Specs
Quick Specs
Form Factor:
Single Width Compute Sled
Processor | Max: 40 Cores2 x 3rd Gen Intel Xeon Scalable
Memory | Max: 2TB RDIMM | 4TB LRDIMM- 32 DDR4 RDIMM/LRDIMM 3200Mhz
- Supports 16 Optane Pmem 200 Series Max: 7.68TB
6 SFF SAS/SATA/NVMe HDD/SSD
Storage Controllers:S150 (SW RAID 6Gb/s SATA/NVMe)
PERC H755 MX, H745P MX (Jumbo), HBA350i MX, HBA330 MX Mini-Mezzanine
BOSS-S1 Module
IDSDM
USB
iDRAC9 with Lifecycle Controller
Ideal for:
- Data Analytics
- Database
- Virtualization
MX7000 Supported Sled Options
Dell PowerEdge MX Series
- Dell PowerEdge MX7000 Modular CTO Enclosure Chassis
-
Dell PowerEdge MX740c CTO Compute Sled Up to 8
- Dell PowerEdge MX750c CTO Compute Sled Up to 8
- Dell PowerEdge MX760c CTO Compute Sled Up to 8
- Dell PowerEdge MX840c CTO Compute Sled Up to 4
- Dell PowerEdge MX5016s CTO Storage Sled Up to 7 Requires a minimum of 1 compute node in a chassis with storage sleds
Each Node is a separate CTO you must configure.
MX750c Features
A fully configurable single-width compute sled powered by up to two-40 core 3rd Generation Intel® Xeon® Scalable processors. Each PowerEdge MX750c supports 32 DDR4 DIMM slots and up to six 2.5-inch SAS/SATA (HDD/SDD) or Express Flash NVMe PCIe SSDs drives. A maximum of eight MX750c servers can be installed in the PowerEdge MX7000 chassis.
- Flexible memory configurations from capacities of up to 4 TB
- Supports up to 16 slots for Second Generation Intel® Optane™ DC persistent memory DCPMM
- Choice of optional M.2 Boot Optimized Storage Solution (BOSS) or Internal Dual microSD Module (IDSDM), to
- streamline operating system and data storage
- Option of Express Flash NVMe PCIe SSD for high-performing direct attached storage requirements
- This makes the PowerEdge MX750 an ideal server for organizations:
- looking for leading-edge performance for virtualization, containers, software-defined storage and software-defined
- networking and database analytics
- seeking to commit to Dell EMC’s vision that leads toward Composable Disaggregated Infrastructure (CDI)
Increase operations with autonomous collaboration
The Dell EMC OpenManage systems management portfolio tames the complexity of managing and securing IT infrastructure. OpenManage Enterprise – Modular is specifically designed to enable customers that enjoy the benefits of a multi-chassis management approach found uniquely in the MX solution. Using Dell Technologies’ intuitive end-to-end tools, IT can deliver a secure, integrated experience by reducing process and information silos in order to focus on growing the business. The Dell EMC OpenManage portfolio is the key to your innovation engine, unlocking the tools and automation that help you scale, manage, and protect your technology environment.
- Built-in telemetry streaming, thermal management, and RESTful API with Redfish offer streamlined visibility and
- control for better server management
- Intelligent automation lets you enable cooperation between human actions and system capabilities for added
- productivity
- Integrated change management capabilities for update planning and seamless, zero-touch configuration and
- implementation
- Full-stack management integration with Microsoft, VMware, ServiceNow, Ansible and many other tools
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Base Standard Capabilities
| Feature | PowerEdge MX750c Technical Specifications | |
|---|---|---|
| Processor | Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor Intel C620 series chipset with optional Intel QuickAssist Technology | |
| Memory | 32 DDR4 DIMM slots, supports RDIMM max 2 TB or LRDIMM max 4 TB, speeds up to 3200 MT/s | |
| Persistent Memory | Supports up to 16 Intel Persistent Memory 200 series (BPS) slots with a maximum total capacity of 7.68 TB per sled | |
| Availability | Supports registered ECC DDR4 DIMMs only | |
| Controllers |
| |
| Drive Bays | Front bays:
| |
| Power Supplies | MX7000 chassis: Up to six 3000 W AC Platinum PSU and grid redundancy support | |
| Fans | MX7000 chassis: 5 rear and 4 front-accessible hot-swap fans with full redundancy | |
| Dimensions | Height: 42.15 mm (1.65 inches) Width: 250.2 mm (9.85 inches)< Depth: 594.99 mm (23.42 inches) | |
| Form Factor | Up to 8 independent hot-swappable, 1U single-width compute sled in a MX7000 chassis | |
| Embedded Management | MX7000 chassis: OpenManage Enterprise Modular Edition (OME-Modular);
| |
| OpenManage Software |
| |
| Integrations and Connections | OpenManage Integrations
| OpenManage Connections
|
| Integrated Security |
| |
| Networking_Options (NDC) | MX7000 chassis Fabric options: up to 2 pairs redundant general purpose switch or passthrough modular bays (Fabrics A and B); redundant pair of storage specific switch bays (Fabric C) Up to 25 Gb CNA/NIC per port for Mezz A/B, 32 Gb Fibre Channel, 12 Gbps SAS for Mezz C | |
| Ports | Front ports
| Internal Port
|
| PCIe |
| |
| Operating Systems and Hypervisors |
| |
Spec Sheet 4
| Feature | PowerEdge MX750c | PowerEdge MX740c |
|---|---|---|
| Processor | Up to two 3rd Generation Intel® Xeon®
Scalable Processors
DIMM Speed: Up to 3200 MT/s Up to 40 cores per socket Max TDP: 270 W |
Up to two Intel® Xeon® Scalable
Processors
One or two 2nd Generation Intel® Xeon® Scalable Processors Up to 28 cores per socket Max TDP: 205 W |
| Chipset | Intel® C627A | Intel® C628 |
| Memory | 32 DDR4 DIMM slots
32 slots for RDIMMs and LRDIMMs Maximum capacity (RDIMM): 2 TB Maximum capacity (LRDIMM): 8 TB Intel Optane PMem 200 Series |
24 DIMM slots
12 slots enabled for NVDIMM-N Maximum capacity (RDIMM): 1.5 TB Maximum capacity (LRDIMM): 3 TB Maximum capacity (NVDIMM-N): 192 GB Intel Optane PMem 100 Series |
| Storage Controllers | S150 Software RAID
HBA350i MX H745P MX Performance RAID via PERC 10, internal and external drive connect, 8GB NV cache H755 Performance RAID, NVMe RAID HBA330 MX mini-mezz, HBA, external drive connect, no cache |
S140 Software RAID
HBA330 MX H730P MX Performance RAID, 2 GB NV cache H745P MX Performance RAID, internal and external drive connect, 8 GB NV cache HBA330 MX mini-mezz, HBA, external drive connect, no cache |
| Drive Support | 2.5-inch 12 Gb SAS
2.5-inch 6 Gb SATA 2.5-inch NVMe |
2.5-inch 12 Gb SAS
2.5-inch 6 Gb SATA 2.5-inch NVMe |
| Drive Backplanes | 6 x 2.5-inch SAS/SATA
6 x 2.5-inch SATA/NVMe (universal BP) 4 x 2.5-inch SAS/SATA/NVMe (universal BP) |
6 x 2.5-inch SAS/SATA
6 x 2.5-inch SAS/SATA/NVMe 4 x 2.5-inch SAS/SATA/NVMe for NVDIMM implementations |
| Internal Boot | Choice of BOSS (Boot Optimized Storage Subsystem) or IDSDM (Internal Dual SD Module) | Choice of BOSS (Boot Optimized Storage Subsystem) or IDSDM (Internal Dual SD Module) |
| I/O Slots | Two PCIe 4.0 x16 Mezz slots (Fabric A
and B)
One PCIe 4.0 x16 Mini-mezz slot (Fabric C) |
Two PCIe 3.0 x16 Mezz slots (Fabric A
and B)
One PCIe 3.0 x16 Mini-mezz slot (Fabric C) |
| USB | One internal USB 3.0 port
One external USB 3.0 port One USB 2.0 management port to iDRAC One USB 3.0 + USB 2.0 port for IDSDM |
One internal USB 3.0 port
One external USB 3.0 port One USB 2.0 management port to iDRAC One USB 3.0 + USB 2.0 port for IDSDM |
| Video | Integrated VGA controller in iDRAC, VGA
over LAN
4 Gb DDR4 shared with iDRAC application memory |
Integrated VGA controller in iDRAC, VGA
over LAN
4 Gb DDR4 shared with iDRAC application memory |
| Management | iDRAC9 | iDRAC9 |
| Security | Optional TPM 1.2/2.0
Cryptographically signed firmware Silicon Root of Trust Secure Boot System Lockdown System Erase |
Optional TPM 1.2/2.0
Cryptographically signed firmware Silicon Root of Trust Secure Boot System Lockdown System Erase |
| Fans | In chassis | In chassis |
| Power Supplies | Power provided by chassis | Power provided by chassis |
| Chassis | MX7000 | MX7000 |