Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Heat sinks / Fans / Cooling Modules
Memory
Storage Devices
Storage Batteries
Storage Cables
RAID Settings
Optical Drive / Cables
EDSFF NVMe Drives
Riser Card
OCP Enablement
InfiniBand PCI / OCP
Ethernet Adapter PCIe/OCP
Fibre Channel HBA
GPU
Transceiver
Security
Rail Kit
Power Cooling
ECS Warranty
The request has been sent.
Thank you.
Price as Configured:
$0
Price as Configured:
$0
Tech
-PLEASE CONTACT FOR CUSTOM CONFIGURATIONS. DISK SHELVES, COMPLETE CONFIGURATIONS & TURN KEY SYSTEMS AVAILABLE.
-SPARE PARTS AVAILABLE FOR EACH MODEL. PLEASE ASK FOR PRICING ON SPARE DISK, CONTROLLERS, POWER SUPPLIES, NICs, HBAs, SFPs, Cables, etc.
- New 4th Generation Intel® Xeon® Scalable Processors (Extreme Core Count die/ XCC die; Medium Core Count/ MCC; High Bandwidth Memory/ HBM)
- New PCIe 5.0 support
- New HPE DDR5 SmartMemeory – Registered (RDIMM), 4800MT/s
- New HPE Gen11 Storage Controllers
- New HPE NS204i-u Gen11 NVMe Hot Plug Boot Optimized Storage Device
- New HPE iLO6 support
- New Intel® Virtual RAID on CPU (Intel® VROC) Premium & Standard FIO Software for HPE
- New DL360 Gen11 20EDSFF NC CTO Server
- New DL360 Gen11 Pre-Configured Models
- New HPE NVMe EDSFF E3.s 1T SSD
- New HPE Self-encrypting Drives
- HPE ProLiant DL360 Gen11 Direct Liquid Cooling solution
- HPE 1800W-2200W Flex Slot Titanium Hot Plug Power Supply Kit
- Read the manual below for more new features.
- Cloud Servers
- Corporate IT
- Database
- Data Analytics
- Retail Servers
The HPE ProLiant DL360 Gen11 server is a rack-optimized 1U dense solution that delivers exceptional compute performance, upgraded high-speed data transfer rate, and memory depth with 2P compute capability. Powered by 4th Gen Intel® Xeon® Scalable processors with up to 60 cores, increased memory bandwidth, up to 8 TB of memory, and high-speed PCIe Gen5 I/O, the HPE ProLiant DL360 Gen11 server is a perfect rack-optimized, 1U 2P, dense solution for general-purpose virtualization workloads that require increased compute density with built-in security and flexibility.
The silicon root of trust anchors the server firmware to an HPE-exclusive ASIC, creating an immutable fingerprint for the Secure Intel Processor that must be matched exactly before the server will boot. The HPE ProLiant DL360 Gen11 server is an excellent choice for EDA, CAD, and VDI.
Since this Server is so large and has so many configurations, we have broken it up by chassis to make this information a little easier for you to digest.
4 LFF
8 SFF
8+2 SFF
20x E3.S EDSFF- 20 EDSFF Carrier 1T (EC1) drive bays: 32G x4 NVMe (PCIe5.0 E3.s 1T)
- 20EDSFF backplane and cage are pre-selected, in CTO server.
The DL360 Gen11 supports the 4 th Gen Intel Xeon Processor with up to 80 cores. CTO server will populate necessary fan kits per system thermal requirements and processor models, minimum of 5 standard fans. Dual processor configurations require 7 fans, either standard or high-performance.
EDSFF CTO Model:
If 350W CPU is selected with Closed Loop Liquid cooling, then 256GB DIMM cannot be selected.
If 8470Q Processor is selected with Closed-loop Liquid Cooling, then 4LFF and 20EDSFF CTO Server cannot be selected as backplane is embedded as default. Or DLC module with Performance Fan Kit must be selected.
Some Processors can only be installed in a single socket configuration.
- Gold 6421N Processor
- Gold 6414U Processor
- Gold 5411N Processor
| Processor Suffix | Description | Offering |
|---|---|---|
| H | DB and Analytics | Highest core counts. Database and Analytics usages benefit from DSA and IAA accelerators. |
| M | Media Transcode | Optimized around AVX frequencies to deliver better performance/watt around Media, AI, and HPC workloads. |
| N | Network/5G/Edge (Hight TPT/Low latency) | Designed for NFV and networking workloads, such as: L3 forwarding, 5G UPF, OVS DPDK, VPP FIB router, VPP IPsec, web server/NGINX, vEPC, vBNG, and vCMTS. |
| S | Storage and HCI | Optimized for Storage UMA use cases with increased UPI Bandwidth for vs Mainline SKUs. |
| P | Cloud - IaaS | Designed for cloud IaaS environments to deliver higher frequencies at constrained TDPs. |
| Q | Liquid Cooling | Liquid cooled processors with higher frequency and performance at same TDP. |
| U | One Socket Optimized | Optimized for targeted platforms adequately served by the cores, memory bandwidth and IO capacity. Available from a single processor configuration. |
| V | Cloud- SaaS | Optimized for orchestration efficiency that delivers higher core counts and VMs per rack. |
| Y | Speed Select1 | Intel® SST-Performance Profile (PP) increases base frequency when fewer cores are enabled. Allows greater flexibility, deployment options and platform longevity. |
This DL360 Gen11 20 EDSFF Rack Server Choice of Performance Fan Kits and Closed-loop Liquid Cooling Heatsink Fan FIO Bundle Kit Below is a table showing you the TDP and which Heatsink / Fan system will be supported.
EDSFF Model: If 256GB DIMM and Rear NS204i-u are selected, then DLC Module must be selected.
This DL360 Gen11 Rack Server has many fans and heat sink options based of the TDP of the processor. Below is a table showing you the TDP and which Heatsink / Fan system will be supported.
Closed-loop Liquid Cooling (P48906-B21)
Supports one or two processors go beyond 271W TDP, as a factory installation kit only. Customer self-repair or self-field upgrade is not allowed. If Closed-loop Liquid Cooling HeatSink Fan FIO Bundle Kit is selected, then any Fans (Standard Fan Kit or High Performance Fan Kit) cannot be selected.
Direct Liquid Cooling
DLC CPM from external NS204i-u (P62026-B21)
DLC CPM from PCIe Slot (P62029-B21)
Direct Liquid Cooling Heatsink Fan FIO Bundle Kit
supports two processors go beyond 271W TDP, with enhanced thermal condition
Cooling Option selection in 20 EDSFF CTO Servers
| CPU TDP (Watts) | 125W – 185W | 186W – 270W | 271W – 350W | 350W (LC CPU) | ||
|---|---|---|---|---|---|---|
| CPU Q’ty (2P only) |
2 | 2 | 2 | 2 | 2 | 2 |
| Heatsink | Standard (P48904-B21) | High Performance (P48905-B21) | Closed-loop LC Heatsink and Fan FIO Bundle Kit 3 (P48906-B21) | Direct Liquid Cooling (DLC) Heatsink and High-Performance Fan (P48908-B21) FIO solution | No support, if Closed-loop LC Heatsink and Fan FIO Bundle Kit (P48906-B21) 3 | Direct Liquid Cooling (DLC) Heatsink and High-Performance Fan (P48908-B21) FIO solution |
| Fans | High Performance (P48908-B21) | High Performance (P48908-B21) | High Performance (P48908-B21) | |||
| Max DIMM | 32x128 GB or 16x256GB | 32x 128GB | 32x 256GB | 32x 256GB | ||
| Networking | Up to 10/25GbE PCIe Adapter or OCP | Up to 10/25 GbE | ||||
| External NS204i-u | Available | 25C (10 EDSFF+10 blanks); 28C (4 EDSFF + 16 blanks) Not support, 20C (20 EDSFF); | Available | No support, 20C (20 EDSFF); | Available | |
| Maximum Qty of E3.s 1T drive | 20 | 20 | 10EDSFF + 10blanks | 20 | No support, 0 drive | 20 |
| Support ambient | 30C (no GPU); 25C (Nvidia A2 or L4) | 30C (no GPU); 25C (Nvidia A2 or L4) | 30C (up to 128GB DIMM, no GPU); | 30C (256GB DIMM); 30C (Nvidia A2 or L4); | No support, < 20C | 30C (256GB DIMM); 30C (Nvidia A2 or L4) |
| No support, require 18C (if any Nvidia A2 or L4 GPU), | ||||||
| Limitation of EDSFF drive | Only P57807-B21 (HPE 15.36TB NVMe RI E3S EC1 PM1743 SSD) is limited at 25C | |||||
| Alternatives | Choice of Direct Liquid Cooling (DLC) Heatsink and Fan FIO solution for all processors in 2P Configuration | |||||
| DIMM Blanks | Required, embedded, and shipped as default in all CTO Servers | |||||
Rules, Requirements, and Limitations
Required for all DLC in order to function: HPE Rack, Rack Manifold, CDU, Primary Hose Kit, and Secondary Hose Kit
DLC Module from NS204i-u Cage (P62026-B21)
Both the following are NOT supported.
- HPE DL360 Gen11 NS204i-u Rear Cbl Kit
- Secondary FH Riser
DLC Module from PCIe slot (P62029-B21)
One of the Secondary Risers MUST be installed and the PCIe slot# 3 cannot be used.
Options listed below would require a Performance Fan kit or Direct Liquid Cooling bundle kit to be implemented.
- CPU TDP (as above table shows)
- 256GB DIMM
- NIC and InfiniBand adapters and OCP cards that go beyond 100GbE/200GbE
- NVMe storage (even Qty 1)
- With GPU
- With hot-plug (external) OS Boot Device NS204i-u
Supports Smart Cooling Modules for highest thermal design points (TDPs)
The DL360 Gen11 will support up to 7 fans with fan redundancy built in. One fan rotor failure will place server in degraded mode but fully functional. Two fan rotor failures could provide warning and imminent server shutdown.
Standard Fan Kit (P48907-B21)Dual rotor hot plug Standard Fan kit (includes 5 fans) for processors below 185W TDP.
2P standard Fan Kit (P54697-B21)Dual rotor hot plug 2P Standard Fan Kit (includes 2 fans) for second processor.
Performance Fan Kit (P48908-B21)Dual rotor hot plug High Performance Fan Kit available (includes 7 fans), for one or two processors from 186W to 270W TDP. Or one processor with 300W TDP.
This DL360 Gen 11 can hold up to a total of 8TB of DDR5 memory on 32 DIMMs in a 2-socket configuration. 16 DIMMs per processor.
All DIMMs in a Processor socket must have the same number of ranks (unless explicitly specified otherwise). x8 DIMMs and x4 DIMMs cannot be mixed in the same channel or same Processor socket.
EDSFF Model: If 256GB DIMM and Rear NS204i-u are selected, then DLC Module must be selected.
Rules & Limitations
- All empty DIMM slots must have a HPE DDR4 DIMM Blank Kit (P07818-B21) installed.
- Max capacity (RDIMM) 8.0 TB 32 x 256 GB RDIMM @ 4800 MT/s
- Mixing of DIMM (UDIMM, RDIMM, and LRDIMM) not supported.
- Mixing vendor is allowed for RDIMMs, but it is not allowed for 3DS RDIMMS
- If a 350W CPU is selected with Closed Loop Liquid cooling, then 256GB DIMM cannot be selected.
- If 256GB of Memory is selected, and without DLC Module. Then a high-speed Networking/ InfiniBand card (PCIe and OCP) that is 100G or more cannot be selected.
- If 256GB Memory is selected, will be limited using 7x performance fan or Closed Loop Liquid Cooling fan (not allow standard fan)
Choice of Intel® VROC Software RAID or HPE ProLiant Gen11 MR and SR PCIe or OCP plug-in Controller. If any of these controllers are selected, then "HPE 96W Smart Stg Li-ion Batt 145mm Kit (P01366-B21 )" or "HPE Smart Hybrid Capacitor w/ 145mm Cbl (P02377-B21 )" must be selected. Vice versa. Now if any of these Storage Batteries get selected. They also need the HPE ProLiant DL360 Gen11 Storage Controller Enablement Cable Kit (P48918-B21).
Software RAID Controller (VROC) SATA
- RAID Support- 0/1/5/10.
- Intel® VROC SATA is off by default and must be enabled.
There are a lot of rules with RAID in the PDF Manual. I recommend you read the manual to understand all the requirements and limitations of RAID in this system.
- If "HPE FIO No Smart Storage Battery (P06141-B21 )" is selected, then SR932/ MR416/ MR408 controller must be selected.
- If RAID is selected and both SAS AND SATA drives are configured, then only the SAS drives will be used in the RAID set. (SAS drives must be the same part number; SATA drives can vary in part numbers).
- If RAID is being selected in a configuration with Intel® VROC and an internal controller, then Customer Defined RAID Setting (389692-B21) must be selected.
| Maximum Storage | ||
|---|---|---|
| Storage | Capacity | Configuration |
| Hot Plug SFF SAS HDD | 24.0 TB | 8+2 x 2.4 TB (with optional 2 SFF cage on UMB) |
| Hot Plug SFF SATA HDD | 20.0 TB | 8+2 x 2.0 TB (with optional 2 SFF cage on UMB) |
| Hot Plug SFF SAS SSD | 15.3 TB | 8+2 x 15.36 TB (with optional 2 SFF cage on UMB) |
| Hot Plug SFF SATA SSD | 76.8 TB | 8+2 x 7.68 TB (with optional 2 SFF cage on UMB) |
| Hot Plug SFF U.3 NVMe PCIe SSD | 153.6 TB | 8+2 x 15.36 TB (with optional 2 SFF cage on UMB) |
| Hot Plug LFF SAS HDD | 80.0 TB | 4 x 20 TB |
| Hot Plug LFF SATA HDD | 80.0 TB | 4 x 20 TB |
| Hot Plug LFF SAS SSD | 30.72 TB | 4 x 7.68 TB |
| Hot Plug LFF SATA SSD | 3.84 TB | 4 x 960 GB |
| M.2 NVMe SSD | 960 GB | 2 x 480 GB (shipped with optional HPE NS204i-u Gen11 NVMe Hot Plug Boot Optimized Storage Device ): Available with external or internal version |
| EDSFF MVMe SSD | 307.2TB | 20 x 15.36 TB |
The system can hold up to 3 PCIe 5.0 slots on two risers. The first riser is a default butterfly riser that comes with the chassis. The default riser is controlled by the first CPU and has two PCIe 5.0 x16 slots. Slot 1 is a full-height while slot 2 is a half-height slot.
The second riser has two options to choose from. One option is the FH Riser makes Slot 2 on Riser 1 not available while the LP Riser does make slot 2 available. With the second option, you are able to get all 3 PCIe 5.0 slots integrated.
If you install the NS204i-u Rear Cable Kit (P54702-B21), then slot 2 of riser 1 will not be available since this is where that card can be installed. You do have another option of installing this Ns204i-u internally (P48920-B21). This OS Boot device includes 2x 480GB M.2 NVMe SSDs, with preconfigured hardware RAID1.
EDSFF CTO Model Rules
If Closed Loop Liquid cooling is selected with specific high speed Networking/ InfiniBand, then EDSFF or SFF NVMe drive cannot be selected
If 256GB DIMM and Rear NS204i-u are selected, then DLC Module must be selected.
If “HPE IB NDR200 1p OSFP MCX75310AAS Adptr” is selected with Closed Loop Liquid cooling, then EDSFF drives cannot be selected.
| Riser Information | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Part Number | Description | Riser Position | Slot Bus Width (Gen5 Lanes) |
GPU Support | NVMe Direct Connect | M.2 Connect | ||||
| Prim. | Sec. | #1 | #2 | #3 | Connectors | Max SSDs | ||||
| (default in chassis) | HPE DL360 Gen11 x16/x16 Primary Riser | D | N/A | x16 | x16 | N/A | Y | N/A | N/A | N/A |
| P48901-B21 | HPE ProLiant DL360 Gen11 x16 Full Height Riser Kit |#1 | N/A | O | N/A | N/A |#1 | x16 | Y | N/A | N/A | N/A |
| P48903-B21 | HPE ProLiant DL360 Gen11 x16 LP Riser Kit | N/A | O | N/A | N/A | x16 | Y |#2 | N/A | N/A | N/A |
| 1 #1 | If secondary FH riser is selected, then maximum 2 quantity of PCIe FH cards can be selected, as primary PCIe Slot 2 cannot be used. #2 | GPU max 75W |
||||||||||
| PCIe Expansion Slots | |||||
|---|---|---|---|---|---|
| Primary Riser (default in chassis) | |||||
| Expansion Slots # | Technology | Bus Width | Connector Width | Processor | Slot Form Factor |
| 1 | PCIe 5.0 | x16 | x16 | CPU 1 | Full-height, up to 9.5” length (or half-length card) |
| 2 | PCIe 5.0 | x16 | x16 | CPU 1 | Half-height (Low-profile), up to 9.5” length (or half length card) |
| Secondary Riser | |||||
| 3 | PCIe 5.0 | x16 | x16 | CPU 2 | Full-height, up to 9.5” length (or half-length card). Slot 2 will be not available. |
| Half-height (Low-profile), up to 9.5” length (or up half length card). Slot 2 is available. | |||||
Supports up to 2 single wide (SW) GPUs to accelerate graphic intense workloads. Mixing of different Graphics Option is not allowed. Requires high performance fans.
- R9H23C | NVIDIA A2 16GB PCIe Non-CEC Accelerator for HPE
- S0K89C | NVIDIA L4 24GB PCIe Accelerator for HPE
For GPU selection, pls refer to the support matrix in GPU section
- If the Graphics Option is selected with Processor Wattage is more than 270W, then DLC Module & Performance Fan Kit must be selected.
- If the Nvidia Graphics Option is selected with Closed Loop Liquid cooling, then EDSFF drives cannot be selected.
Software that enables you to securely configure, monitor, and update your HPE ProLiant Gen11 servers seamlessly, from anywhere.
Embedded in Hewlett Packard Enterprise servers, HPE Integrated Lights-Out 6 (iLO 6) is an exclusive core intelligence that monitors server status, providing the means for reporting, ongoing management, service alerting, and local or remote management to quickly identify and resolve issues.
HPE Flexible Slot (Flex Slot) Power Supplies share a common electrical and physical design that allows for hot plug, tool-less installation into HPE ProLiant Gen11 Performance Servers. Flex Slot power supplies are certified for high-efficiency operation and offer multiple power output options, allowing users to "right-size" a power supply for specific server configurations. This flexibility helps to reduce power waste, lower overall energy costs, and avoid "trapped" power capacity in the data center.
Mixing of 2 different power supplies is NOT supported.
- 4LFF CTO model only
- Processors with a TDP of 125W or less are supported.
- Only 1 Processor is supported.
- Max 2 networking/InfiniBand cards can be selected and they cant be x16 cards
- Max 8 DIMMs can be selected
Either option below must be selected and the quantity must match. These cannot be selected together
- "HPE 1600W DC PSU Power Cable Kit (P22173-B21)"
- "HPE 1600W DC PSU Power Lug Option Kit (P36877-B21)"
EDSFF Drives (Height x Width x Depth)
- 29 x 43.46 x 77.31 cm
- 69 x 17.11 x 30.43 in
- 14.56 kg (32.1 lb) - >SFF minimum: One drive, one processor, one power supply, two heatsinks, one Smart Array controller, and five fans.
- 20.44 kg (45.07 lb) - SFF maximum: Ten drives, two processors, two power supplies, two heatsinks, one Smart Array controller, and seven fans.
- 14.75kg (32.51lb) - EDSFF minimum: One drive, two processors, one power supply, two heatsinks, one Smart Array controller, and seven fans.
- 21.19kg (46.71lb) - EDSFF maximum: Twenty drives, two processors, two power supplies, two heatsinks, one Smart Array controller, and seven fans.
Current Configuration
(List below serves as quick links to each section)
Select Chassis
Select Processor
Heat sinks / Fans / Cooling Modules
Memory
Storage Devices
Storage Batteries
Storage Cables
RAID Settings
Optical Drive / Cables
EDSFF NVMe Drives
Riser Card
OCP Enablement
InfiniBand PCI / OCP
Ethernet Adapter PCIe/OCP
Fibre Channel HBA
GPU
Transceiver
Security
Rail Kit
Power Cooling
ECS Warranty
The request has been sent.
Thank you.
Price as Configured:
$0
Base Standard Capabilities
| Technical specifications | HPE ProLiant DL360 Gen11 |
|---|---|
| Processor type | Intel |
| Processor family | 4th Generation Intel® Xeon® Scalable Processors |
| Processor number | 1 or 2 |
| Processor core available | 8 to 60 core depending on processor. |
| Processor cache | 12 - 60 MB L3. depending on processor |
| Processor speed | 3.7 GHz, maximum depending on processor. |
| Power supply type | HPE 500W Flex Slot Platinum Hot Plug Power Supply, HPE 800W Flex Slot Platinum Hot Plug Power Supply, HPE 800W Flex Slot Titanium Hot Plug Power Supply, HPE 1000W Flex Slot Titanium Power Supply, HPE 1600W Flex slot Platinum Hot Plug Power Supply, HPE 1600W DC Power supply, HPE 1600W Flex Slot -48VDC Hot Plug Power Supply, HPE 1800W-2200W Flex Slot Titanium Hot Plug Power Supply (to be available CQ4 2023), depending on model. |
| Expansion slots | Maximum 3 PCIe Gen5 slots and maximum 2 OCP 3.0 PCIe5 slots. |
| Maximum memory | 4.0 TB per socket. when populated with 256 GB DDR5 |
| Memory slots | 16 DIMM slots per socket |
| Memory type | HPE DDR5 SmartMemory |
| Memory protection features | HPE Fast Fault Tolerant Memory Advanced ECC Memory Online Spare Memory Mirrored Memory |
| Optical drive type | Optional - HPE 9.5mm SATA DVD-RW Optical Drive, HPE Mobile USB DVD-RW Drive. |
| System fan features | Standard Fan Kit (Q'ty 5), Standard Fan Kit (Q'ty 2) for 2nd Processor, Performance Fan Kit (Q'ty 7), Close Loop Liquid Cooling Heatsink & Fan kit, Direct Liquid Cooling Solution (Shipment will be available CQ3 2023), depending on model. |
| Network controller | Wide range of speeds, cabling, chipsets and form factors (PCIe stand-up adapter and OCP3.0). Please see QuickSpecs for network card choices. |
| Storage controller | Included - Embedded SATA controller (AHCI or Intel SATA software RAID controller) Optional - HPE Smart Array Gen11 Storage Controller in Variety of protocols -including NVMe-, port count, array utilities, and form factors (PCIe stand-up adapter and OCP3.0). Please see QuickSpecs for storage controllers selection |
| DIMM capacity | 16 GB to 256 GB |
| Infrastructure management | Included - HPE iLO Standard with Intelligent Provisioning (embedded), HPE OneView Standard (requires download). Optional - HPE iLO Advanced, and HPE OneView Advanced |
| Drive supported | Up to 4 LFF SAS/SATA HDDs or SSDs. Up to 8+2 SFF SAS/SATA HDDs or SATA/SAS/NVMe U.3 SSDs, depending on model. Up to 20 EDSFF E3.s 1T NVMe SSD. Up to 2 RAID1 NVMe M.2 Boot device (Internal modular or external accessible from rear wall). |
Spec Sheet 4
| CTO Server | HPE DL360 Gen11 20EDSFF NC CTO Server |
|---|---|
| SKU Number | P52500-B21 |
| TAA SKU | P52500-B21#GTA |
| HPE Trusted Supply Chain | Optional: HPE Trusted Supply Chain for HPE ProLiant (P36394-B21) |
| Processor | Not included as standard. Optional: Qty 1 or 2 (2 processors must be selected in 20EDSFF NC CTO Server) |
| DIMM Slots | 32-DIMM slots |
| DIMM Blanks | DIMM Blanks are required, embedded and shipped as default in all CTO Servers |
| Storage Controller | Choice of Intel® VROC Software RAID capable Choice of HPE ProLiant external hardware controller **Internal Hardware Controller support is not available |
| PCIe Slots | Up to 3 Slots PCIe 5.0 (Slot 1, 2 &3) One standard primary/butterfly riser: 2 slots as Slot 1 & Slot 2 (1 x16 FH / 1 x16 LP) and 4 x8 front NVMe connectors Optional: Slot 3 in 1 x16 FH or LP slot All PCIe Slos are in design with up to 9.5” length |
| OCP3.0 Slots | PCIe 5.0: 2 slots (1x8/ 1x8) |
| Drive Cage – included | 20EDSFF – default backplane. 32G x4 NVMe, with E3.s 1T carrier (EC1) support. (PCIe5.0 storage) |
| Network Controller | "BCM 5719 1Gb 4p BASE-T OCP Adptr" to be defaulted in the configurator at OCP Slot 21.
Customer is allowed to remove and select other cards (PCIe of OCP) from Networking, InfiniBand,
Smart IO (HW) or Storage Offload category. Choice of OCP3.0 or stand-up cards for primary networking selection plus additional/optional stand-up networking adapters. Notes: − No embedded networking from motherboard. − In 1 Processor configuration, “CPU1 to OCP2 x8 Enablement Kit” will be selected as default as OCP NIC is pre-selected at OCP Slot 2, to be defaulted in the configurator if 1 Processor is selected. Customer is allowed to remove if OCP NIC is not selected but need to be replaced by a PCIe standup NIC. Meanwhile, the “CPU1 to OCP2 x8 Enablement Kit” will be removed. − “CPU2 to OCP2 x8 Enablement Kit” or “CPU2 to OCP2 x16 Enablement Kit” must be selected if OCP NIC is selected in 2 Processors configuration. − “CPU2 to OCP2 x8 Enablement Kit” to be defaulted in the configurator if 2 Processors are selected. User should be allowed to remove “CPU2 to OCP2 x8 Enablement Kit” and should be forced select “CPU2 to OCP2 x16 Enablement Kit” if OCP NIC is selected. Customer is allowed to remove if OCP NIC is not selected but need to be replaced by a PCIe standup NIC. Meanwhile, the “CPU2 to OCP2 x8 Enablement Kit” will be removed. − In 20EDSFF CTO model, either no OCP enablement kit or “CPU2 to OCP2 x8 Enablement Kit” can be selected from the limited PCIe5.0 electrical lanes from OCP Slot 1 (x8) and OCP Slot2 (x8). |
| Fans | Choice of
|
| Management | HPE iLO with Intelligent Provisioning (standard) HPE GreenLake for Compute Ops Management (a 3-year subscription included) Optional: iLO Advanced and OneView |
| Video Output | Rear: 1 VGA Optional:
|
| USB | Front: 1 USB 3.2 Gen1 + iLO service port Rear: 2 USB 3.2 Gen1 Internal: 1 USB 3.2 Gen1 + 1 USB2.0 Optional: 1 Front USB 2.0 |
| Security | Trusted Platform Module (TPM) 2.0. It is an embedded feature and can be disabled in the BIOS
setting. Notes: Disabled for shipments to China |
| Rail Kit | Optional Easy Install rails and CMA
|
| Form Factor | 1U Rack |