Dell PowerEdge R7625 Buyers Review Guide
Dual-Socket 2U Density for HPC, Virtualization, VDI, and EDSFF Gen5 NVMe
High Performance Computing (HPC) — dual AMD EPYC 9004 with up to 256 total cores, 6 TB DDR5, and PCIe Gen5 bandwidth delivers the memory capacity and core density required for memory-intensive simulation, scientific computing, and AI inference workloads.
Virtualization — 256 Zen4/Zen4c cores and 6 TB DDR5 maximize VM density per rack unit; AMD SEV-SNP enables per-VM encrypted memory isolation for secure multi-tenant environments.
Virtual Desktop Infrastructure (VDI) — high dual-socket core count and optional GPU acceleration with up to 6 × 75W single-width cards maximize user session density and graphics-accelerated desktop responsiveness.
Data Analytics — 6 TB DDR5 at 4800 MT/s enables large in-memory datasets; up to 32 EDSFF E3.S Gen5 NVMe drives or 24 SFF SAS/NVMe drives support high-throughput analytic storage tiers.
Software-Defined Storage (SDS) — up to 32 EDSFF E3.S Gen5 NVMe drives in a 2U chassis delivers exceptional all-flash NVMe density for Ceph, Lustre, or DAOS nodes with dual-socket compute redundancy.
Database Consolidation — 6 TB DDR5 with NVMe Gen5 direct-attach storage supports large in-memory transactional databases including SAP, Oracle, MySQL, and PostgreSQL workloads at high concurrency.
Edge and Branch Compute — 2U form factor with dual-socket compute density and optional DLC suits demanding edge deployments running containerized, virtualized, or AI-accelerated workloads.
Dual AMD EPYC 9004 Genoa — Up to 256 Total Cores in 2U
Two AMD EPYC 9004 Genoa (SP5) processors — dual-socket 2U platform supports symmetric two-CPU configurations; each processor connects via AMD Infinity Fabric xGMI3 interconnect at 32 GT/s — double the 16 GT/s of the prior SP3 generation.
Up to 128 cores per socket, 256 total cores — Zen4 and Zen4c core variants available across the EPYC 9004 lineup; up to 128-core EPYC 9754 or mixed-core EPYC 9654P options scale from balanced single-socket to maximum dual-socket density.
5nm TSMC process — delivers a significant generational improvement in performance-per-watt versus the 7nm EPYC Gen 2 and Gen 3 processors in the R7525; TDP range from 155W to 400W covered by air or DLC cooling.
PCIe Gen5 from both CPUs — each EPYC 9004 processor provides PCIe Gen5 lanes; Slot 1, Slot 2, Slot 7, and Slot 8 operate at Gen5 speeds — doubling bandwidth compared to Gen4 for NVMe, GPU, and NIC traffic.
AMD Infinity Guard security — hardware-level AMD Secure Memory Encryption (SME) and Secure Encrypted Virtualization (SEV-SNP) provide per-VM memory isolation and encrypted DRAM protection without OS-level overhead.
Large L3 cache — up to 256 MB L3 cache per socket in the EPYC 9654 accelerates latency-sensitive workloads; cache coherency across both sockets maintained by xGMI3 fabric at full bandwidth.
24 DDR5 DIMM Slots — Up to 6 TB at 4800 MT/s
24 DDR5 DIMM slots — 12 slots per CPU socket; supports RDIMM and 3DS RDIMM module types; maximum single-server memory footprint of 6 TB enables in-memory databases, large analytics datasets, and high VM density without memory contention.
DDR5 at 4800 MT/s — 50% higher bandwidth per channel versus DDR4 at 3200 MT/s; dual-socket R7625 doubles the 12-slot, 3 TB capacity of single-socket 2U EPYC 9004 platforms while maintaining the same per-channel speed.
ECC RDIMM only — registered ECC DDR5 DIMMs required; 3DS RDIMMs supported for maximum capacity configurations; do not mix RDIMM and 3DS RDIMM within a memory channel, and do not mix x4 and x8 DRAM widths within a channel.
Compared to R7525 — the R7525 used 32 DDR4 slots reaching only 2 TB RDIMM or 4 TB LRDIMM at 3200 MT/s; R7625 DDR5 delivers 6 TB RDIMM at 50% greater bandwidth with fewer slots and lower power per DIMM.
AMD Secure Memory Encryption — hardware SME encrypts all DRAM in real time using keys generated by the AMD Secure Processor; no performance penalty for workloads that require memory-at-rest encryption compliance.
Memory population guidance — for maximum performance, populate DIMMs in balanced pairs across both CPU memory channels; consult Dell memory population rules in the technical guide for 1 DPC and 2 DPC configurations at target capacities.
PERC 12 and PERC 11 — Full RAID and HBA Coverage Across All Drive Tiers
PERC H965i (PERC 12) — Dell’s flagship internal RAID controller for 16th Generation; supports 24G SAS4, SATA, and NVMe RAID including NVMe-only RAID arrays; provides the highest throughput and lowest latency RAID option for EDSFF and NVMe U.2 configurations.
PERC H755 and H755N (PERC 11) — H755 supports SAS/SATA RAID 0/1/5/6/10/50/60 with non-volatile cache; H755N adds NVMe RAID capability in a low-profile form factor ideal for high-density SFF configurations.
PERC H355 and HBA355i (PERC 11) — H355 delivers RAID 0/1/5/10 for SAS/SATA with a lower cost profile; HBA355i provides pass-through HBA mode for software RAID (VSAN, Ceph) or direct NVMe access without controller overhead.
BOSS-N1 boot controller — Boot Optimized Storage Subsystem (NVMe generation); dedicated M.2 NVMe SSD pair for OS boot via hardware RAID 1; rear-mounted and independent of all PERC cards and front drive bays.
S160 software RAID — SATA-only software RAID option for entry-level configurations; runs within the OS and does not require a dedicated RAID card; supported on select chassis configurations.
HBA355e external HBA — external SAS HBA for direct-attached JBOD expansion; enables scale-out storage configurations connecting external PowerVault enclosures when internal bay count is insufficient.
Eight Front Chassis Configurations — Up to 32 EDSFF E3.S Gen5 NVMe Drives
8 × 3.5-inch SAS/SATA front bays — up to 160 TB raw; supports 7.2K and 10K HDDs plus SATA SSD; ideal for high-capacity nearline storage with dual-socket compute.
12 × 3.5-inch SAS/SATA front bays — up to 240 TB raw; maximum LFF configuration for archival, backup, and high-capacity HDD workloads; note GPU and rear modules are not supported on this chassis.
8 × 2.5-inch SAS/SATA/NVMe front bays — up to 122.88 TB; universal backplane accepts SAS, SATA, or NVMe interchangeably for flexible mixed-workload deployments.
16 × 2.5-inch SAS/SATA/NVMe front bays — up to 245.76 TB; high-density SFF configuration for mixed SAS/NVMe RAID deployments requiring broad drive count coverage.
24 × 2.5-inch SAS/SATA/NVMe front bays — up to 368.64 TB; maximum 2.5-inch SFF density with SAS expander backplane; note GPU and rear modules are not supported on this chassis.
8, 16, or 32 × EDSFF E3.S Gen5 NVMe front bays — up to 245.76 TB all-flash; 32-drive EDSFF configuration delivers exceptional PCIe Gen5 NVMe density in a 2U chassis — the highest NVMe count available in the dual-socket 2U class.
Rear bay options — 2 × 2.5-inch (up to 30.72 TB) or 4 × 2.5-inch SAS/SATA/NVMe (up to 61.44 TB); note rear modules are supported only on 8 × 3.5-inch and 8 × 2.5-inch configurations.
BOSS-N1 — Dedicated NVMe OS Boot, All Data Bays Free
BOSS-N1 module — Boot Optimized Storage Subsystem (NVMe generation); dedicated M.2 NVMe SSD carrier mounts in a rear internal slot, fully separate from all front and rear data drive bays.
Hardware RAID 1 mirrored pair — two M.2 NVMe SSDs mirror the OS in hardware; one drive failure does not interrupt operation or require OS reinstallation.
No PCIe slot consumed — BOSS-N1 uses a dedicated internal connector independent of all riser PCIe slots; every PCIe expansion slot remains free for NICs, HBAs, or GPUs.
Hot-serviceable module — BOSS-N1 is accessible from the rear panel without powering down the server; M.2 SSD replacement does not require chassis disassembly.
UEFI Secure Boot integration — BOSS-N1 supports UEFI Secure Boot and integrates with iDRAC9 Lifecycle Controller for bare-metal OS deployment and recovery workflows.
Frees all front bays for data — because the OS resides on BOSS-N1, all front drive bays and optional rear drive modules are available exclusively for application data and storage workloads.
Up to 6 × 75W Single-Width or 2 × 300W Double-Width PCIe Gen5 GPUs
Up to 6 × 75W single-width GPUs — six single-wide full-length PCIe Gen5 accelerators fit in the 2U chassis using Configs 3 and 4 riser combinations; suited for mixed inference, VDI, and parallel compute workloads distributed across a large GPU count.
Up to 2 × 300W double-width GPUs — two double-wide full-length PCIe Gen5 accelerators via R1P and R4P riser configurations; supports high-power compute GPUs such as NVIDIA A30 or AMD Instinct class cards for deep learning training and inference.
High-Performance Gold fans required — all GPU configurations require High-Performance Gold (VHP) fans; air cooling supports GPU TDPs up to 300W per card; 400W TDP processors with GPUs require Direct Liquid Cooling.
Chassis restrictions — GPU acceleration is not supported on 12 × 3.5-inch LFF or 24 × 2.5-inch SFF chassis configurations; systems with a rear drive module installed also do not support GPU cards.
PCIe Gen5 bandwidth — Gen5 riser slots (Slots 1, 2, 7, 8) deliver 128 GB/s per x16 link; double the Gen4 bandwidth available on the R7525 — critical for GPU-to-memory transfers in large language model inference and HPC acceleration.
Compared to R7525 — the R7525 supported up to three double-wide 300W GPUs; R7625 reduces DW count to two due to dual-socket PCIe topology but adds PCIe Gen5 bandwidth and supports up to six single-wide cards.
Up to 8 PCIe Slots — 4 × Gen5 and 4 × Gen4 with 14 Riser Configurations
Slot 1: 1 × x8 Gen5 or 1 × x8 Gen4 — Full height, Half length
Slot 2: 1 × x8/x16 Gen5 or 1 × x8 Gen4 or 1 × x16 Gen5 Full length — Full height
Slot 3: 1 × x16 Gen4 — Low profile, Half length
Slot 4: 1 × x8 Gen4 — Full height, Half length
Slot 5: 1 × x8 Gen4 or 1 × x16 Gen4 Full length — Full height
Slot 6: 1 × x16 Gen4 — Low profile, Half length
Slot 7: 1 × x8/x16 Gen5 or 1 × x8 Gen4 or 1 × x16 Gen5 Full length — Full height
Slot 8: 1 × x8 Gen5 or 1 × x8 Gen4 — Full height, Half length
14 riser configurations — Config 0 (no risers) through Config 13 cover combinations of R1B, R1P, R1Q, R1S, R2A, R3A, R3B, R4B, R4P, R4Q risers plus EDSFF and U.2 paddle card options for maximum flexibility across all chassis types.
OCP 3.0 and Dual GbE LOM — Flexible High-Speed Connectivity
OCP 3.0 card slot — one optional OCP 3.0 adapter supports 1 GbE × 4, 10 GbE × 2, 10 GbE × 4, 25 GbE × 2, or 25 GbE × 4 configurations; OCP 3.0 uses the x16 PCIe connector and does not consume a standard riser slot.
Optional 2 × 1 GbE LOM card — integrated Dual-Port 1 GbE LOM provides management and low-bandwidth connectivity without occupying an OCP or PCIe slot; LOM and OCP cards can both be installed simultaneously for dual-path connectivity.
PCIe NIC expansion — additional NICs up to 100 GbE can be installed in any available PCIe slot using standard Ethernet or InfiniBand HCA adapters; Gen5 slots (1, 2, 7, 8) provide full bandwidth for 25/100 GbE NICs.
Dedicated iDRAC9 management NIC — one dedicated 1 GbE rear Ethernet port provides out-of-band iDRAC9 management completely independent of all data-plane NICs; management traffic never competes with production network traffic.
Quick Sync 2 wireless module — optional Bluetooth/Wi-Fi module enables mobile management via OpenManage Mobile; useful for initial configuration and field servicing without a wired management network connection.
Dual-socket network architecture — OCP and riser slots are distributed across both CPU NUMA nodes; NIC placement aligned to the appropriate CPU for workloads requiring NUMA-local network access and minimal cross-socket latency.
800W to 2800W — Hot-Swap Redundant Platinum & Titanium PSUs
800W Platinum — 100–240 VAC mixed-mode entry PSU for low-TDP single-CPU and partially populated configurations; supports hot-swap redundancy in 1+1 configuration.
1100W Titanium — 100–240 VAC mixed-mode or −48V LVDC; Titanium efficiency (≥96% at 50% load) reduces power consumption and cooling overhead for always-on enterprise workloads.
1400W Platinum — 100–240 VAC mixed-mode; balanced capacity PSU suited for mid-range dual-socket configurations with moderate GPU and drive populations.
1800W Titanium — 200–240 VAC or 240 HVDC; high-efficiency option for fully populated dual-socket systems; optimal for data centers with 208V or higher circuit availability.
2400W Platinum — 100–240 VAC or 240 HVDC; high-capacity option for maximum GPU and drive configurations requiring broad input voltage compatibility.
2800W Titanium — 200–240 VAC or 240 HVDC; highest available PSU for the R7625; required for fully loaded dual-socket systems with multiple high-TDP GPUs and maximum drive populations.
Hot-swap redundant — all PSU options support hot-swap replacement in a 1+1 redundant configuration; a PSU can be replaced under full load without powering down the server.
SmartCooling — Standard Air Cooling and Optional Direct Liquid Cooling
Up to 6 hot-plug fans — High Performance Silver (HPR) fans for standard configurations; High Performance Gold (VHP) fans required for GPU-accelerated and high-TDP processor configurations; all fans are hot-swap for zero-downtime replacement.
Air cooling for standard TDP processors — dual-socket configurations with AMD EPYC 9004 processors up to 360W TDP are supported with air cooling and HPR or VHP fan configurations; chassis airflow is managed by Dell SmartCooling algorithms via iDRAC9.
Optional Direct Liquid Cooling (DLC) — required for 400W TDP processors such as the AMD EPYC 9654 or EPYC 9754; DLC is a rack-level solution requiring manifolds and a Cooling Distribution Unit (CDU); provides significant PUE improvement for high-density deployments.
DLC chassis constraints — when DLC is installed, note that the rear VGA port is required for video output; specific DIMM slot populations and chassis types must be confirmed in the technical guide before deploying DLC on R7625.
iDRAC9 SmartCooling — iDRAC9 continuously monitors thermal sensors across both CPU sockets, DIMMs, drives, and PCIe cards; fan speeds are dynamically adjusted in real time to optimize cooling efficiency while maintaining all thermal thresholds.
Sustainability impact — Titanium-rated PSUs combined with DLC for high-TDP configurations reduce total power consumption and cooling overhead; Dell’s server thermal architecture is designed to help reduce the data center carbon footprint.
Front, Rear, and Internal I/O — USB 3.0, VGA, and iDRAC Direct
Front panel I/O — 1 × iDRAC Direct (Micro-AB USB) for local management; 1 × USB 2.0 for OS installation media, keyboard, or USB drives; 1 × VGA for local video output during initial setup or troubleshooting.
Rear panel I/O — 1 × dedicated iDRAC9 Ethernet management port; 1 × USB 2.0; 1 × USB 3.0 for high-speed peripheral access; 1 × Serial port (optional); 1 × VGA (optional, or required for DLC configurations).
Internal port — 1 × USB 3.0 (optional) for internal USB flash drive OS deployment or persistent management storage without consuming front or rear port connections.
iDRAC Direct port — Micro-AB USB on the front panel provides local laptop-to-server iDRAC console access without a network connection; essential for field technicians performing initial setup or recovery in co-location environments.
Serial port option — optional rear serial port supports legacy console access and out-of-band serial-over-LAN (SOL) sessions via iDRAC9; useful for environments with serial-based console servers.
DLC VGA note — the optional rear VGA port becomes required when Direct Liquid Cooling is installed, as the DLC manifold physically covers the standard rear VGA position; confirm port availability when planning DLC deployments.
Cyber Resilient Architecture — Silicon Root of Trust and AMD Infinity Guard
Silicon Root of Trust — cryptographic chain of trust anchored in iDRAC9 silicon; validates every firmware component at boot before execution; any tampered firmware is detected and blocked before the OS loads.
AMD Secure Memory Encryption (SME) — hardware-level DRAM encryption using keys generated by the AMD Secure Processor; protects against cold-boot attacks and physical DIMM extraction without software overhead.
AMD Secure Encrypted Virtualization (SEV-SNP) — per-VM memory encryption with integrity protection; each virtual machine’s memory is encrypted with a unique key; a compromised hypervisor cannot read or modify guest VM memory.
Secured Component Verification — hardware integrity check new to 16th Generation; validates that all installed components (CPUs, DIMMs, drives, NICs) match the factory configuration using cryptographic attestation at each boot.
TPM 2.0 — FIPS 140-2 and CC-TCG certified Trusted Platform Module; stores platform measurements and cryptographic keys; required for BitLocker, measured boot, and Zero Trust infrastructure attestation.
Cryptographically signed firmware — all iDRAC9, BIOS, and peripheral firmware is digitally signed by Dell; unsigned or modified firmware is rejected at update time and at boot; System Lockdown mode prevents all unauthorized configuration changes.
Secure Erase — iDRAC9 Lifecycle Controller provides NIST 800-88 compliant cryptographic erase and overwrite for all attached drives; ensures data cannot be recovered when decommissioning or redeploying drives.
iDRAC9 — Autonomous Out-of-Band Management with Redfish API
iDRAC9 out-of-band management — dedicated management controller operates independently of the host OS and CPU; provides full server control including power, BIOS, firmware updates, and hardware monitoring even when the server is powered off.
Redfish API — industry-standard DMTF Redfish RESTful API enables programmatic server management; integrates with Ansible, Terraform, Python, and all major infrastructure-as-code and automation platforms.
iDRAC9 Lifecycle Controller — embedded provisioning engine supports bare-metal OS deployment, firmware updates, hardware configuration, and system inventory collection without booting an OS or inserting physical media.
OpenManage Enterprise — centralized console for one-to-many PowerEdge management; supports automated firmware compliance, alerting, remote KVM console, and server profiles across large fleets; integrates with VMware vCenter, ServiceNow, and Microsoft System Center.
iDRAC Direct (front panel) — Micro-AB USB port provides local GUI access to iDRAC9 via laptop browser connection; enables full management without a dedicated management network during deployment or recovery.
Quick Sync 2 wireless module — optional Bluetooth and Wi-Fi module enables OpenManage Mobile app on iOS and Android; scan the QRL barcode on the server to pull inventory and initiate remote management sessions in the field.
CloudIQ integration — Dell CloudIQ AIOps plug-in for PowerEdge provides predictive health scoring and anomaly detection across the server fleet; proactively identifies hardware issues before they cause outages.
Windows Server, RHEL, Ubuntu, SLES, and VMware ESXi
Microsoft Windows Server with Hyper-V — full certification including Windows Server 2019 and 2022 LTSC; Hyper-V virtualization leverages AMD SEV-SNP for shielded VM isolation; supports Nested Virtualization and Storage Spaces Direct for HCI configurations.
Red Hat Enterprise Linux (RHEL) — Dell and Red Hat jointly certify current RHEL releases; RHEL with KVM leverages AMD EPYC virtualization extensions; supported for SAP HANA and SAP S/4HANA deployments on certified configurations.
Canonical Ubuntu Server LTS — Ubuntu 20.04 and 22.04 LTS certified; commonly used for Kubernetes, OpenStack, Ceph SDS, and AI/ML workloads; Ubuntu Pro subscription available for extended 10-year security maintenance.
SUSE Linux Enterprise Server (SLES) — SLES certified for SAP HANA and traditional enterprise Linux workloads; SUSE Linux Enterprise High Availability extension supported for clustered deployments.
VMware ESXi — VMware vSphere certified across current ESXi releases; AMD EPYC 9004 supports vSphere Distributed Services Engine for DPU offload in supported configurations; vSAN Ready Node configurations available.
Lifecycle Controller OS deployment — all supported operating systems can be deployed bare-metal via iDRAC9 Lifecycle Controller without physical media; network-based OS deployment integrates with OpenManage Enterprise for fleet provisioning.
Universal Rail Kit — 2U 19-Inch Rack Ready with CMA Option
2U rack form factor — 86.8 mm height (3.41 in); 482 mm width (18.97 in); standard 19-inch EIA rack compatible with all major rack vendors and data center cabinet standards.
Depth: 772.13 mm (30.39 in) with bezel — verify rack depth before installation; most modern 1000 mm deep racks accommodate the R7625 with adequate clearance for rear cable management.
Rail sizing compatibility matrix — Dell publishes an Enterprise Systems Rail Sizing and Rack Compatibility Matrix with specific rail types, adjustability ranges, and rack mounting flange details for all configurations.
Cable Management Arm (CMA) option — optional CMA organizes rear cables and allows the server to slide forward on the rails without disconnecting rear cables during servicing.
Tool-less rail design — standard PowerEdge rails support tool-free installation in square-hole racks; adapter kits available for round-hole and threaded-hole rack configurations.
Maximum weight: 34.4 kg (75.84 lbs) fully loaded — plan rack load capacity accordingly; 23.3 kg without drives and PSUs for initial rack mounting before component population.
Quick Resource Locator (QRL) — QR code on the system information tag links to setup videos, service manual, and configuration-specific support resources for fast field servicing.
R7625 vs. R7525 — What’s New in 16th Generation
AMD EPYC 9004 Genoa (SP5) vs Gen 2/3 EPYC (SP3) — xGMI3 interconnect doubles from 16 GT/s to 32 GT/s; PCIe Gen5 with four slots replaces Gen4-only; 5nm process delivers significant improvement in performance-per-watt.
DDR5 at 4800 MT/s vs DDR4 at 3200 MT/s — 24 DDR5 slots deliver up to 6 TB RDIMM; the R7525 used 32 DDR4 slots reaching only 2 TB RDIMM or 4 TB LRDIMM at lower bandwidth.
EDSFF E3.S Gen5 NVMe added — the R7625 supports 8, 16, or 32 × E3.S Gen5 NVMe drives; the R7525 had no EDSFF configuration option.
PERC 12 (H965i) added — the H965i brings 24G SAS4 RAID and NVMe RAID; the R7525 used PERC 11 (H345/H745/H755) only.
Optional Direct Liquid Cooling — the R7625 supports DLC for 400W TDP processors; the R7525 was air-cooling only.
Secured Component Verification added — hardware integrity check for component validation at boot; not available on R7525.
| Feature | R7625 (Gen 16) | R7525 (Gen 15) |
|---|---|---|
| Processors | 2 × AMD EPYC 9004 (up to 256 cores) | 2 × AMD EPYC Gen 2/3 (up to 256 cores) |
| CPU Interconnect | xGMI3 32 GT/s | xGMI 16 GT/s |
| Memory | 24 × DDR5, 6 TB, 4800 MT/s | 32 × DDR4, 2 TB RDIMM / 4 TB LRDIMM, 3200 MT/s |
| EDSFF Storage | Up to 32 × E3.S Gen5 NVMe | Not supported |
| PCIe Generation | 4 × Gen5 + 4 × Gen4 (8 slots) | 8 × Gen4 (no Gen5) |
| GPU Options | Up to 2 × 300W DW or 6 × 75W SW | Up to 3 × 300W DW or 6 × 75W SW |
| Power Supplies | 800W–2800W Platinum & Titanium | 800W–2400W Platinum & Titanium |
| Direct Liquid Cooling | Optional DLC supported | Air cooling only |
| Storage Controllers | PERC 12 (H965i) + PERC 11 + BOSS-N1 | PERC 11 (H345/H745/H755) + BOSS |
| Secured Component Verification | Yes (new in Gen 16) | No |
| Management | iDRAC9 Redfish API + CloudIQ | iDRAC9 (no CloudIQ) |
Dell ProSupport and ProDeploy — End-to-End Service Coverage
Dell ProSupport — 24/7/365 direct access to Dell’s advanced-level engineers with model-specific PowerEdge expertise; proactive monitoring via SupportAssist identifies and resolves hardware issues before they cause downtime.
ProSupport Plus — adds predictive analysis and automated issue detection via Dell SupportAssist; telemetry from iDRAC9 is analyzed in Dell’s cloud to identify degrading components and dispatch parts proactively.
Dell ProDeploy — factory integration and on-site deployment services configure the R7625 to your exact specifications before delivery; includes rack installation, cabling, OS deployment via Lifecycle Controller, and validation testing.
Residency and consulting services — Dell Technologies consulting engagements cover architecture design, migration planning, HPC cluster sizing, and virtualization optimization for R7625 deployments across 170+ locations worldwide.
Keep Your Hard Drive (KYHD) — optional service retains failed drives after replacement; critical for organizations with data sovereignty, compliance, or chain-of-custody requirements that prohibit returning failed storage media.
Express Computer Systems refurbished coverage — ECS professionally refurbishes, tests, and reconditions R7625 servers to operational standards; configured to order at a fraction of new pricing with options spanning all chassis types and drive configurations.
Titanium PSUs and EPYC Genoa — Performance-Per-Watt Leadership
Titanium-rated PSUs — the 1100W, 1800W, and 2800W Titanium PSUs achieve ≥96% efficiency at 50% load; Titanium efficiency reduces heat output and cooling energy at scale compared to Platinum-rated equivalents — a direct reduction in PUE for high-density deployments.
AMD EPYC 9004 performance-per-watt — the 5nm Zen4 process delivers substantially higher performance-per-watt than the 7nm EPYC Gen 2 and Gen 3 processors in the R7525; workloads can consolidate from more physical servers onto fewer R7625 nodes, reducing total power, cooling, and rack space.
Optional Direct Liquid Cooling — DLC removes heat at the processor level using liquid coolant rather than data center air; enables higher TDP processors in lower ambient temperatures with reduced CRAC unit load; measurably improves data center PUE in high-density rows.
iDRAC9 power management — iDRAC9 System Power Management policies allow administrators to cap server power draw, enabling higher rack density within existing power budgets; historical power telemetry supports capacity planning and sustainability reporting.
EDSFF E3.S NVMe efficiency — EDSFF E3.S drives consume significantly less power per TB than 2.5-inch NVMe U.2 drives while delivering equivalent Gen5 performance; 32-drive EDSFF configurations maximize storage density per watt in the 2U chassis.
Dell’s sustainability commitments — Dell Technologies targets net-zero greenhouse gas emissions across Scope 1 and 2 by 2050; PowerEdge server packaging uses recycled and renewable materials; end-of-life asset recovery through Dell Technologies services enables responsible hardware retirement.
Frequently Asked Questions — Dell PowerEdge R7625
The Dell PowerEdge R7625 supports two AMD EPYC 9004 Genoa (SP5) processors with up to 128 cores each, for a maximum of 256 total cores per system. Dual-socket configurations using the AMD EPYC 9754 deliver the full 256-core count. Both Zen4 and Zen4c core variants are available across the EPYC 9004 lineup.
The R7625 supports up to 32 front drives depending on the chassis configuration selected. Options include up to 32 × EDSFF E3.S Gen5 NVMe, 24 × 2.5-inch SAS/SATA/NVMe, 16 × 2.5-inch SAS/SATA/NVMe, 12 × 3.5-inch SAS/SATA, or 8 × 3.5-inch SAS/SATA. Optional rear bay modules add 2 or 4 additional 2.5-inch drives on supported chassis.
The R7625 supports up to six single-wide 75W PCIe Gen5 GPUs or up to two double-wide 300W PCIe Gen5 GPUs. GPU acceleration is not supported on 12 × 3.5-inch LFF or 24 × 2.5-inch SFF chassis configurations, or on systems with a rear drive module installed. All GPU configurations require High-Performance Gold fans.
Yes. Express Computer Systems offers professionally refurbished Dell PowerEdge R7625 servers tested, reconditioned, and configured to order. ECS refurbished servers are available across all major chassis configurations — LFF, SFF, and EDSFF — at a fraction of new pricing, making the R7625 accessible for budget-conscious data center and HPC deployments.
The R7625 (Gen 16) replaces the R7525 (Gen 15) with AMD EPYC 9004 Genoa (SP5) processors, DDR5 memory (24 slots, 6 TB at 4800 MT/s versus 32 DDR4 slots at 3200 MT/s), PCIe Gen5 slots (4 of 8), EDSFF E3.S Gen5 NVMe support, optional Direct Liquid Cooling, the new PERC H965i (PERC 12) controller, and Secured Component Verification security. The R7525 supported up to three double-wide GPUs versus two on the R7625, but the R7625 adds Gen5 bandwidth throughout.
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