SKU: PW17Y

Dell PowerEdge R660 8x 2.5" Backplane | PW17Y

Name: Dell PowerEdge R660 8x 2.5" Backplane | PW17Y
Brand: Dell
SKU: PW17Y
Availability: OutOfStock

Dell

| Backplane Kit

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Quick Specs

Form Factor: 1U rack chassis
Drive Bays: 8 x 2.5-inch SAS/SATA/NVMe
Max Storage Capacity: 122.88 TB
Power Supplies: 2x redundant AC or DC (up to 2000W Platinum/Titanium)
Cooling: Air-cooled with up to 4 fans, optional Direct Liquid Cooling
Expansion Slots: Up to 2x PCIe Gen5
Rail Kit: ReadyRails II sliding rails with optional cable management arm
Management: Integrated iDRAC10

Part Number:

PW17Y

Compatible With:

Dell PowerEdge R660

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Base Standard Capabilities

Feature	Technical Specifications
Processor	Up to two 4th Generation Intel Xeon Scalable processors, with up to 56 cores and optional Intel® QuickAssist Technology.
Memory	32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 4800 MT/s Supports registered ECC DDR5 DIMMs only
Storage controllers	Internal Controllers (RAID): PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSD drives, or USB External HBAs (non-RAID): HBA355e Software RAID: S160
Drive Bays	Front bays: Up to 10 x 2.5-inch, SAS/SATA/NVMe (HDD/SSD) max 153.6 TB Up to 8 x 2.5-inch, SAS/SATA/NVMe, (HDD/SSD) max 122.88 TB Rear bays: Up to 2 x 2.5-inch, SAS/SATA/NVMe, max 30.72 TB
Power Supplies	1800W Titanium 200—240 VAC or 240 HVDC, hot swap with full redundant 1400W Platinum 100—240 VAC or 240 HVDC, hot swap with full redundant 1100W Titanium 100—240 VAC or 240 HVDC, hot swap with full redundant 1100W LVDC -48 — -60 VDC, hot swap with full redundancy 800W Platinum 100—240 VAC or 240 HVDC, hot swap with full redundant 700 W Titanium 200—240 VAC or 240 HVDC, hot swap with full redundant
Cooling Options	Air cooling Optional Direct Liquid Cooling (DLC) Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
Fans	Standard (STD) fans/High performance Gold (VHP) fans Up to 4 sets (dual fan module) hot plug fans
Dimensions	Height – 42.8 mm (1.68 inches) Width – 482 mm (18.97 inches) Depth – 822.88 mm (32.39 inches) with bezel -809.04 mm (31.85 inches) without bezel
Form Factor	1 U rack server
Embedded Management	iDRAC9 iDRAC Direct iDRAC RESTful API with Redfish iDRAC Service Module Quick Sync 2 wireless module
Bezel	Optional LCD bezel or security bezell
OpenManage Software	OpenManage Enterprise OpenManage Power Manager plugin OpenManage Service plugin OpenManage Update Manager plugin CloudIQ for PowerEdge plug in OpenManage Enterprise Integration for VMware vCenter OpenManage Integration for Microsoft System Center OpenManage Integration with Windows Admin Center
Mobility	OpenManage Mobile
OpenManage Integrations	BMC Truesight Microsoft System Center OpenManage Integration with ServiceNow Red Hat Ansible Modules Terraform Providers VMware vCenter and vRealize Operations Manager
Security	Cryptographically signed firmware Data at Rest Encryption (SEDs with local or external key mgmt) Secure Boot Secure Erase Secured Component Verification (Hardware integrity check) Silicon Root of Trust System Lockdown (requires iDRAC9 Enterprise or Datacenter) TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
Embedded NIC	2 x 1 GbE LOM card (optional)
Network options	1 x OCP card 3.0 (optional) Note: The system allows either LOM card or an OCP card or both to be installed in the system.
GPU Options	Up to 2* x 75 W SW
Ports	Front Ports 1 x iDRAC Direct (Micro-AB USB) port 1 x USB 2.0 1 x VGA	Rear Ports 1 x Dedicated iDRAC Ethernet port 1 x USB 2.0 1 x USB 3.0 1 x Serial (optional) 1 x VGA (optional for Direct Liquid Cooling configuration)
Ports	Internal Ports 1 x USB 3.0 (optional)
PCIe	Up to three PCIe slots : Slot 1 : 1 x16 Gen5 Full height, 3/4 length, Half length or 1 x8/ 1 x16 Gen 5 or 1 x16 Gen 4 Low profile, Half length Slot 2 : 1 x16 Gen5 Full height, 3/4 length, Half length or 1 x16 Gen 5 or 1 x16 Gen 4 Low profile, Half length Slot 3 : 1 x8/ 1 x16 Gen 5 or 1 x16 Gen 4 Low profile, Half length
Operating System and Hypervisors	Canonical Ubuntu Server LTS Microsoft Windows Server with Hyper-V Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware ESXi

Spec Sheet 4

Rack Server	R760	R660	R7625	R6625	R7615	R6615
Key attributes	Provides performance and versatility for demanding applications	Provides performance and versatility for demanding applications	Breakthrough performance	Breakthrough performance	Powerful performance and scalability	Peak performance and excellent TCO
Target workloads	Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure	High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization	High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization	High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization	Software-Defined Storage (SDS), Virtualization, Data Analytics	Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV)
Type of processor	2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor		2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor		1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores
Memory (DDR5 DIMM slots & max)	32 (8 TB)		24 (1.5 TB*)		12 (768 GB*)
Disk drives up to:	12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5” (rear)	8 x 2.5” 10 x 2.5” 2 x 2.5” (rear)	8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear)	4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear)	8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear)	4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear)
NVMe drives up to:	24	10	24	10	24	10
Gen5 PCIe slots up to:	4	2	4	2	4	2
Gen4 PCIe slots up to:	8	3	8	3	4	3
Accelerator support up to:	2 x 350 W DW or 6 x 75 W SW	2** x 75 W SW	2 x 300 W DW or 6 x 75 W SW	3 x 75 W SW	3 x 300 W DW or 6 x 75 W SW	3 x 75 W SW
Rack height (U)	2	1	2	1	2	1
Integrated security	TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks.			TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV)
* Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615. ** Future releases will include additional GPU slots in R660.

Dell PowerEdge R660 8x 2.5" Backplane | PW17Y

Quick Specs

Part Number:

Base Standard Capabilities

Spec Sheet 4

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