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Base Standard Capabilities
| Feature | PowerEdge MX750c Technical Specifications | |
|---|---|---|
| Processor | Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor Intel C620 series chipset with optional Intel QuickAssist Technology | |
| Memory | 32 DDR4 DIMM slots, supports RDIMM max 2 TB or LRDIMM max 4 TB, speeds up to 3200 MT/s | |
| Persistent Memory | Supports up to 16 Intel Persistent Memory 200 series (BPS) slots with a maximum total capacity of 7.68 TB per sled | |
| Availability | Supports registered ECC DDR4 DIMMs only | |
| Controllers |
| |
| Drive Bays | Front bays:
| |
| Power Supplies | MX7000 chassis: Up to six 3000 W AC Platinum PSU and grid redundancy support | |
| Fans | MX7000 chassis: 5 rear and 4 front-accessible hot-swap fans with full redundancy | |
| Dimensions | Height: 42.15 mm (1.65 inches) Width: 250.2 mm (9.85 inches)< Depth: 594.99 mm (23.42 inches) | |
| Form Factor | Up to 8 independent hot-swappable, 1U single-width compute sled in a MX7000 chassis | |
| Embedded Management | MX7000 chassis: OpenManage Enterprise Modular Edition (OME-Modular);
| |
| OpenManage Software |
| |
| Integrations and Connections | OpenManage Integrations
| OpenManage Connections
|
| Integrated Security |
| |
| Networking_Options (NDC) | MX7000 chassis Fabric options: up to 2 pairs redundant general purpose switch or passthrough modular bays (Fabrics A and B); redundant pair of storage specific switch bays (Fabric C) Up to 25 Gb CNA/NIC per port for Mezz A/B, 32 Gb Fibre Channel, 12 Gbps SAS for Mezz C | |
| Ports | Front ports
| Internal Port
|
| PCIe |
| |
| Operating Systems and Hypervisors |
| |
Compare Servers
| Feature | PowerEdge MX750c | PowerEdge MX740c |
|---|---|---|
| Processor | Up to two 3rd Generation Intel® Xeon®
Scalable Processors DIMM Speed: Up to 3200 MT/s Up to 40 cores per socket Max TDP: 270 W | Up to two Intel® Xeon® Scalable
Processors One or two 2nd Generation Intel® Xeon® Scalable Processors Up to 28 cores per socket Max TDP: 205 W |
| Chipset | Intel® C627A | Intel® C628 |
| Memory | 32 DDR4 DIMM slots 32 slots for RDIMMs and LRDIMMs Maximum capacity (RDIMM): 2 TB Maximum capacity (LRDIMM): 8 TB Intel Optane PMem 200 Series | 24 DIMM slots 12 slots enabled for NVDIMM-N Maximum capacity (RDIMM): 1.5 TB Maximum capacity (LRDIMM): 3 TB Maximum capacity (NVDIMM-N): 192 GB Intel Optane PMem 100 Series |
| Storage Controllers | S150 Software RAID HBA350i MX H745P MX Performance RAID via PERC 10, internal and external drive connect, 8GB NV cache H755 Performance RAID, NVMe RAID HBA330 MX mini-mezz, HBA, external drive connect, no cache | S140 Software RAID HBA330 MX H730P MX Performance RAID, 2 GB NV cache H745P MX Performance RAID, internal and external drive connect, 8 GB NV cache HBA330 MX mini-mezz, HBA, external drive connect, no cache |
| Drive Support | 2.5-inch 12 Gb SAS 2.5-inch 6 Gb SATA 2.5-inch NVMe | 2.5-inch 12 Gb SAS 2.5-inch 6 Gb SATA 2.5-inch NVMe |
| Drive Backplanes | 6 x 2.5-inch SAS/SATA 6 x 2.5-inch SATA/NVMe (universal BP) 4 x 2.5-inch SAS/SATA/NVMe (universal BP) | 6 x 2.5-inch SAS/SATA 6 x 2.5-inch SAS/SATA/NVMe 4 x 2.5-inch SAS/SATA/NVMe for NVDIMM implementations |
| Internal Boot | Choice of BOSS (Boot Optimized Storage Subsystem) or IDSDM (Internal Dual SD Module) | Choice of BOSS (Boot Optimized Storage Subsystem) or IDSDM (Internal Dual SD Module) |
| I/O Slots | Two PCIe 4.0 x16 Mezz slots (Fabric A
and B) One PCIe 4.0 x16 Mini-mezz slot (Fabric C) | Two PCIe 3.0 x16 Mezz slots (Fabric A
and B) One PCIe 3.0 x16 Mini-mezz slot (Fabric C) |
| USB | One internal USB 3.0 port One external USB 3.0 port One USB 2.0 management port to iDRAC One USB 3.0 + USB 2.0 port for IDSDM | One internal USB 3.0 port One external USB 3.0 port One USB 2.0 management port to iDRAC One USB 3.0 + USB 2.0 port for IDSDM |
| Video | Integrated VGA controller in iDRAC, VGA
over LAN 4 Gb DDR4 shared with iDRAC application memory | Integrated VGA controller in iDRAC, VGA
over LAN 4 Gb DDR4 shared with iDRAC application memory |
| Management | iDRAC9 | iDRAC9 |
| Security | Optional TPM 1.2/2.0 Cryptographically signed firmware Silicon Root of Trust Secure Boot System Lockdown System Erase | Optional TPM 1.2/2.0 Cryptographically signed firmware Silicon Root of Trust Secure Boot System Lockdown System Erase |
| Fans | In chassis | In chassis |
| Power Supplies | Power provided by chassis | Power provided by chassis |
| Chassis | MX7000 | MX7000 |
