Dell PowerEdge R810 Rack Server CTO

Built with highly reliable Intel Xeon processors, high-capacity DDR3 memory, and enterprise-class manageability, the PowerEdge R810 provides outstanding price for performance with excellent memory capacity per processor

The PowerEdge R810 is built for reliability, from new Intel Advanced RAS (Reliability, Availability, Serviceability) features and dual internal SD modules to embedded diagnostics and industrial-quality materials. Dual internal SD modules provide failover capability for the embedded hypervisor; this feature was designed based on customer reliability feedback. Dell listened and delivered.

With the Dell Lifecycle Controller, persistent diagnostics eliminate technicians having to load diagnostics from media, minimizing downtime. Every fully configured Dell server is tested (and re-tested) before it leaves the factory. Our “one-touch” process is designed to ensure one person is responsible for the entire server build, resulting in greater quality control.

The PowerEdge R810 follows the 11th Generation PowerEdge behavioral specifications with the same system design commonality and usability true to the entire portfolio. All 11th Generation servers are designed to make the user experience easier while saving time and money.

The Dell™ PowerEdge™ R810 is designed to support either a dual-processor configuration with FlexMem Bridge or a four-processor configuration. In either configuration, all IO and memory is available in the system. While not formally supported, single processor configurations with a processor installed in CPU1 will allow the system to boot for diagnostic purposes.

The PowerEdge R810 also features a Dell technology that allows flexibility in processor and memory scalability—the FlexMem Bridge. The FlexMem Bridge allows the full amount of addressable DIMMs on four-socket systems with the Intel Xeon processor E7 product family and Intel Xeon processor 7500 and 6500 series to be accessed, even when only two of the processors are in place, in a completely passive solution (no active components)

R810 supports RDIMMs only, running at 1066 MT/s. DIMMs rated at 1333 MT/s are supported running at 1066 MT/s. DIMM capacities of 1GB, 2GB, 4GB, 8GB and 16GB are supported.
Single-, dual-, and quad-rank DIMMS are supported. LV DIMMs are not supported.
In the case where two processors and 2 FlexMem Bridges are installed, DIMMs C1–C8 will associate with CPU1, and DIMMs D1–D8 will associate with CPU2.

Registered (RDIMM) ECC DDR3 technology features support:

• Up to 512 GB of memory (with 32 16GB RDIMMs)
• 1066 MT/s single-, dual-, and quad-rank DIMMs
• Low power self-refresh mode for DIMMs
• Single-Bit Error Correction
• Multi-Bit Error Detection
• Support for Memory Mirroring in limited configurations

In 2P mode, the mirroring will be inter-node with hemisphere mode enabled. In this case, the memory controller (MBox) of CPU1 is mapped to the corresponding MBox of CPU2. The figure below depicts the mirroring logic for 2P configurations. A, B, C and D represent the DIMM socket groups.

For four-processor configurations, the PowerEdge R810 will also support mirroring in the inter-socket mode (note that intra-socket is not possible in 4P because each processor has only one MBox connected to memory buffers). In this 4P case, the memory on CPU1 will be mirrored with memory on CPU3, while memory on CPU2 is mirrored with memory on CPU4. Table 10 depicts the mirroring logic for 2P configurations. A,B,C and D represent the DIMM socket groups.

• (1) Physical x16 (x8 electrical) PCI Express Gen2 slot
• (1) Physical x8 (x4 electrical) PCI Express Gen2 slot
• (1) Storage adapter (physical x8, x4 electrical) PCI Express Gen2 slot
• All slots are controlled from the PEX8642 PCIE Gen2 arbiter

• (2) Physical x16 (x8 electrical) PCI Express Gen2 slots
• Both slots are controlled from the IOH PCIE Gen2 arbiter