Dell PowerEdge R7715 - Review
5th Gen AMD EPYC 9005 Series — Up to 160 Zen5 Cores
AMD EPYC 9005 Series (Zen5) — Single-socket design supporting one 5th Generation AMD EPYC processor with up to 160 cores for maximum multi-threaded throughput
Up to 2× Performance — The 9005 series delivers up to two times better performance compared to the previous EPYC generation, accelerating data analytics and virtualization workloads
Max TDP: 400 W — Broad processor range from 8-core entry SKUs up to 160-core flagship models; cTDP options from 125 W to 400 W
CXL 2.0 Support — Supports CXL Type 3 memory expansion devices for compute-near-memory architectures and scale-out memory pools
PCIe Link Encryption — Hardware-level PCIe link encryption and hot-plug port reconfiguration for enhanced security and flexibility
Ideal for Dense Workloads — Purpose-built for data analytics, dense virtualization, software-defined storage, HPC, and high-core-count database workloads
24-Slot DDR5 RDIMM — Up to 6 TB at 5200 MT/s
24 DDR5 DIMM Slots — Double the slot count of the previous-generation R7615 (12 slots), enabling massive in-memory database and analytics deployments
Maximum Capacity: 6 TB — Achieved with 256 GB eight-rank RDIMMs across all 24 slots, ideal for in-memory SAP HANA or Oracle workloads
Speed: Up to 5200 MT/s — 1 DIMM per channel (1DPC) runs at 5200 MT/s; 2 DIMMs per channel (2DPC) at 4400 MT/s for balanced capacity-speed trade-offs
ECC RDIMM Only — Registered ECC DDR5 DIMMs exclusively for enterprise data integrity and error correction
DIMM Options — 16 GB, 32 GB, 64 GB, 96 GB, 128 GB, and 256 GB RDIMM modules supported across all 24 slots
12-Channel Architecture — AMD EPYC 9005 delivers up to 12 memory channels per CPU for exceptional memory bandwidth in scale-out workloads
Flexible Drive Bay Configurations — Up to 40 EDSFF E3.S NVMe Drives
No Backplane / 2 × U.2 — Minimal-storage compute configurations for pure workload processing
Up to 8 × 2.5" Universal — SAS, SATA, or NVMe hybrid bay supporting mixed drive types in a compact footprint
Up to 12 × 3.5" SAS/SATA — High-capacity spinning media for archive, backup, and NAS workloads
Up to 24 × 2.5" SAS/SATA — Dense SFF configuration for all-flash SSD or mixed SAS/SSD environments
Up to 16 × 2.5" SSD + 8 × U.2 NVMe — Tiered hybrid configuration combining SAS/SATA capacity with NVMe performance tiers
Up to 40 × EDSFF E3.S Gen5 NVMe — Maximum NVMe density for all-flash software-defined storage and hyperconverged infrastructure at PCIe Gen 5 speeds
Configurations also include — 8×, 16×, and 32× EDSFF E3.S Gen5 NVMe variants for right-sized flash deployments
PERC RAID Controllers — PERC H365i, H965i & H975i
PERC H365i — Internal entry-level RAID controller supporting RAID 0, 1, 5, 6, 10, 50, 60 for SAS/SATA workloads
PERC H965i — Internal high-performance RAID controller with advanced tiering and NVMe support
PERC H975i — Internal high-performance RAID controller; ESXi support requires v9.0 or later
External HBA: HBA465e — Non-RAID external host bus adapter for direct SAS/SATA attached storage arrays
External RAID: H965e — External RAID controller for SAN and shared storage connectivity
No Software RAID — All RAID functionality provided by dedicated hardware PERC controllers for consistent, predictable performance
BOSS-N1 DC-MHS Boot Module — Dedicated OS Drive Bay
BOSS-N1 DC-MHS — Boot Optimized Storage Subsystem with Datacenter Modular Hardware System support, providing dedicated M.2 SSD boot media independent of data drives
Internal USB Boot — Optional internal USB 3.1 Type-A port for legacy boot media or OS deployment tooling
Front-Mount PERC — Optional front-mounted PERC module provides additional storage controller flexibility for mixed workload environments
FPGA PESTI — Supports payload data for Front PERC 12 and BOSS-N1 DC-MHS for unified firmware management
Non-Disruptive OS — BOSS module keeps the OS drive separate from data storage arrays, allowing data drive changes without OS impact
Up to 3 × 450 W Double-Wide GPU Accelerators
Double-Wide GPUs — Up to 3 × 450 W double-wide GPU cards for high-density AI inference, training, and HPC acceleration workloads
Single-Wide GPUs — Up to 6 × 75 W single-wide GPU cards for lighter inference, video analytics, or edge AI applications
Upgrade vs R7615 — R7715 supports 450 W double-wide GPUs versus 300 W on the previous-generation R7615, enabling newer, higher-TDP accelerator cards
GPU Air Shroud — Dedicated GPU air shroud with 1U GPU heatsink (2K16D) and High Performance Platinum fans ensure proper thermal management under GPU load
PCIe Gen5 Bandwidth — All GPU slots connect via PCIe Gen 5 x16 lanes, delivering maximum bandwidth for GPU-to-CPU data transfers
Validated Configurations — Only Dell-validated GPU cards are supported; unauthorized GPU installation voids warranty
NVIDIA BlueField-3 DPU — SmartNIC Offload & Data Center Acceleration
NVIDIA BlueField-3 B3220 — 2 × 200 GbE networking (2×200G), PCIe Gen5 x16, 150 W TDP — offloads networking, storage, and security processing from the CPU
NVIDIA BlueField-3 B3140H — 1 × 400 GbE networking, PCIe Gen5 x16, 75 W TDP — single high-speed port variant for simplified cabling
System-on-Chip Design — ARM cores, high-performance NIC, and programmable acceleration engines in a single card for converged infrastructure offload
Workload Offload — Offloads and accelerates data center infrastructure services including virtual switching, storage protocols, and security encryption
Compatible Riser Slots — BlueField-3 B3220 fits RC1, RC2, RC3, RC4, RC5, and RC8 riser configurations (slots 7 and 2)
Up to 8 PCIe Gen5 Slots — Double the Previous Generation
8 PCIe Gen5 Slots — All slots are x16 connectors, delivering up to 2× the bandwidth of PCIe Gen 4 for GPU, NIC, and NVMe expansion
Slot 1 & 2 — Full Height, Half/Full Length x8/x16; Slot 2 supports dual-width cards via R1d, R1e, R1e_DW risers
Slot 3 — Low Profile or Full Height, Full Length x16 via R2n/R2m risers — ideal for high-bandwidth NIC or HBA
Slots 4 & 5 — Full Height x8/x16 with OCP3.0 option on Slot 4 via R3a/R3b/R3b_DW/R3e risers
Slots 7 & 8 — Full Height x8/x16, dual-width capable via R5b_DW, R5b, R5f, R5a risers for large-form-factor accelerator cards
Slot 9 — Low Profile or Full Height, Half Length x16 via R4a/R4b risers
Slot 10 — Dedicated OCP NIC 3.0 x16 slot; Slot 6 reserved for BOSS module x4
Dual OCP NIC 3.0 — Up to 400 GbE per Card
Dual OCP NIC 3.0 — Two OCP NIC 3.0 slots (Slot 4 and Slot 10) enabling dual-fabric networking for separate management and data plane connectivity
OCP Speed Options — 1 GbE × 4, 10 GbE × 2/4, 25 GbE × 2/4, 100 GbE × 2, and 200 GbE × 2 (configurable to 400 GbE × 1) per OCP slot
1 Gb Dedicated BMC Port — Datacenter-Secure Control Module (DC-SCM) provides a dedicated 1 Gb out-of-band Ethernet port for iDRAC management isolation
PCIe Add-in NIC — Optional PCIe Add-in Card NICs support 100 GbE × 2 and 400 GbE × 1 for high-performance data center networking
Fibre Channel HBA — FC32 and FC64 Fibre Channel HBA cards supported for SAN connectivity
NDR VPI Support — InfiniBand/NDR VPI (400 GbE) PCIe AIC supported for HPC and AI cluster interconnects
Hot-Swap Redundant PSUs — Up to 3200 W Titanium
Titanium Efficiency (800 W & 1100 W) — Mixed-mode C13 PSUs for standard 100–240 Vac or 240 Vdc deployments with lowest heat dissipation
High-Power Titanium (1500 W & 2400 W) — For GPU-dense and high-TDP processor configurations; 1500 W also available in 277 Vac/HVDC variant
3200 W Titanium — Maximum power option for triple-GPU or maximum-core-count configurations; available in 200–240 Vac and 277 Vac/HVDC versions
Telco DC: 1400 W — (-48)–(-60) Vdc for telco/carrier-grade deployments
Platinum PSUs (800 W & 1100 W) — Cost-optimized efficiency tier for standard data center use cases
Full Redundancy — Two hot-swap PSU bays with N+1 redundancy; M-CRPS 73.5 mm (3200/2400 W) and 60 mm form factors
SmartCooling — Air + Direct Liquid Cooling for High-TDP Configs
Air Cooling — Up to 6 hot-plug cooling fans (Silver, Gold, or Platinum HPR tiers) for standard non-GPU configurations, supporting ASHRAE A2/A3/A4 and Rugged environments
Direct Liquid Cooling (DLC) — Available for high-TDP processor and GPU configurations; DLC Module (4JWWY) handles the most demanding thermal loads up to 400 W TDP
Fan Tiers — Silver (STD HPR) fans for base processors; Gold (VHP HPR) for mid/high-core processors; Platinum (HPR Pltm) for maximum TDP and GPU configurations
GPU Air Shroud — Dedicated GPU shroud with 1U GPU heatsink (2K16D) and HPR Platinum fans for triple-GPU configurations
SmartCooling — Intelligent fan speed management allows most configurations to run air-cooled, reducing acoustic and energy overhead
Operating Range — ASHRAE A2: 10–35°C; A3: 5–40°C; A4 & Rugged: 5–45°C/55°C with altitude de-rating
Cyber Resilient Architecture — Silicon Root of Trust to Zero Trust
Silicon Root of Trust — Boot resilience anchored in immutable silicon, verifying firmware integrity from power-on through full OS load
AMD Secure Encrypted Virtualization (SEV) — Hardware-level VM memory encryption protects individual virtual machine workloads from each other and the hypervisor
AMD Secure Memory Encryption (SME) — Full system memory encryption at the hardware level for data-at-rest protection without software overhead
TPM 2.0 — FIPS & CC-TCG Certified — Hardware-rooted cryptographic key storage for measured boot, BitLocker, and compliance mandates
Cryptographically Signed Firmware — All firmware updates verified via cryptographic signature chains, blocking unauthorized or tampered firmware injection
Secured Component Verification — Hardware integrity check validates components from factory to deployment, detecting unauthorized substitution in the supply chain
Additional Controls — Secure Boot, Secure Erase (data sanitization), System Lockdown, Chassis Intrusion Detection, and Data at Rest Encryption (SED with local or external key management)
iDRAC10 + OpenManage — Autonomous Out-of-Band Server Management
iDRAC10 (Express, Enterprise, Datacenter) — Next-generation Integrated Dell Remote Access Controller with expanded AI-assisted diagnostics, autonomous operations, and enhanced telemetry versus iDRAC9 on previous platforms
iDRAC Direct (USB-C) — Front-panel USB-C Type-C HOST/BMC Direct port for local management and diagnostics without a network connection
RESTful API with Redfish — Industry-standard Redfish API for infrastructure-as-code, automation pipelines, and GitOps-driven server management
Racadm CLI — Command-line interface for scripted configuration, firmware updates, and mass deployment
Quick Sync 2 — Optional wireless module enables mobile device access to server status and configuration via the OpenManage Mobile app
OpenManage Enterprise (OME) — Unified console for lifecycle management, firmware updates, power monitoring, and APEX AIOps Observability across server fleets
Automation Integrations — Red Hat Ansible Collections and Terraform Providers for infrastructure-as-code workflows
Broad OS & Hypervisor Compatibility — Linux, Windows, VMware
Canonical Ubuntu Server LTS — Official Ubuntu LTS support for cloud-native, containerized, and AI workload deployments
Microsoft Windows Server with Hyper-V — Full Windows Server support including Hyper-V virtualization for mixed Windows/Linux environments
Red Hat Enterprise Linux (RHEL) — Certified RHEL support for enterprise Linux, OpenShift, and automation-driven infrastructure
SUSE Linux Enterprise Server (SLES) — SUSE support for SAP HANA, HPC, and high-reliability Linux workloads
VMware ESXi — VMware virtualization support; PERC H975i controller requires ESXi 9.0 or later
PXE Boot Support — Network boot via PXE for zero-touch provisioning and OS deployment at scale
IPMI — Legacy IPMI interface supported alongside Redfish for mixed-generation management tool compatibility
Rack Rail Integration — Standard 2U Rack Compatibility
2U Form Factor — 86.8 mm (3.41 in) height × 482 mm (18.97 in) width × 802.4 mm (31.59 in) depth (with PSU handle)
Standard Rack Compatibility — Compatible with Dell standard 19-inch rack enclosures and third-party ANSI/EIA-310 racks
Rail Sizing Matrix — Full rail sizing and rack compatibility matrix documented for matched depth and rail type selection
Optional Metal Bezel — Front metal bezel for dust protection and physical security in open-rack environments
Optional LCP KVM — Left Control Panel with USB 2.0 and Mini DisplayPort for local KVM access without a dedicated KVM switch
Express Service Tag — Slide-out label panel contains Service Tag, NIC/MAC addresses, and iDRAC secure default password for rapid identification
R7715 vs R7615 — The Gen 17 AMD EPYC Upgrade
| Feature | PowerEdge R7715 (Gen 17) | PowerEdge R7615 (Gen 16) |
|---|---|---|
| Processor | AMD EPYC 9005 Series (Zen5) — up to 160 cores | AMD EPYC Genoa (Zen4c) — up to 128 cores |
| Memory Slots | 24 DDR5 DIMM slots | 12 DDR5 DIMM slots |
| Max Memory | 6 TB RDIMM | ~3 TB RDIMM |
| Memory Speed | Up to 5200 MT/s | Up to 4800 MT/s |
| GPU Max TDP | 3 × 450 W DW | 3 × 300 W DW |
| PCIe Slots | Up to 8 × Gen5 | Up to 4 × Gen5 |
| Cooling | Air + Direct Liquid Cooling | Air only |
| Management | iDRAC10 | iDRAC9 |
| OCP NIC | Dual OCP NIC 3.0 | Single OCP NIC 3.0 |
| Max Storage | Up to 40 × EDSFF E3.S Gen5 NVMe | Up to 32 × E3.S Gen5 NVMe |
25% More Cores — 160 vs 128 maximum cores; Zen5 architecture delivers up to 2× better performance per generation
2× Memory Slots — 24 vs 12 DIMM slots enables massive scale-up in-memory workloads impossible on R7615
Liquid Cooling Added — R7715 introduces Direct Liquid Cooling, supporting high-TDP GPU and processor configurations not thermally possible on R7615
iDRAC10 Upgrade — Next-generation management with AI diagnostics, expanded automation, and improved telemetry over iDRAC9
Dell Technologies Services — ProSupport, ProDeploy & Beyond
ProSupport Infrastructure Suite — 24×7 expert technical support with predictive issue detection, automated case creation, and proactive diagnostics via Secure Connect Gateway (SCG)
ProDeploy Infrastructure Suite — Tailored deployment services covering rack, stack, configure, and validate — accelerating time to production for new server deployments
Professional Services for AI — Accelerate high-value AI use case delivery with specialized consulting and architecture services from Dell experts
Secure Connect Gateway (SCG) — Automated monitoring detects hardware issues, opens support cases, and uploads diagnostic data to Dell Support automatically
DAY 2 Automation with Ansible — Dell Technologies Consulting delivers post-deployment infrastructure automation using Red Hat Ansible Collections
170+ Global Locations — Service and support backed by 60,000+ Dell employees and partners across 170 locations worldwide
APEX Flex on Demand — Consumption-based acquisition model letting you pay based on actual usage, matching infrastructure costs to real business demand
Frequently Asked Questions — Dell PowerEdge R7715
The R7715 supports up to 6 TB of DDR5 RDIMM memory across 24 DIMM slots using 256 GB eight-rank modules. Memory runs at 5200 MT/s (1 DIMM per channel) or 4400 MT/s (2 DIMMs per channel), making it ideal for in-memory databases, SAP HANA, and large analytics workloads that benefit from maximum DRAM capacity in a single socket.
The R7715 offers the widest drive bay selection in its class, supporting configurations from a driveless chassis all the way up to 40 × EDSFF E3.S Gen5 NVMe drives for maximum flash density. It also supports 24 × 2.5-inch SAS/SATA, 12 × 3.5-inch SAS/SATA, and hybrid configurations like 16 × 2.5-inch SSD + 8 × U.2 NVMe, giving data center operators precise storage right-sizing options.
Yes. The R7715 supports Direct Liquid Cooling (DLC) via the DLC Module (part 4JWWY), a significant upgrade over the R7615 which was air-only. DLC is designed for high-TDP AMD EPYC processor configurations and GPU-dense deployments where air cooling reaches its thermal limits. SmartCooling allows most standard configurations to remain air-cooled, with DLC available as needed for maximum-performance builds.
Yes. Express Computer Systems stocks professionally reconditioned refurbished Dell PowerEdge R7715 servers tested, cleaned, and configured to your specifications — ready to deploy at significant cost savings versus new. Shop refurbished Dell R7715 servers at ECS.
The R7715 represents a major generational step up from the R7615. Key improvements include 160 Zen5 cores vs 128 Zen4c cores, doubled DIMM slots (24 vs 12) for up to 6 TB memory, doubled PCIe slots (8 vs 4 Gen5), Direct Liquid Cooling support, higher GPU TDP support (450 W vs 300 W), dual OCP NIC 3.0 vs single, up to 40 EDSFF NVMe drives vs 32, and upgraded iDRAC10 management versus iDRAC9 on the R7615.
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