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Home / Refurbished Dell EMC PowerEdge Servers / Dell PowerEdge MX750c Compute Sled CTO

Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Select Memory DIMM's

Select RAID Controller

Select Fabric A

Select Fabric B

Select Fabric C

Boot Option | Boot Optimized Storage Subsystem (BOSS)

Boot Option | Internal Dual SD Module (IDSDM)

(2.5") HDD

(2.5") SSD

Select Drive NVMe Gen 4 PCIe

Select Trusted Platform Module (TPM)

Select Warranty

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Dell PowerEdge MX750c Compute Sled CTO

Dell

| CTO Servers

 

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Select Chassis

Select Processor

The 3rd Generation Xeon Scalable Processors stack is a next generation data center CPU offering with the latest features.
Silver Processors have a Max Memory speed of 2666Mhz

The 3rd Generation Xeon Scalable

Select Memory DIMM's

32 DDR4 DIMM Slots Available
Only 3200 MT/s, 2933 MT/s and 2666 MT/s DIMMs have been validated on the MX750c and will clock down based on CPU bin support level.
256 GB LRDIMM is only supported on X4 universal backplane configuration. It cannot be mixed with Intel Optane PMem 200 Series configurations.

Select RAID Controller

If you plan to connect this Compute Sled to a storage sled in the MX7000. You must select the H745p MX or the HBA330 MX to access those drives.
If you want to have multiple Compute Sleds to have access to the same Storage Sled. You Must select HBA330 MX controller.
The MX7000 chassis must have a pair of Dell EMC PowerEdge MX5000s SAS switches installed.

Select Fabric A (Optional)

Select Fabric B (Optional)

Select Fabric C (Optional)

If you chose the RAID Controller H745P MX, HBA350i MX, or HBA330 MX. Fabric C has been filled already.
These controllers are the only way to link this compute sled to the storage sled MX5016s.

Boot Option | Boot Optimized Storage Subsystem (BOSS) (Optional)

Supports up to 2 M.2 SSD's
The PowerEdge MX750c supports either the optional IDSDM or the BOSS S-1 module but cannot support both simultaneously.
You must Select the BOSS Card as well if you choose this option.

Boot Option | Internal Dual SD Module (IDSDM) (Optional)

Supports up to 2 microSD, The second microSD is for redundancy
The PowerEdge MX750c supports either the optional IDSDM or the BOSS S-1 module but cannot support both simultaneously.
You must Select the IDSDM Card as well if you choose this option.

(2.5") HDD (Optional)

Up to 8 SFF Drives

(2.5") SSD (Optional)

Up to 8 SFF Drives

Select Drive NVMe Gen 4 PCIe (Optional)

Up to 8 SFF Drives

Select Trusted Platform Module (TPM) (Optional)

Select Warranty

Helpful Tip: Once desired configuration is selected click "Add to Cart".
From the cart page you can submit a submit a quote request for best pricing

Quick Specs

Form Factor:

Single Width Compute Sled

Processor | Max: 40 Cores

2 x 3rd Gen Intel Xeon Scalable

Memory | Max: 2TB RDIMM | 4TB LRDIMM

- 32 DDR4 RDIMM/LRDIMM 3200Mhz
- Supports 16 Optane Pmem 200 Series Max: 7.68TB

Storage | Max: 7.68TB

6 SFF SAS/SATA/NVMe HDD/SSD

Storage Controllers:

S150 (SW RAID 6Gb/s SATA/NVMe)
PERC H755 MX, H745P MX (Jumbo), HBA350i MX, HBA330 MX Mini-Mezzanine

Boot Options:

BOSS-S1 Module
IDSDM
USB

Remote Management:

iDRAC9 with Lifecycle Controller

Ideal for:

  • Data Analytics
  • Database
  • Virtualization
MX7000 Supported Sled Options
Dell PowerEdge MX Series

Each Node is a separate CTO you must configure.

MX750c Features

A fully configurable single-width compute sled powered by up to two-40 core 3rd Generation Intel® Xeon® Scalable processors. Each PowerEdge MX750c supports 32 DDR4 DIMM slots and up to six 2.5-inch SAS/SATA (HDD/SDD) or Express Flash NVMe PCIe SSDs drives. A maximum of eight MX750c servers can be installed in the PowerEdge MX7000 chassis.

  • Flexible memory configurations from capacities of up to 4 TB
  • Supports up to 16 slots for Second Generation Intel® Optane™ DC persistent memory DCPMM
  • Choice of optional M.2 Boot Optimized Storage Solution (BOSS) or Internal Dual microSD Module (IDSDM), to
  • streamline operating system and data storage
  • Option of Express Flash NVMe PCIe SSD for high-performing direct attached storage requirements
  • This makes the PowerEdge MX750 an ideal server for organizations:
  • looking for leading-edge performance for virtualization, containers, software-defined storage and software-defined
  • networking and database analytics
  • seeking to commit to Dell EMC’s vision that leads toward Composable Disaggregated Infrastructure (CDI)
Increase operations with autonomous collaboration

The Dell EMC OpenManage systems management portfolio tames the complexity of managing and securing IT infrastructure. OpenManage Enterprise – Modular is specifically designed to enable customers that enjoy the benefits of a multi-chassis management approach found uniquely in the MX solution. Using Dell Technologies’ intuitive end-to-end tools, IT can deliver a secure, integrated experience by reducing process and information silos in order to focus on growing the business. The Dell EMC OpenManage portfolio is the key to your innovation engine, unlocking the tools and automation that help you scale, manage, and protect your technology environment.

  • Built-in telemetry streaming, thermal management, and RESTful API with Redfish offer streamlined visibility and
  • control for better server management
  • Intelligent automation lets you enable cooperation between human actions and system capabilities for added
  • productivity
  • Integrated change management capabilities for update planning and seamless, zero-touch configuration and
  • implementation
  • Full-stack management integration with Microsoft, VMware, ServiceNow, Ansible and many other tools
Memory
RDIMM

Registered DIMM – Provides for higher capacity options and advanced RAS features. It is the most commonly used DIMM type, and offers the best mix of frequency, capacity, and rank structure choices.

LRDIMM

Load Reduced DIMM – Provides maximum capacity beyond that of an RDIMM but at a higher power consumption. Uses a buffer to reduce memory loading to a single load on all DDR signals, allowing for greater density

DCPMM

(also known as Intel Optane DC persistent memory): Provides a large memory capacity at an affordable price. Any application can take advantage of DCPMM in Memory Mode with a compatible operating system. Unlock more performance and persistency when using an application that supports App Direct Mode. DCPMM is used along with RDIMMs or LRDIMMs and a maximum number of 6 DCPMMs can be used per CPU. This persistent memory technology does not require a battery.

Mezzanine & PERCs

The system can support 1 Mini-Mezz and 1 Internal PERC or is can handle 1 Jumbo PERC which will do the work of both the Mini-Mezz and the Internal PERC. This Fabric C slot is how you are able to connect the MX5016s Storage Array to this compute sled.

Image of the Mini-Mezzanine for Fab C
Mini-Mezzanine

The Mini-Mezzanine is install in the rear of the system near the Fab A and B Mezzanine Cards. This Mini Mezzanine gets connect to the Fab C in the MX7000 Enclosure. Only certain cards are supported here.

Image of the Mini-Mezzanine for Fab C
Internal PERC

This Internal PERC Module is considered the MX version of the PERC cards. This card controls the internal drives on this compute sled. There is a dedicated slot for this PERC near the front of the system. This is not supported if a JUMBO PERC is installed. They use the same SCREW to connect to the chassis.

Image of the Mini-Mezzanine for Fab C
JUMBO PERC

The Jumbo PERC is very unique it does the action of both the Mini-Mezzanin card and the Internal PERC. Not only can this control the internal drives but with also controls the External Storage Arrays that are connected to the Fab C in the back of the MX7000 Enclosure. This is one way to connect to the MX5016s Storage Array. If this is installed, the system does not support the Mini-Mezzanine or the Internal PERC.

BOOT Options & Remote Management

The MX740c has the option to install the OS with the BOSS Module. If you're trying to boot the Hypervisor you can install the IDSDM. These two cards can't be installed together. They take up the same slot. Likewise, you are able to manage the iDRAC Remote Management with One USB 2.0 management port to iDRAC.

Image of the IDSDM
IDSDM

The Internal Dual SD Module supported up to 2 Micro SD cards for redundancy when loading the Hypervisor OS system. This is not suitable for loading a full OS. The Boss card will do that. The IDSDM and the BOSS card can not be installed together.

Image of the BOSS
BOSS

This Boot Optimized Sub System is ideal for loading the OS on to any server. It saves a drive from being allocated for this job and does not take up any PCIe slots. The BOSS and IDSDM can not be installed together.

Storage Controller
Interface Support Cache Memory Size RAID Levels RAID Support MX750c Max Drives Supported
S150 Software RAID 6Gb/s SATA NVMe No Cache 0,1,5,10 Software RAID 6 Internal drive support
HBA350i MX 12Gb/s SAS
6Gb/s SASSATA
3Gb/s SAS/SATA		 N/A N/A N/A 6 Internal drive support
H745P MX 12Gb/s SAS
6Gb/s SATA		 8GB NV 0,1,5,6,10,50,60 Hardware RAID 6 internal, 112 from MX5016s storage sled For use with both internal drives and MX5016s storage sled
H755 MX 12Gb/s SAS 8 GB NV 0,1,5,6,10,50,60 Hardware RAID 6 internal, 112 from MX5016s storage sled For use with both internal drives and MX5016s storage sled
HBA330 mini-mezz 12Gb/s SAS No Cache No RAID Pass-Through Only No RAID SAS HBA 112 For use with MX5016s storage sled

Current Configuration

(List below serves as quick links to each section)

Select Chassis

Select Processor

Select Memory DIMM's

Select RAID Controller

Select Fabric A

Select Fabric B

Select Fabric C

Boot Option | Boot Optimized Storage Subsystem (BOSS)

Boot Option | Internal Dual SD Module (IDSDM)

(2.5") HDD

(2.5") SSD

Select Drive NVMe Gen 4 PCIe

Select Trusted Platform Module (TPM)

Select Warranty

The request has been sent.
Thank you.

Price as Configured:
$0

Error Submitting Cart. Please get in touch with us for support.

Please select all the mandatory items in the configuration list before submitting the cart.

One or more items in your cart has no price. This will be submitted as a "Request for a Quote".

Base Standard Capabilities

FeaturePowerEdge MX750c Technical Specifications
ProcessorUp to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor
Intel C620 series chipset with optional Intel QuickAssist Technology
Memory32 DDR4 DIMM slots, supports RDIMM max 2 TB or LRDIMM max 4 TB, speeds up to 3200 MT/s
Persistent MemorySupports up to 16 Intel Persistent Memory 200 series (BPS) slots with a maximum total capacity of 7.68 TB per sled
AvailabilitySupports registered ECC DDR4 DIMMs only
Controllers
  • Internal controllers: PERC H755 MX, PERC H745P MX, HBA350i MX, S150
  • Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs 240 GB or 480 GB or Internal Dual SD Module (IDSDM) or USB
  • External PERC (RAID): PERC H745P MX
  • External HBAs (non-RAID): HBA330 MMZ
Drive BaysFront bays:
  • Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) 7.68 TB per drive
  • Up to 6 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) 7.68 TB per drive
Power SuppliesMX7000 chassis: Up to six 3000 W AC Platinum PSU and grid redundancy support
FansMX7000 chassis: 5 rear and 4 front-accessible hot-swap fans with full redundancy
DimensionsHeight: 42.15 mm (1.65 inches)
Width: 250.2 mm (9.85 inches)<
Depth: 594.99 mm (23.42 inches)
Form FactorUp to 8 independent hot-swappable, 1U single-width compute sled in a MX7000 chassis
Embedded ManagementMX7000 chassis: OpenManage Enterprise Modular Edition (OME-Modular);
  • Up to 2 redundant MX9002m management modules
  • Unified control: single management point for server, storage, and networking
  • Intelligent automation: Operational template methodology and comprehensive RESTful API
  • Quick Sync 2 Bluetooth Low Energy (BLE)/wireless module
On compute sled:
  • iDRAC9
  • iDRAC Direct
  • iDRAC Service Module
OpenManage Software
  • OpenManage Enterprise
  • OpenManage Power Manager plugin
  • OpenManage SupportAssist plugin
  • OpenManage Update Manager plugin
  • OpenManage Enterprise Modular Edition
Integrations and ConnectionsOpenManage Integrations
  • BMC Truesight
  • Microsoft System Center
  • Red Hat Ansible Modules
  • VMware vCenter and vRealize Operations Manager
OpenManage Connections
  • IBM Tivoli Netcool/OMNIbus
  • IBM Tivoli Network Manager IP Edition
  • Micro Focus Operations Manager i
  • Nagios Core
  • Nagios XI
Integrated Security
  • TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
  • Digitally Signed Firmware
  • Chassis Intrusion Alert
  • Secure Boot
  • Secure Erase
  • Silicon Root of Trust
  • System Lockdown (requires iDRAC Enterprise or Datacenter)
Networking_Options (NDC)MX7000 chassis Fabric options: up to 2 pairs redundant general purpose switch or passthrough modular bays (Fabrics A and B);
redundant pair of storage specific switch bays (Fabric C)
Up to 25 Gb CNA/NIC per port for Mezz A/B, 32 Gb Fibre Channel, 12 Gbps SAS for Mezz C
PortsFront ports
  • 1 x iDRAC Direct port (Micro-AB USB)
  • 1 x USB 3.0
Internal Port
  • 1 x USB 3.0
PCIe
  • One x16 PCIe Gen4 slot for Mezz A – connected to processor 1
  • One x16 PCIe Gen4 slot for Mezz B – connected to processor 2
  • One x16 PCIe Gen4 slot for Mini Mezz card – connected to processor 2
  • One x16 PCIe Gen4 slot for PERC – connected to processor 1
  • Two x8 PCIe Gen4 connectors for NVMe drive – connected to processor 1
  • One x8 PCIe Gen4 connectors for NVMe drive – connected to processor 2
  • Two x4 PCIe Gen3 slot for BOSS M.2 HW RAID card – connected to Platform Controller Hub (PCH)
Operating Systems and Hypervisors
  • Canonical Ubuntu Server LTS
  • Citrix Hypervisor
  • Microsoft Windows Server with Hyper-V
  • Red Hat Enterprise Linux
  • SUSE Linux Enterprise Server
  • VMware ESXi/vSAN

Spec Sheet 4

Feature PowerEdge MX750c PowerEdge MX740c
Processor Up to two 3rd Generation Intel® Xeon® Scalable Processors
DIMM Speed: Up to 3200 MT/s
Up to 40 cores per socket
Max TDP: 270 W		 Up to two Intel® Xeon® Scalable Processors
One or two 2nd Generation Intel® Xeon® Scalable Processors
Up to 28 cores per socket
Max TDP: 205 W
Chipset Intel® C627A Intel® C628
Memory 32 DDR4 DIMM slots
32 slots for RDIMMs and LRDIMMs
Maximum capacity (RDIMM): 2 TB
Maximum capacity (LRDIMM): 8 TB
Intel Optane PMem 200 Series		 24 DIMM slots
12 slots enabled for NVDIMM-N
Maximum capacity (RDIMM): 1.5 TB
Maximum capacity (LRDIMM): 3 TB
Maximum capacity (NVDIMM-N): 192 GB
Intel Optane PMem 100 Series
Storage Controllers S150 Software RAID
HBA350i MX
H745P MX Performance RAID via PERC 10, internal and external drive connect, 8GB NV cache
H755 Performance RAID, NVMe RAID
HBA330 MX mini-mezz, HBA, external drive connect, no cache 		S140 Software RAID
HBA330 MX
H730P MX Performance RAID, 2 GB NV cache
H745P MX Performance RAID, internal and external drive connect, 8 GB NV cache
HBA330 MX mini-mezz, HBA, external drive connect, no cache
Drive Support 2.5-inch 12 Gb SAS
2.5-inch 6 Gb SATA
2.5-inch NVMe		 2.5-inch 12 Gb SAS
2.5-inch 6 Gb SATA
2.5-inch NVMe
Drive Backplanes 6 x 2.5-inch SAS/SATA
6 x 2.5-inch SATA/NVMe (universal BP)
4 x 2.5-inch SAS/SATA/NVMe (universal BP)		 6 x 2.5-inch SAS/SATA
6 x 2.5-inch SAS/SATA/NVMe
4 x 2.5-inch SAS/SATA/NVMe for NVDIMM implementations
Internal Boot Choice of BOSS (Boot Optimized Storage Subsystem) or IDSDM (Internal Dual SD Module) Choice of BOSS (Boot Optimized Storage Subsystem) or IDSDM (Internal Dual SD Module)
I/O Slots Two PCIe 4.0 x16 Mezz slots (Fabric A and B)
One PCIe 4.0 x16 Mini-mezz slot (Fabric C)		 Two PCIe 3.0 x16 Mezz slots (Fabric A and B)
One PCIe 3.0 x16 Mini-mezz slot (Fabric C)
USB One internal USB 3.0 port
One external USB 3.0 port
One USB 2.0 management port to iDRAC
One USB 3.0 + USB 2.0 port for IDSDM		 One internal USB 3.0 port
One external USB 3.0 port
One USB 2.0 management port to iDRAC
One USB 3.0 + USB 2.0 port for IDSDM
Video Integrated VGA controller in iDRAC, VGA over LAN
4 Gb DDR4 shared with iDRAC application memory		 Integrated VGA controller in iDRAC, VGA over LAN
4 Gb DDR4 shared with iDRAC application memory
Management iDRAC9 iDRAC9
Security Optional TPM 1.2/2.0
Cryptographically signed firmware
Silicon Root of Trust
Secure Boot
System Lockdown
System Erase		 Optional TPM 1.2/2.0
Cryptographically signed firmware
Silicon Root of Trust
Secure Boot
System Lockdown
System Erase
Fans In chassis In chassis
Power Supplies Power provided by chassis Power provided by chassis
Chassis MX7000 MX7000

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