Virtualization & Private Cloud — Maximize VM density across 2U with up to 2x 144 E-cores (288 total) and 8TB DDR5 memory, enabling large-scale private cloud consolidation without sacrificing performance per VM.

High-Performance Computing (HPC) — Run simulation, modeling, and research workloads across 288 E-cores or 172 P-cores with full PCIe Gen5 interconnect bandwidth and up to 40x Gen5 NVMe drives for extreme parallel I/O throughput.

Scale-Out Database — Drive OLTP, in-memory, and analytics databases with dual-socket DDR5 bandwidth, up to 8TB memory, and up to 40x EDSFF E3.S Gen5 NVMe drives delivering maximum local storage density per node.

AI & GPU-Accelerated Workloads — The R770’s 2U chassis accommodates up to 6x NVIDIA L4 24GB GPUs for AI inference, or up to 2x NVIDIA H100 NVL 94GB double-width accelerators for large-model training and inference at scale.

Enterprise Applications — Run SAP HANA, Oracle Database, and Microsoft SQL Server with up to 8TB DDR5 (P-Core), high-bandwidth memory channels, and enterprise-grade RAS features including memory mirroring and Fault Resilient Mode.

Big Data & Analytics — Power Hadoop, Spark, and real-time streaming analytics with up to 40x E3.S Gen5 NVMe drives and dual-socket memory bandwidth exceeding 800 GB/s aggregate in a single 2U node.

Software-Defined Storage — Deploy ultra-dense 2U all-flash NVMe storage nodes with up to 40x EDSFF E3.S Gen5 drives for distributed, hyperconverged, or object storage architectures at petabyte scale.

32 DIMM Slots — 288-pin DDR5 RDIMM sockets across 16 memory channels (8 per processor) — doubling available bandwidth and capacity versus single-socket platforms.

E-Core Configuration — Supports up to 2TB max using 32GB or 64GB RDIMMs at 6400 MT/s (1DPC) or 5200 MT/s (2DPC). Optimal for cloud-scale and parallel workloads prioritizing core density over raw memory capacity.

P-Core Configuration — Supports up to 8TB max using 16GB through 256GB RDIMMs including 96GB, 128GB, and 256GB 8R DIMMs. Enables memory mirroring and Fault Resilient Mode (FRM) for RAS-critical deployments including SAP HANA and Oracle.

RDIMM Capacities — 16GB (1R), 32GB (2R), 64GB (2R), 96GB (2R), 128GB (2R), 256GB (8R) — all ECC DDR5 at 1.1V. 16GB, 96GB, 128GB, and 256GB supported with P-Core only.

DDR5 Exclusively — Supports registered ECC DDR5 DIMMs only; no DDR4 compatibility. All DIMM slots must be populated with identical DIMMs (one Dell PN) — mixing configurations are not supported.

Memory Mirroring & FRM — Memory mirroring (full redundancy) supported on P-Core only. Fault Resilient Mode available on P-Core with 8 or 16 DIMMs per processor for mission-critical uptime requirements.

H965i Front DC-MHS — High-performance PERC 12 internal RAID controller using the DC-MHS connector; optimized for NVMe E3.S configurations without occupying a PCIe riser slot.

H365i Front DC-MHS — Standard PERC 12 internal front RAID controller via DC-MHS; suitable for SAS/SATA drive configurations with RAID 0, 1, 5, 6, 10, 50, 60 support.

H975i Front DC-MHS — Premium PERC 12 internal controller with higher cache and throughput; ESXi 9.0 or later required for full support. Dual H975i configuration supported in select R770 configurations for maximum controller throughput.

External Controllers — PERC H965e (RAID) and HBA 465e (pass-through) for connecting external 12Gb SAS JBOD enclosures and MD-series storage arrays beyond direct-attach capacity.

No Tri-Mode — PowerEdge 17th Gen does not support mixing SAS, SATA, and NVMe behind the same controller; select the controller matched to your drive protocol for each backplane.

External Storage — Supports external USB tape, NAS/IDM appliance software, and 12Gb MD-series JBOD connections for storage expansion beyond direct-attach capacity limits.

Up to 6x NVIDIA L4 24GB 72W — Single-width Low Profile GPUs connected via PCIe Gen5 x16 slots; maximum density option for AI inference, video transcoding, and GPU-accelerated analytics workloads in a 2U chassis.

Up to 2x NVIDIA H100 NVL 94GB 350W — Double-width full-height accelerators providing 94GB HBM3 memory each and NVLink interconnect; designed for large language model inference and GPU-to-GPU collective communication at scale.

Up to 2x NVIDIA L40s 48GB 350W — Double-width full-height Ada Lovelace GPUs with 48GB GDDR6 ECC; suited for professional visualization, 3D rendering, AI content generation, and mixed compute/graphics workloads.

Up to 2x NVIDIA A16 64GB 250W — Quad-GPU double-width card with 4x 16GB GDDR6 (64GB total); optimized for virtual desktop infrastructure (VDI), remote visualization, and multi-tenant GPU sharing.

Full PCIe Gen5 Bandwidth — Each double-width GPU slot operates at full x16 Gen5 bandwidth (32 GT/s) — no lane sharing required — enabling GPU-direct storage access and high-bandwidth AI pipeline integration.

Riser Configuration Dependent — GPU card availability depends on the riser selected; double-width full-height GPUs (H100 NVL, L40s, A16) require full-height riser configurations. Review riser compatibility matrix when configuring GPU and storage combinations.

OCP NIC 3.0 Integrated Slot — Primary OCP NIC 3.0 slot (Slot 10) delivers up to 100GbE on PCIe Gen5 x16 without consuming a PCIe riser slot; additional OCP slots available in front I/O configurations for dual-fabric deployments.

Port Speed Options — 1GbE x4, 10GbE x2/x4, 25GbE x2/x4, 100GbE x2 — select based on fabric topology and application bandwidth requirements across east-west and north-south traffic patterns.

Shared iDRAC NIC Port — The primary OCP NIC card shares a port with iDRAC for out-of-band management, reducing required physical ports in standard deployment configurations.

Dedicated iDRAC Ethernet — Dedicated 1Gb iDRAC management port available at front (FIO) or rear (RIO) for independent management-plane traffic that doesn’t share data-plane bandwidth.

OCP 3.0 vs 2.0 — OCP 3.0 uses PCIe Gen5 (vs Gen3 on OCP 2.0) and supports up to x16 lanes in a small form factor, enabling next-generation 100GbE and future 200GbE throughput without consuming a full-height PCIe riser slot.

Additional PCIe NICs — Full-height and low-profile PCIe riser slots support standard PCI Express network adapters (InfiniBand, 25GbE, 100GbE, 200GbE, 400GbE) for high-performance computing fabrics and storage networking.

Up to 6x Fan Modules — Hot-swappable fan modules with N+1 redundancy; continuous operation with one failed fan module — no downtime required for fan replacement during active workloads.

HPR Silver (HPR SLVR) Fans — High Performance Silver fans required for elevated processor TDPs; support dual-socket E-Core and P-Core configurations up to the highest supported TDP with air cooling.

HPR Gold (HPR GOLD) Fans — Highest-tier fan option for maximum-TDP configurations and high-ambient-temperature environments; provides additional thermal headroom for DLC-equipped systems.

Extended & L-Type Heatsinks — Extended heatsinks support higher TDP processors with air cooling; L-Type heatsinks required for the highest-TDP SKUs including the 6780E 330W E-Core in air-cooled configurations.

Optional Direct Liquid Cooling (DLC) — Available for highest-TDP E-Core processor configurations; DLC module connects at the rear of the chassis with coolant supply and return lines from the facility cooling loop — enabling denser rack deployments without thermal throttling.

ASHRAE A2 Standard — 10–35°C operating range for conventional data center environments with ISO Class 8 air filtration. Extended ambient support varies by processor TDP and system configuration.

iDRAC Closed-Loop Control — iDRAC dynamically adjusts fan speeds using inlet temperature, CPU/DIMM/drive sensors, and system inventory — minimizing acoustic output and energy consumption across all load levels.

Silicon Root of Trust — Hardware-anchored cryptographic boot chain verifies firmware integrity at the silicon level before any software loads — protecting against supply chain attacks and firmware tampering from factory to site.

TPM 2.0 (FIPS, CC-TCG Certified) — Trusted Platform Module 2.0 provides hardware-based key storage, attestation, and cryptographic operations for drive encryption and platform integrity verification.

Secure Boot — UEFI Secure Boot validates bootloader and OS kernel signatures, blocking unauthorized operating systems and rootkits from loading during the boot process.

Data at Rest Encryption — Self-Encrypting Drive (SED) support with local or external key management for NIST-compliant data protection across SAS, SATA, NVMe, and E3.S drive types.

Secured Component Verification — Factory-to-site hardware integrity check ensures no components were replaced or tampered with during shipping — critical for supply chain zero-trust requirements.

System Lockdown (iDRAC10) — Requires iDRAC10 Enterprise or Datacenter; locks all firmware update and configuration change pathways, preventing unauthorized modifications even with physical chassis access.

Chassis Intrusion Detection & Secure Erase — Intrusion switch logs chassis access events; Secure Erase cryptographically sanitizes all storage media prior to decommission for data compliance.

Multi-Factor Authentication (MFA) — Enforces MFA across iDRAC and management interfaces, reducing credential-based attack surface in Zero Trust IT environments.

Canonical Ubuntu Server LTS — Long-term support Ubuntu for stable enterprise Linux deployments with full iDRAC10 driver support and Lifecycle Controller integration.

Red Hat Enterprise Linux (RHEL) — Industry-standard enterprise Linux with Dell-certified driver stacks and one-click OS deployment via Lifecycle Controller.

SUSE Linux Enterprise Server (SLES) — High-reliability Linux for SAP workloads and mission-critical enterprise applications requiring long-term kernel stability.

VMware ESXi — Leading type-1 hypervisor for virtualized infrastructure; Dell-certified with OpenManage Integration for vCenter for lifecycle management directly from the vSphere console. Note: H975i PERC requires ESXi 9.0 or later.

Microsoft Windows Server & Windows Server Datacenter — Full Microsoft certification including Hyper-V virtualization, Windows Admin Center integration, and NVIDIA GPU support for virtual desktop and AI inference workloads.

OEM-Ready — Available in OEM and OEMR configurations; hardware can be customized from bezel to BIOS to packaging for white-label or branded customer deployments.

Processor Core Explosion — Intel Xeon 6 E-Core (up to 144 cores per socket, 288 total) vs 4th/5th Gen Xeon Scalable (up to 60 cores per socket, 120 total) on R760 — up to 2.4× more cores in the same 2U dual-socket form factor.

Memory Speed & Capacity — DDR5 at 6400 MT/s (1DPC) vs 4800 MT/s on R760; up to 8TB max (P-Core) vs ~6TB on R760 — significantly faster bandwidth for data-intensive and in-memory applications.

EDSFF E3.S NVMe Added — R770 supports up to 40x EDSFF E3.S Gen5 NVMe drives vs R760 with no E3.S support — enabling next-generation NVMe storage density at 2.46PB raw in a single 2U chassis.

Higher-TDP GPU Support — R770 adds H100 NVL 94GB 350W and L40s 48GB 350W double-width GPUs not available on R760; L4 GPU count increases from 3x to 6x in 2U chassis, doubling AI inference throughput.

DLC Support Added — R770 adds optional Direct Liquid Cooling for the highest-TDP E-Core processor SKUs vs R760 which is air-only — enabling denser rack deployments without thermal throttling.

iDRAC10 vs iDRAC9 — R770 ships with iDRAC10 offering enhanced automation, expanded Redfish API coverage, and next-generation security features including strengthened System Lockdown.

Higher Maximum PSU Wattage — R770 supports up to 3200W PSUs vs ~1500W max on R760 — necessary for dual high-TDP processor configurations with double-width GPU complement and DLC module.

Titanium PSU Efficiency — Up to 3200W Titanium PSUs achieve industry-leading efficiency at all load levels; Platinum and Titanium Mixed Mode options across the full wattage range to match data center power delivery infrastructure.

1% Power Monitoring Accuracy — Dell’s 1% monitoring accuracy (5× the 5% industry standard) enables right-sizing of power infrastructure and UPS capacity — reducing stranded capacity and energy waste across the fleet.

N+1 Fan Redundancy & Closed-Loop Cooling — iDRAC dynamically sets minimum required fan speeds using real-time sensor data — reducing idle power consumption versus fixed-speed cooling alternatives.

Intel Xeon 6 E-Core Efficiency — Efficient-core architecture delivers superior performance-per-watt vs prior Xeon generations; Dell cites 1.69× better performance per watt, enabling more workloads per kilowatt-hour with fewer servers and a smaller data center footprint.

Optional DLC Reduces Cooling Overhead — Direct Liquid Cooling moves processor heat directly to facility cooling loops at higher efficiency than air-based cooling for the highest-TDP configurations — lowering total cooling energy versus comparable air-only rack deployments.

Dell EIPT — Enterprise Infrastructure Planning Tool calculates precise power consumption across server, storage, and networking at specific workload levels — enabling accurate TCO modeling before purchasing decisions.

Recycled Materials & Responsible Sourcing — Dell incorporates recycled content in products and packaging and offers end-of-life take-back to support circular economy goals.