Specs
Quick Specs
Form Factor:
1U rack server
Processor | Max: 128 Cores1x 4th Gen AMD 9004 Series
Memory | Max: 3TB12 ECC DDR5 RDIMM 4800Mhz
Storage | Max: 153.6TB4 LFF SAS/SATA (HDD/SSD) | Max: 80TB
Rear Drives | Max: 30.72TB2 SFF SAS/SATA (HDD/SSD) NVMe | Max: 30.72TB
2 EDSFF E3.S Gen5 NVMe (SSD) | Max: 15.36TB
S160 (SW RAID)
H965i, H755, H755N, H355, HBA355i, HBA355e, HBA465e, H965e
BOSS-N1 (hot Swap), USB
Networking Options (NOC):1 x OCP card 3.0 + 2 x 1 GbE LOM card
Note: The system allows either LOM card or an OCP card or both to be installed in the system.
iDRAC9 with Lifecycle Controller
PCIe Slots:2x or 3x PCIe 4.0 & 5.0
GPU:Up to 2 x 75 W SW
Ideal for:
- Hyper-Converged infrastructure (HCI)
- Network Function Virtualization (NFV)
- Virtualization
The new Dell PowerEdge R6615 is a 1U, single-socket rack server. Designed to be the best investment per dollar for your data center, this server provides performance and flexible, low-latency storage options in an air or Direct Liquid Cooling (DLC) configuration. Stay ahead of the curve Delivering breakthrough innovation for traditional and emerging workloads, including dense virtualization, hyper-converged infrastructure (HCI), and Network Function Virtualization (NFV) with OpenStack for Telco using the latest performance and density with optional acceleration
Invest wisely in a platform that grows with your business:
- Using AMD EPYC 4th generation processor to deliver up to 50% more core count per single socket platform in an innovative air-cooled blueprint.
- Enables DDR5 at 4800 MT/s memory and PCIe Gen5 with double the speed of previous Gen4 for faster access and transport of data optimizing application output.
- Optional DLC is available to more efficiently cool high-performance processors.
Experience more virtual machine density to support the most demanding applications
- Deliver more virtual machines per physical host using increased core count and higher memory footprint than previous generations.
- Improve responsiveness or reduce app load time for power users with up to 2 x single-wide half-length GPUs.
Expect increased expandability by storing more data in one server, saving space in your data center.
- Deliver more memory density with DDR5 (up to 3TB of RAM) providing greater memory capacity.
- Support lower latency higher performance NVMe SSD in a hardware RAID solution helps maximize compute performance
Cyber Resilient Architecture for Zero Trust IT environment & operations
Security is integrated into every phase of the PowerEdge lifecycle, including protected supply chain and factory-to-site integrity assurance. Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor Authentication (MFA) and role-based access controls ensure trusted operations
The R6615 is supported by One AMD EPYC 4th Generation 9004 Series with up to 128 cores processor and 12 DIMMS of DDR5 Memory. This system only supports registered ECC DDR5 DIMMs. The system also come with the option to install a Boot Device. The BOSS-N1 boot device supports HWRIAD for 2x M.2 NVMe SSDs.
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Base Standard Capabilities
| Feature | Technical Specifications | ||
|---|---|---|---|
| Processors | One AMD EPYC 4th Generation 9004 Series with up to 128 cores | ||
| Memory | • 12 DDR5 DIMM slots, supports RDIMM 3 TB max, speed up to 4800 MT/s • Supports registered ECC DDR5 DIMMs only | ||
| Storage Controllers: | • Internal Controllers (RAID) PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i • Internal Boot: Boot Optimized Storage Subsystem (BOSS-N1): HWRAID 2 x M.2 NVMe SSDs or USB • External HBA (non-RAID): HBA355e • Software Raid: S160 | ||
| Drive Bays | Front bays: • Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max 80 TB • Up to 8 x 2.5-inch NVMe (SSD) max 122.88 TB • Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 153.6 TB • Up to 14 x EDSFF E3.S Gen5 NVMe (SSD) max 107.52 TB • Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) max 122.88 TB Rear bays: • Up to 2 x 2.5-inch SAS/SATA (HDD/SSD) max 30.72 TB • Up to 2 x EDSFF E3.S Gen5 NVMe (SSD) max 15.36 T | ||
| Power Supplies | • 1800 W Titanium 200–240 V AC or 240 HVDC, hot swap redundant • 1400 W Platinum 100–240 V AC or 240 HVDC, hot swap redundant • 1100 W Titanium 100–240 V AC or 240 HVDC, hot swap redundant • 1100 W LVDC -48 – -60 VDC hot swap redundant • 800 W Platinum 100–240 V AC or 240 HVDC, hot swap redundant • 700 W Titanium 200–240 V AC or 240 HVDC, hot swap redundant | ||
| Cooling Options | • Air cooling • Optional Direct Liquid Cooling (DLC) Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate. | ||
| Fans | • Standard (STD) fans/High performance GOLD (VHP) fans • Up to 4 sets (dual fan module) hot plug fans | ||
| Dimensions | • Height – 42.8 mm (1.685 inches) • Width – 482 mm (18.97 inches) • Depth – 822.89 mm (32.39 inches) with bezel -------809.05 mm (31.85 inches) without bezel | ||
| Form Factor | 1U rack server | ||
| Embedded Management | • iDRAC9 • iDRAC Direct • iDRAC RESTful API with Redfish • iDRAC Service Module • Quick Sync 2 wireless module | ||
| Bezel | Optional LCD bezel or security bezel | ||
| OpenManage Software | • OpenManage Enterprise • OpenManage Power Manager plugin • OpenManage Service plugin • OpenManage Update Manager plugin • CloudIQ for PowerEdge plug in • OpenManage Enterprise Integration for VMware vCenter • OpenManage Integration for Microsoft System Center • OpenManage Integration with Windows Admin Center | ||
| Mobility | OpenManage Mobile | ||
| OpenManage Integrations | • BMC Truesight • Microsoft System Center • OpenManage Integration with ServiceNow • Red Hat Ansible Modules • Terraform Providers • VMware vCenter and vRealize Operations Manager | ||
| Security | • AMD Secure Encrypted Virtualization (SEV) • AMD Secure Memory Encryption (SME) • Cryptographically signed firmware • Data at Rest Encryption (SEDs with local or external key mgmt) • Secure Boot • Secured Component Verification (Hardware integrity check) • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ | ||
| Embedded NIC | 2 x 1 GbE LOM card (optional) | ||
| Network Options | 1 x OCP card 3.0 (optional) Note: The system allows either LOM card or an OCP card or both to be installed in the system. | ||
| GPU Options | Up to 2 x 75 W SW | ||
| Ports | Front Ports • 1 x iDRAC Direct (Micro-AB USB) port • 1 x USB 2.0 • 1 x VGA | Rear Ports • 1 x Dedicated iDRAC Ethernet port • 1 x USB 3.0 • 1 x USB 2.0 • 1 x Serial (optional) • 1 x VGA (optional for Direct Liquid Cooling configuration) | |
| Internal Ports • 1 x USB 3.0 (optional) | |||
| PCIe | Up to three PCIe slots: • Slot 1: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length or 1 x8 Gen4 Low profile, Half length • Slot 2: 1 x16 Gen4 Low profile, Half length or 1 x16 Gen5 Full height, Half length or 1 x8 Gen4 Low profile, Half length • Slot 3: 1 x16 Gen5 or 1 x16 Gen4 Low profile, Half length | ||
| Operating System and Hypervisors | • Microsoft Windows Server with Hyper-V • Red Hat Enterprise Linux • SUSE Linux Enterprise Server • VMware ESXi | ||
Spec Sheet 4
| Rack Server | R760 | R660 | R7625 | R6625 | R7615 | R6615 |
|---|---|---|---|---|---|---|
| Key attributes | Provides performance and versatility for demanding applications | Provides performance and versatility for demanding applications | Breakthrough performance | Breakthrough performance | Powerful performance and scalability | Peak performance and excellent TCO |
| Target workloads | Mixed Workload Standardization Database and Analytics Virtual Desktop Infrastructure | High Density Virtualization, Dense Database Analytics, Mixed Workload Standardization | High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization | High Performance Computing (HPC), Virtual Desktop Infrastructure (VDI), Virtualization | Software-Defined Storage (SDS), Virtualization, Data Analytics | Virtualization, Hyper-Converged Infrastructure (HCI), Network Functions Virtualization (NFV) |
| Type of processor | 2 x 4th Generation Intel® Xeon® Scalable processors; up to 56 cores per processor | 2 x AMD EPYC™ 4th Generation 9004 Series Processor, up to 96 cores per processor | 1 x AMD EPYC™ 4th Generation 9004 series processor; up to 96 cores | |||
| Memory (DDR5 DIMM slots & max) | 32 (8 TB) | 24 (1.5 TB*) | 12 (768 GB*) | |||
| Disk drives up to: | 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5” (rear) |
8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear) |
4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
8 x 3.5” 12 x 3.5” 8 x 2.5” 16 x 2.5” 24 x 2.5” 2 x 2.5” or 4 x 2.5”(rear) |
4 x 3.5” 8 x 2.5” 10 x 2.5” 2 x 2.5” (rear) |
| NVMe drives up to: | 24 | 10 | 24 | 10 | 24 | 10 |
| Gen5 PCIe slots up to: | 4 | 2 | 4 | 2 | 4 | 2 |
| Gen4 PCIe slots up to: | 8 | 3 | 8 | 3 | 4 | 3 |
| Accelerator support up to: | 2 x 350 W DW or 6 x 75 W SW | 2** x 75 W SW | 2 x 300 W DW or 6 x 75 W SW | 3 x 75 W SW | 3 x 300 W DW or 6 x 75 W SW | 3 x 75 W SW |
| Rack height (U) | 2 | 1 | 2 | 1 | 2 | 1 |
| Integrated security | TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Chassis Intrusion Alert, Secure Boot being standard security, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), Data at Rest Encryption (SEDs with local or external key mgmt) Secured Component Verification (Hardware integrity check) and System Erase on all racks. | TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ, Cryptographically Signed Firmware, Secure Boot, Secure Erase, Silicon Root of Trust, System Lockdown (requires iDRAC9 Enterprise or Datacenter), AMD Secure Memory Encryption (SME) and AMD Secure Encrypted Virtualization (SEV) | ||||
| * Future releases will include additional system capacity for DDR5 memory in R7625, R6625, R7615 and R6615. ** Future releases will include additional GPU slots in R660. |
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