIC slot on PCIe Gen 4 × 8 lanes; supports Intel, Broadcom, Mellanox, QLogic, Emulex, and SolarFlare SFF cards from 1 GbE to 25 GbE; OCP 3.0 NIC does not consume any of the up-to-eight user PCIe slots — all expansion slots remain available for HBA, GPU, or add-in NIC cards simultaneously with the OCP NIC active

SNAP I/O Socket Direct Networking — SNAP I/O leverages Mellanox socket direct technology to allow both CPU0 and CPU1 to access one OCP 3.0 NIC without traversing the UPI inter-socket link; each CPU's traffic routes to its corresponding NIC port natively — eliminating the remote-socket UPI latency penalty, freeing UPI bandwidth for NUMA cache coherency, and improving I/O-bound workload throughput per socket

Paddle Card NVMe Routing — R1-paddle and R3-paddle cards route additional PCIe Gen 4 lanes from the CPU directly to the front NVMe backplane in NVMe-heavy configurations; enables 24-drive NVMe configurations (via NVMe switch configuration) without dedicating user PCIe slots for backplane connectivity; maximum NVMe throughput uses CPU-direct PCIe lanes at full backplane bandwidth

700 W Mixed Mode 80 PLUS Titanium HLAC — Titanium efficiency at the entry wattage tier; HLAC (High Line AC) mixed mode auto-senses 200–240 VAC and 240 VDC; ideal for single-socket R750 configurations or lightweight dual-socket configurations with low GPU or drive load; Titanium's superior efficiency versus Platinum at 50% load load reduces annual electricity cost in 24×7 data center operations

800 W Mixed Mode 80 PLUS Platinum AC — 800 W at high-line (200–240 V) and low-line (100–120 V); Platinum efficiency at 93% peak; supports both standard AC and 240 VDC mixed mode; entry-point hot-swap PSU for dual-socket R750 configurations with moderate processor and drive load at standard US and international AC power; most common choice for general-purpose virtualization deployments — buy a refurbished Dell PowerEdge R750 at ECS with your required PSU spec

1100 W Mixed Mode 80 PLUS Titanium — 1100 W at high-line; Titanium efficiency up to 96% at 50% load — best-in-class for dual-socket deployments under sustained 50–70% utilization; the 1100 W Titanium's efficiency premium over Platinum delivers measurable annual savings on power and cooling costs over multi-year production deployments; recommended for database and analytics workloads with consistent mid-range CPU and memory utilization

1400 W Mixed Mode 80 PLUS Platinum — 1400 W at high-line; provides headroom for dual-socket 270 W CPU + 4-GPU + 24-NVMe configurations at peak simultaneous load; same 86 mm/60 mm PSU form factor family with equal hot-swap serviceability to lower wattage units; Platinum efficiency maintained across the load range from idle to full load

1800 W and 2800 W Mixed Mode 80 PLUS Titanium HLAC — 1800 W and 2800 W Titanium HLAC options address the most power-intensive R750 GPU-dense deployments running dual 300 W GPUs alongside dual 270 W CPUs with full NVMe backplane; 2800 W provides 150%+ headroom above the total platform thermal design power in the most demanding configuration — ensures PSU load stays within Titanium efficiency sweet spot rather than operating at maximum output

1100 W DC Hot-Swap (−48 V to −60 V) — Dedicated −48 V DC PSU for carrier, telco, and NEBS-adjacent data center power distributions; 1100 W rated at nominal DC rail; same hot-swap housing as AC units — enables PSU standardization in mixed AC/DC data center power environments without chassis change or re-specification when deploying R750s into carrier or edge facilities

1+1 Redundant Hot-Swap Design — Both PSU slots operate simultaneously with load sharing; if one unit fails, the surviving PSU assumes full system load immediately with zero downtime; hot-swap replacement while the system runs without OS or workload disruption; PSUs must be matched wattage class — mismatched wattage triggers an iDRAC mismatch alert and the higher-wattage unit governs system operation

1% Power Monitoring Accuracy — Dell's R750 PSU monitoring reports power consumption at 1% accuracy versus the industry-standard 5%; enables tighter iDRAC Enterprise power cap configuration with a smaller safety margin while ensuring the server stays within valid operating range — translates to higher effective rack density in power-constrained data centers without increasing risk of over-budget power events

Front Panel — iDRAC Direct (Micro-USB) — Dedicated micro-USB iDRAC Direct port provides browser-zero iDRAC access at 169.254.0.1 from a directly connected laptop without requiring a network connection to the iDRAC management port; configure BIOS and iDRAC, retrieve hardware inventory, review event logs, and perform bare-metal provisioning directly from the front of the server — essential for ROBO deployments and rack staging workflows

Front Panel — USB 2.0 and VGA — One USB 2.0 Type-A port for keyboard/mouse and deployment media; one front VGA for direct console access without pulling the server to the rear — in dense rack environments, front VGA eliminates the need to slide the server out to access the rear VGA during initial configuration or troubleshooting events when the 2U depth occupies significant rear clearance

Optional LCD Bezel — Optional LCD bezel provides system status at a glance including power state, temperature, and system health alerts directly on the front panel; security bezel also available; useful in open-access data centers or server rooms where visual status monitoring is preferred over SSH or iDRAC web sessions

Rear Panel — USB Ports — One USB 2.0 (Type-A) and one USB 3.0 (Type-A) on the rear panel; USB 3.0 at 5 Gb/s supports external high-speed storage, OS installation drives, and backup media; separate port placement matches the standard rear-panel layout across all Gen 15 Dell PowerEdge servers for consistent cable management in mixed-generation racks

Rear Panel — Dual LOM, iDRAC, VGA, Optional Serial — Two RJ-45 1 GbE LOM ports for production data traffic; one dedicated RJ-45 iDRAC management port; one rear VGA; optional DB-9 serial port for BIOS console-redirection over RS-232 and serial concentrators; all three Ethernet management and data interfaces are simultaneously accessible without configuration switching

Liquid Cooling Rear Panel Variant — R750 Direct Liquid Cooling configurations use an LC (Liquid Cooled) RIO board; the LC RIO board provides USB 3.0, USB 2.0, and iDRAC port as standard; VGA port on the rear is optional for the LC RIO board — verify rear VGA availability when specifying a liquid-cooled R750 configuration if rear-panel console access is required without front VGA

Internal USB 3.0 and Video Controller — Optional internal USB 3.0 dongle installs inside the chassis for persistent in-chassis storage; embedded Matrox G200 video controller with 16 MB frame buffer; supports display resolutions up to 1920 × 1200 at 60 Hz simultaneously on front and rear VGA outputs

iDRAC9 License Tiers — iDRAC9 Express ships standard on every R750; Enterprise adds dedicated NIC, virtual console/media, power capping, and System Lockdown; Datacenter adds telemetry streaming, extended Redfish API scripting, GPU management, and custom thermal controls including delta-T and PCIe inlet temperature control; all tiers are upgradeable via digital license key — no hardware change required to activate Enterprise or Datacenter features

iDRAC Service Module (iSM) — Optional lightweight in-band agent inside the host OS; extends iDRAC visibility into OS-level health metrics including process status, Windows/Linux crash data, and software inventory without requiring SSH to iDRAC from within the OS; iSM requires no additional license and runs on all supported OS families covering Windows Server, RHEL, SLES, and Ubuntu

iDRAC Direct and Quick Sync 2 — iDRAC Direct provides local access via front-panel micro-USB without a network connection; optional Quick Sync 2 BLE wireless module enables iDRAC configuration and inventory review via smartphone using OpenManage Mobile — allows initial IP address configuration and inventory collection without a network cable at the iDRAC management port during rack installation

Lifecycle Controller — Embedded provisioning engine delivers OS-agnostic bare-metal deployments; firmware updates, BIOS and iDRAC configuration, driver deployment, and full OS installation without a PXE server or a deployed OS; change audit trail persisted in Lifecycle Controller logs for change management and compliance reporting including OS installation timestamp and driver package version

Redfish RESTful API and Automation — DMTF-standard Redfish RESTful API on iDRAC9; full lifecycle management via curl, Python, PowerShell, Ansible, and Terraform; RACADM CLI for scripted administration; Dell EMC GitHub Scripting Libraries and Dell Update Packages (DUP) for offline firmware management; DSU, DRM, PSBI, and SUU for repository-based fleet firmware workflows across R750 fleets

OpenManage Console Portfolio — OpenManage Enterprise (OME) for one-to-many server lifecycle management; OpenManage Power Manager plugin for rack and row power capping and energy analytics; OpenManage SupportAssist plugin for predictive issue detection and automated support case creation; Dell EMC Repository Manager for change-controlled firmware update workflows across heterogeneous PowerEdge generations

Third-Party Integrations — OpenManage Integrations: VMware vCenter (OMIVV), Microsoft System Center (OMIMSSC), Red Hat Ansible Modules, BMC Truesight; Connections: IBM Tivoli Netcool/OMNIbus, IBM Tivoli Network Manager, Micro Focus Operations Manager, Nagios Core, Nagios XI — iDRAC management actions are available from every major enterprise ITSM and monitoring platform without bespoke scripting or unsupported API calls

ReadyRails II Sliding Rails (B6) — Drop-in chassis installation; tool-less in 19-inch EIA-310-E compliant square and unthreaded round hole 4-post racks including all Dell rack generations; tooled installation in threaded 4-post racks; supports full extension of the R750 out of the rack for serviceability of drives, PSUs, fans, DIMMs, PCIe cards, and rear BOSS module without removing the server from the rack

Stab-In/Drop-In Sliding Rails (B13) — Supports both Drop-in and Stab-in installation methods; tool-less in square, unthreaded round hole, and threaded round hole 4-post racks; Stab-in requires attaching inner rail members to the chassis sides first (2-person lift for 2U at full chassis weight); full extension serviceability; CMA and SRB compatible — outer CMA brackets are removable to reduce rail total depth and eliminate rear PDU clearance conflicts

Static Rails (B4) — Stab-in installation only; tool-less in 19-inch square/unthreaded round hole 4-post racks; tooled in threaded 4-post and 2-post relay racks including Dell Titan and Titan-D frames; note: screws are not included with static rail kits — provide for threaded rack flanges with appropriate thread type; static rails do not extend and are not CMA/SRB compatible; use for 2-post telco, branch IDF, and deployments where full slide-out serviceability is not required

Cable Management Arm (CMA) — Available with both ReadyRails II and Stab-In/Drop-In sliding rails; tool-less side-swap between left and right without additional hardware; large ventilated strap baskets retain cables during server slide-out service events; for single-PSU R750 configurations, mount the CMA on the side opposite the PSU bay for unobstructed hot-swap PSU access while the CMA remains fully loaded with production cables

Strain Relief Bar (SRB) — Tool-less attachment to both sliding rail types; two available depth positions to accommodate varying cable bundle sizes and rack depths; organizes production data, power, and management cables into separated bundles without CMA arm bulk — appropriate for high-density racks where CMA clearance would conflict with adjacent servers or rear-mounted PDUs

Chassis Dimensions and Weight — Height: 86.8 mm (3.41 in, 2U); Width: 482 mm (18.97 in); Depth: 758.3 mm without bezel / 772.14 mm with bezel; verify rear clearance when deploying in racks with rear-mounted PDUs or patch panels — R750 at 2U is significantly deeper than many legacy 2U platforms; maximum chassis weight up to approximately 32 kg fully loaded — use proper 2-person lift procedures and rail safety locks during installation