Dell PowerEdge R7615 Review
Single-Socket 2U Density for SDS, Virtualization, HPC, and EDSFF Gen5 NVMe
Software-Defined Storage (SDS) — up to 32 EDSFF E3.S Gen5 NVMe drives in a 2U chassis delivers exceptional NVMe density for all-flash SDS nodes running Ceph, Lustre, or DAOS.
Virtualization — single AMD EPYC 9004 with up to 128 cores and 3 TB DDR5 memory provides high VM density per rack unit; AMD SEV enables per-VM memory isolation for secure multi-tenant workloads.
High Performance Computing (HPC) — up to 128 Zen4/Zen4c cores, 32 MB L3 cache per core, and PCIe Gen5 bandwidth support memory-intensive simulation and scientific computing workloads.
Data Analytics — 3 TB DDR5 at 4800 MT/s enables large in-memory datasets; up to 24 SAS/SATA/NVMe drives or 32 EDSFF Gen5 drives support high-throughput analytic storage tiers.
Virtual Desktop Infrastructure (VDI) — high single-socket core count maximizes user session density; optional GPU support with up to 6 × 75W single-width cards accelerates graphics-intensive desktop workloads.
Database Consolidation — 3 TB DDR5 with NVMe Gen5 direct-attach storage supports in-memory and high-throughput transactional databases including MySQL, PostgreSQL, and SAP workloads.
Edge and Branch Compute — 2U form factor with high compute density and optional DLC suits space-constrained edge data centers running containerized or virtualized workloads.
AMD EPYC™ 9004 (Genoa) — Single-Socket, Up to 128 Cores per Chassis
Single-socket SP5 platform — one AMD EPYC 9004 Series processor on the SP5 socket; supports the full Genoa lineup from 16-core 9124 to 128-core 9754, enabling wide TDP and core-count flexibility.
Up to 128 Zen4c or 96 Zen4 cores — Zen4c SKUs (9754, 9734) maximize thread density for highly parallel workloads at lower per-core TDP; Zen4 SKUs optimize single-thread performance.
5nm TSMC process technology — Genoa’s 5nm die delivers improved performance-per-watt over prior EPYC generations; sustains higher sustained throughput in a thermally constrained 2U chassis.
Up to 4.10 GHz boost clock — 9174F and 9274F F-series SKUs reach 4.10 GHz and 4.05 GHz respectively for latency-sensitive transactional databases and VDI user density workloads.
32 MB L3 cache per core — largest available x86 L3 cache per core; significantly reduces main-memory accesses for data-intensive HPC and analytics workloads.
Up to 400W TDP — 9684X and 9754 reach 400W TDP requiring Direct Liquid Cooling; standard air cooling with HPR Gold fans supports configurations up to 300W TDP.
AMD Infinity Guard — Secure Encrypted Virtualization (SEV-SNP) and Secure Memory Encryption (SME) provide hardware-level per-VM and full-system memory encryption at silicon.
12 DDR5 DIMM Slots — Up to 3 TB at 4800 MT/s
12 × 288-pin DDR5 RDIMM slots — all 12 channels driven by the single EPYC 9004 processor; one DIMM per channel at 1DPC for full 4800 MT/s speed across all configurations.
Up to 3 TB total capacity — achieved with 256 GB 3DS RDIMM octa-rank modules; supports 16 GB single-rank through 256 GB octa-rank DIMMs across the full DDR5 speed range.
4800 MT/s operating speed — DDR5 dual sub-channel architecture delivers higher per-pin bandwidth than DDR4; Infinity Fabric and memory clock synchronized for optimal latency.
RDIMM only — no UDIMMs — all memory modules must be registered ECC RDIMM or 3DS RDIMM; unbuffered DIMMs are not supported in any R7615 configuration.
Capacity by DIMM rank — 32 GB dual-rank: up to 384 GB; 64 GB dual-rank: up to 768 GB; 128 GB quad-rank: up to 1.5 TB; 256 GB octa-rank: up to 3 TB.
Bandwidth advantage over R7515 — DDR5 at 4800 MT/s exceeds the R7515’s DDR4 maximum of 3200 MT/s; 12-channel architecture delivers greater aggregate memory bandwidth for HPC workloads.
Memory channels not hot-swappable — DIMM slots require server power-off for module replacement; plan memory configuration at deployment time to avoid downtime for capacity upgrades.
PERC H965i Through H355 — Full RAID Coverage Across All Drive Tiers
PERC H965i (PERC 12) — 24G SAS4 RAID-on-Chip controller with 8 GB NV cache; supports RAID 0/1/5/6/10/50/60 across SAS, SATA, and NVMe; highest-tier internal RAID for enterprise workloads.
PERC H755 / H755N — PERC 11 12G SAS3 controllers with 8 GB write cache; H755N is the NVMe-optimized variant; supported in front-PERC and adapter-PERC form factors.
PERC H355 — entry-level PERC 11 controller for RAID 0/1/5/10 across 12G SAS/SATA; cost-optimized for configurations where premium NV cache is not required.
HBA355i / HBA355e / HBA465e — non-RAID passthrough HBAs; HBA355i is internal, HBA355e and HBA465e are external 24G SAS4 HBAs for direct JBOD connectivity to ME5 series enclosures.
BOSS-N1 boot module — Boot Optimized Storage Subsystem with hardware RAID 1 across two M.2 NVMe SSDs; dedicated rear internal slot; no PCIe slot consumed; independent of all front and rear data bays.
Software RAID (S160) — OS-level NVMe RAID via S160 driver; supported in configurations where hardware RAID is not required; enables direct NVMe passthrough to the OS.
External storage via JBOD — HBA355e and HBA465e support connection to ME5 series SAS JBOD enclosures for scale-out storage beyond internal bay count.
Eight Front Chassis Configurations — Up to 32 EDSFF E3.S Gen5 NVMe Drives
8 × 3.5-inch SAS/SATA front bays — up to 160 TB raw; supports 7.2K and 10K HDDs plus SATA SSD; ideal for high-capacity nearline storage.
12 × 3.5-inch SAS/SATA front bays — up to 240 TB raw; maximum LFF configuration for archival, backup, and high-capacity HDD deployments.
8 × 2.5-inch SAS/SATA/NVMe front bays — up to 122.88 TB; universal backplane accepts SAS, SATA, or NVMe interchangeably.
16 × 2.5-inch SAS/SATA/NVMe front bays — up to 245.76 TB; high-density SFF configuration for mixed SAS/NVMe deployments requiring RAID across many drives.
24 × 2.5-inch SAS/SATA/NVMe front bays — up to 368.64 TB; maximum 2.5-inch SFF density with SAS expander backplane supporting 24G SAS4 and NVMe mixed populations.
8, 16, or 32 × EDSFF E3.S Gen5 NVMe front bays — up to 245.76 TB all-flash; 32-drive EDSFF configuration delivers exceptional PCIe Gen5 NVMe density in a single 2U chassis — the highest NVMe count available in this class.
Rear bay options — 2 × 2.5-inch (up to 30.72 TB) or 4 × 2.5-inch SAS/SATA/NVMe (up to 61.44 TB); hot-swap rear modules add capacity without consuming front bays.
BOSS-N1 — Dedicated NVMe OS Boot, All Data Bays Free
BOSS-N1 module — Boot Optimized Storage Subsystem (NVMe generation); dedicated M.2 NVMe SSD carrier mounts in a rear internal slot, fully separate from all front and rear data drive bays.
Hardware RAID 1 mirrored pair — two M.2 NVMe SSDs mirror the OS in hardware; one drive failure does not interrupt operation or require OS reinstallation.
No PCIe slot consumed — BOSS-N1 uses a dedicated internal connector independent of all riser PCIe slots; every PCIe expansion slot remains free for NICs, HBAs, or GPUs.
Hot-serviceable module — BOSS-N1 is accessible from the rear panel without powering down the server; M.2 SSD replacement does not require chassis disassembly.
UEFI Secure Boot integration — BOSS-N1 supports UEFI Secure Boot and integrates with iDRAC9 Lifecycle Controller for bare-metal OS deployment and recovery workflows.
Frees all front bays for data — because the OS resides on BOSS-N1, all front drive bays and optional rear drive modules are available exclusively for application data and storage workloads.
Up to 6 × 75W Single-Width or 3 × 300W Double-Width GPUs in 2U
Up to 3 × 300W double-width GPUs — full-length double-width GPU cards (NVIDIA A100 80GB, A40 48GB, A30 24GB, MI210) supported in GPU riser configurations; highest GPU performance tier available in the 2U chassis.
Up to 6 × 75W single-width GPUs — single-width full-length GPU cards (NVIDIA A2 16GB) supported in SW riser configurations; optimizes GPU count per chassis for inference and VDI offload workloads.
GPU shroud required — GPU configurations use a dedicated GPU air shroud that replaces the standard air shroud; High Performance Gold (HPR Gold) fans are required for all GPU configurations.
PCIe Gen5 GPU interface — GPU cards in Gen5-capable riser slots connect via PCIe Gen5 x16 for maximum bandwidth between the EPYC 9004 processor and the accelerator.
GPU not supported on 12 × 3.5-inch config — GPU is incompatible with the 12 × 3.5-inch LFF front storage chassis; GPU configurations require 2.5-inch or EDSFF front backplane configurations.
Typical GPU use cases — AI inference, visualization, GPU-accelerated HPC simulations, video transcoding, and VDI graphics offload for increased user session density per server.
Up to 8 PCIe Slots — Mixed Gen5 and Gen4 Across Ten Riser Configurations
Up to 8 PCIe slots — 4 × PCIe Gen5 and 4 × PCIe Gen4 slots across all riser configurations; slot width is x8 or x16 depending on riser type and position.
Ten riser configurations (Config 0 through Config 10) — riser combinations (R1U, R1T, R2A, R2T, R3A, R3B, R4A, R4P, R4Q, R4S) optimized for compute, GPU, storage controller, and mixed-use profiles.
Config 0 (No Riser) — no external expansion cards; front PERC only; maximum thermal headroom for high-TDP processor configurations without additional heat sources from expansion cards.
Full-height / full-length slots — R1T provides one FHFL PCIe Gen5 x16 slot (Slot 2) for large dual-width GPU or FPGA accelerators requiring the maximum physical card envelope in a 2U chassis.
Low-profile slots — R2A provides two low-profile half-length PCIe Gen4 slots (Slots 3 and 6) for standard-height NICs, SAS HBAs, and FPGA cards.
Rear storage possible with Config 6 — R2T + R4Q configuration supports rear drive modules; all other riser configurations occupy the rear module position and preclude rear storage.
OCP 3.0 slot independent — the dedicated OCP 3.0 slot on the system board is separate from all riser PCIe slots; OCP card installation does not consume a riser slot.
OCP 3.0 Networking — Up to 25 GbE per Slot Plus PCIe NIC Options
Dedicated OCP 3.0 slot — one integrated OCP 3.0 (SFF) card slot on the system board; supports both SCFF and SFF cards up to x8 PCIe Gen4; independent of riser PCIe slots.
OCP 3.0 speeds — 1 GbE × 4, 10 GbE × 2, 10 GbE × 4, 25 GbE × 2, or 25 GbE × 4 via Intel, Mellanox, and Broadcom OCP cards; maximum 25 GbE per port.
Optional 2 × 1 GbE LOM card — Broadcom BCM5720 LAN-on-Motherboard adds two integrated 1 GbE ports; can be installed alongside an OCP card for management/data network separation.
PCIe NIC expansion — additional NICs up to 100 GbE (Mellanox ConnectX) installable in PCIe riser slots for high-bandwidth storage fabrics, HPC interconnects, or RDMA-capable networks.
Dedicated iDRAC9 1 GbE port — separate rear-panel Ethernet port exclusively for out-of-band management; never shares bandwidth with production network traffic.
Multi-rail topology — install LOM + OCP + PCIe NICs simultaneously for separate management, storage, and production paths; OCP x16 cards downgrade to x8 on the R7615 system board.
Wake-on-LAN (WoL) support — all supported OCP cards include WoL capability; enables remote power-on for rack management and scheduled maintenance operations.
700W to 2400W — Titanium & Platinum Hot-Swap Redundant PSUs
700W Titanium Mixed Mode — 200–240V AC or 240V HVDC; smallest Titanium-efficiency PSU; C13 power cord; suited for lower-TDP processor configurations.
800W Platinum Mixed Mode — 100–240V AC or 240V HVDC; C13 power cord; broadest voltage input range for sites that require 120V AC compatibility.
1100W Titanium Mixed Mode — 100–240V AC or 240V HVDC; 96%+ AC-to-DC efficiency; recommended for high-TDP single-socket configurations in AC data center environments.
1100W LVDC — −48V to −60V DC input for telecom and HVDC power plant environments; C13 power cord; same efficiency class for DC-powered infrastructure.
1400W Platinum Mixed Mode — 100–240V AC or 240V HVDC; C13 power cord; supports high-TDP 400W processor configurations with adequate PSU headroom in N+1 redundancy.
1800W Titanium — 200–240V AC or 240V HVDC; C15 power cord; highest efficiency at maximum wattage; required for DLC-cooled 400W TDP configurations with fully-populated storage.
2400W Platinum — 100–240V AC or 240V HVDC; C19 power cord; highest absolute wattage for configurations with maximum GPU, storage, and PCIe expansion card populations.
SmartCooling — Standard Air Cooling + Optional Direct Liquid Cooling
Up to 6 hot-plug fan modules — HPR Silver (HPR SLVR) or HPR Gold fans; fan type selection is driven by CPU TDP, drive configuration, rear modules, and GPU presence per the thermal restriction matrix.
HPR Gold fans required for GPU and high-TDP configs — HPR Gold provides higher airflow for configurations with 300W+ TDP processors, fully-populated drive bays, or GPU cards installed.
Air shroud required for all air-cooled configs — the standard or GPU air shroud directs airflow from front fan modules across the CPU, memory, and storage; never operate with the shroud removed.
Optional Direct Liquid Cooling (DLC) — liquid cooling heat sink modules replace air heat sinks for 300W+ TDP configurations; coldplates connect to facility coolant manifold via rear-panel coolant tubes.
DLC is a rack solution — requires rack manifolds and a Cooling Distribution Unit (CDU) such as DLC3000 or DLC7000 installed in the rack infrastructure; DLC is not a standalone server option.
SmartCooling algorithm — iDRAC9 dynamically adjusts fan speed based on inlet temperature, CPU load, drive population, and ambient sensors for optimal acoustic and thermal balance.
Thermal restriction matrix — not all CPU SKUs are compatible with all drive configurations; Dell’s thermal restriction matrix defines valid CPU/drive/fan combinations; some CPU SKUs are not supported in 12 × 3.5-inch configs.
Front, Rear & Internal I/O — USB 3.0, VGA, iDRAC Direct
Front panel — 1 × iDRAC Direct (Micro-AB USB 2.0) for local management without network access; 1 × USB 2.0; 1 × VGA for direct console connection during initial setup.
Rear panel — 1 × USB 3.0 (9-pin SuperSpeed); 1 × USB 2.0 (4-pin); 1 × VGA (absent on DLC configurations, replaced by optional VGA port bracket); 1 × dedicated iDRAC9 Ethernet port; OCP card ports; optional LOM ports.
DLC VGA port option — Direct Liquid Cooling configurations replace the standard rear VGA with an optional VGA port installed on an expansion bracket; must be ordered separately for DLC deployments.
Optional serial COM port — 9-pin DTE, 16550-compliant serial adapter installs in an expansion bracket; required for legacy serial console management in out-of-band environments.
Internal USB — 1 × internal USB 3.0 port for internal USB flash media or hypervisor boot drives; accessible inside the chassis without external cable routing.
iDRAC Direct LED — front-panel iDRAC Direct port includes a two-state LED: solid blue = active connection, blinking blue = data transfer in progress.
Integrated Matrox G200 graphics — 16 MB video frame buffer; resolutions up to 1920 × 1200 at 60 Hz for management console use via front or rear VGA.
Cyber Resilient Architecture — Silicon Root of Trust & AMD Infinity Guard
Silicon Root of Trust — cryptographic hardware anchor in iDRAC9 silicon verifies the integrity of every firmware image at each boot; prevents execution of unsigned or tampered firmware.
AMD Secure Encrypted Virtualization (SEV-SNP) — hardware-level per-VM memory encryption with Secure Nested Paging; even a compromised hypervisor cannot access guest VM memory in plaintext.
AMD Secure Memory Encryption (SME) — full-system DRAM encryption at the memory controller level; all memory encrypted transparently without application modification.
Secured Component Verification — hardware integrity check validates server components match the factory configuration at startup; detects substituted or counterfeit parts before OS boot.
Cryptographically signed firmware — every firmware image is signed by Dell Technologies; iDRAC9 validates signatures before installation and before each execution at boot.
System Lockdown — locks all firmware and configuration changes when enabled; requires iDRAC9 Enterprise or Datacenter license; prevents unauthorized modification during live operation.
TPM 2.0 / Secure Boot / Secure Erase — TPM 2.0 (FIPS and CC-TCG certified, plus optional China NationZ) stores cryptographic keys; Secure Erase cryptographically sanitizes drives to NIST 800-88 before decommission.
iDRAC9 — Out-of-Band Lifecycle Management & Redfish API
iDRAC9 embedded in every server — dedicated management processor independent of the main CPU and OS; remains accessible even when the server is powered off or the OS is unresponsive.
RESTful Redfish API — industry-standard API enables infrastructure-as-code management; integrates with Ansible, Terraform, BMC TrueSight, ServiceNow, and VMware vCenter at scale.
iDRAC Direct — local management via Micro-AB USB port on the front panel; connect a laptop directly without needing network access or preconfigured credentials.
Quick Sync 2 wireless module — optional Bluetooth/Wi-Fi module enables OpenManage Mobile (OMM) configuration and health monitoring from a mobile device via the information tag.
OpenManage Enterprise (OME) — CloudIQ for PowerEdge plug-in, OpenManage Enterprise Integration for VMware vCenter, and OpenManage Integration with Windows Admin Center provide one-to-many lifecycle management.
Lifecycle Controller — manages firmware updates, OS deployment, hardware configuration, and system logs without an installed OS; enables bare-metal provisioning from iDRAC9 directly.
OpenManage integrations — certified plugins for VMware vCenter, Red Hat Ansible, Microsoft SCOM, Terraform, ServiceNow, and BMC TrueSight for ecosystem-native server management workflows.
Windows Server, RHEL, Ubuntu, SLES & VMware ESXi
Microsoft Windows Server (with Hyper-V) — certified for Windows Server 2019 and 2022; Hyper-V role supported for in-OS VM consolidation; Dell-validated drivers and firmware for EPYC 9004.
Red Hat Enterprise Linux (RHEL) — RHEL 8.x and 9.x certified; includes Dell hardware enablement packages for EPYC 9004 platform features including SEV-SNP and AMD SME kernel support.
Canonical Ubuntu Server LTS — Ubuntu 20.04 LTS and 22.04 LTS certified; ideal for Kubernetes, OpenStack, Ceph SDS deployments, and DevOps CI/CD pipeline servers.
SUSE Linux Enterprise Server (SLES) — SLES 15.x certified; common in SAP workloads, mission-critical Linux deployments, and enterprise environments requiring long-term OS support.
VMware ESXi — ESXi 7.0 and 8.0 certified; validated for vSAN, NSX-T, and vSphere DRS for automated VM workload balancing across ESXi clusters.
OS deployment via Lifecycle Controller — iDRAC9 Lifecycle Controller supports one-click OS installation without an external boot server or USB media; PXE boot also supported for network-based deployment.
Full OS support list — visit www.dell.com/ossupport for the complete and current list of certified operating systems and hypervisors for the PowerEdge R7615.
Universal Rail Kit — 2U 19-Inch Rack Ready with CMA Option
2U rack form factor — 86.8 mm height (3.41 in); 482 mm width (18.97 in); standard 19-inch EIA rack compatible with all major rack vendors and data center cabinet standards.
Depth: 772.13 mm (30.39 in) with bezel — verify rack depth before installation; most modern 1000 mm deep racks accommodate the R7615 with adequate clearance for rear cable management.
Rail sizing compatibility matrix — Dell publishes an Enterprise Systems Rail Sizing and Rack Compatibility Matrix with specific rail types, adjustability ranges, and rack mounting flange details for all configurations.
Cable Management Arm (CMA) option — optional CMA organizes rear cables and allows the server to slide forward on the rails without disconnecting rear cables during servicing.
Tool-less rail design — standard PowerEdge rails support tool-free installation in square-hole racks; adapter kits available for round-hole and threaded-hole rack configurations.
Maximum weight: 34.5 kg (76.05 lbs) fully loaded — plan rack load capacity accordingly; 25.7 kg without drives and PSUs for initial rack mounting before component population.
Quick Resource Locator (QRL) — QR code on the system information tag links to setup videos, service manual, and configuration-specific support resources for fast field servicing.
R7615 vs. R7515 — What’s New in 16th Generation
AMD EPYC 9004 Genoa (SP5) vs Gen 2/3 EPYC (SP3) — xGMI3 interconnect doubles from 16 GT/s to 32 GT/s; PCIe Gen5 with 4 slots replaces Gen3/Gen4; 5nm process improves performance-per-watt significantly.
DDR5 at 4800 MT/s vs DDR4 at 3200 MT/s — 12 DDR5 slots deliver up to 3 TB; the R7515 used 16 DDR4 slots reaching only 1 TB RDIMM or 2 TB LRDIMM at lower bandwidth.
EDSFF E3.S Gen5 NVMe added — the R7615 supports 8, 16, or 32 × E3.S Gen5 NVMe drives; the R7515 had no EDSFF configuration option.
PERC 12 (H965i) added — the H965i brings 24G SAS4 RAID and NVMe RAID; the R7515 used PERC 11 (H330/H730P) only.
Optional Direct Liquid Cooling — the R7615 supports DLC for 300W+ TDP processors; the R7515 was air-cooling only.
GPU expanded — R7615 supports 3 × 300W DW or 6 × 75W SW GPUs; the R7515 supported up to 4 × 150W GPUs with different riser configurations.
Secured Component Verification added — hardware integrity check for component validation at boot; not available on R7515.
| Feature | R7615 (Gen 16) | R7515 (Gen 15) |
|---|---|---|
| Processor | AMD EPYC 9004 Genoa (SP5) | AMD EPYC Gen 2/3 (SP3) |
| CPU Interconnect | xGMI 32 GT/s | xGMI 16 GT/s |
| Memory | 12 DDR5 slots, up to 3 TB, 4800 MT/s | 16 DDR4 slots (1 TB RDIMM / 2 TB LRDIMM) |
| EDSFF Storage | Up to 32 × E3.S NVMe Gen5 | Not supported |
| PCIe Generation | 4 × Gen5 + 4 × Gen4 | 2 × Gen3 + 2 × Gen4 |
| Top RAID Controller | PERC H965i (PERC 12, 24G SAS4) | H730P / H330 (PERC 11) |
| Direct Liquid Cooling | Optional DLC | Air cooling only |
| GPU Options | 3 × 300W DW or 6 × 75W SW | Up to 4 × 150W |
| Security | Silicon Root of Trust + SCV | Silicon Root of Trust |
| Management | iDRAC9 | iDRAC9 |
| Form Factor | 2U rack | 2U rack |
ProSupport & ProDeploy — End-to-End Service Coverage
ProSupport for Enterprise — 24×7 access to Dell Technologies senior engineers with direct escalation to engineering; remote diagnostics, firmware analysis, and field dispatch coordination.
ProSupport Plus — adds SupportAssist automated case creation using iDRAC9 telemetry; predictive hardware failure detection reduces unplanned downtime before components fail.
ProDeploy Enterprise Suite — factory integration, rack-and-stack, and on-site deployment services; server arrives pre-configured and deployed within the contracted service window.
Dell Consulting Services — architecture design, migration planning, and workload optimization by Dell Technologies consultants across 170+ global service locations.
170+ country coverage — 60K+ certified engineers and partners; SLA options from next business day to 4-hour on-site parts and labor response for mission-critical deployments.
Data Migration Services — assisted data migration from legacy infrastructure; supports physical-to-virtual (P2V) and storage migrations with dedicated project management.
Extended Life support — post-end-of-service-life support contracts maintain coverage on refurbished infrastructure beyond standard warranty windows for long-lifecycle deployments.
Titanium PSUs & EPYC Genoa — Performance-per-Watt at Scale
AMD EPYC 9004 5nm efficiency — Genoa’s 5nm TSMC process delivers substantially improved performance-per-watt versus prior EPYC generations; more compute per watt in the 2U chassis.
Titanium 80 PLUS PSUs — the 700W, 1100W, and 1800W Titanium PSUs achieve 96%+ AC-to-DC conversion efficiency; lower waste heat and reduced cooling load versus Platinum tier PSUs at equivalent wattage.
Optional Direct Liquid Cooling — DLC removes heat directly from the CPU at source; reduces dependency on high-flow air cooling and can lower overall data center cooling energy consumption per rack.
iDRAC9 Power Manager — OpenManage Power Manager plugin enables real-time power capping, rack-level power budgeting, and per-server power consumption analytics for energy cost management.
ENERGY STAR and 80 PLUS certification — Dell PowerEdge products are designed to meet ENERGY STAR, 80 PLUS, Climate Savers, and EPEAT environmental certification standards.
High NVMe density per watt — 32 EDSFF E3.S drives in 2U deliver more capacity per rack unit than equivalent 2.5-inch U.2 configurations; fewer drives in fewer servers means less aggregate power consumption per TB.
Sustainability commitment — Dell Technologies provides end-of-life electronics recycling, responsibly sourced materials, and circular economy programs for decommissioned server infrastructure.
Frequently Asked Questions — Dell PowerEdge R7615
The R7615 supports one AMD EPYC 4th Generation 9004 Series processor in a single-socket (SP5) configuration. The highest-core SKU is the EPYC 9754 with 128 Zen4c cores (256 threads) at 360W TDP. Other high-core options include the 9734 (112 cores), 9654 (96 cores), and several F-series SKUs for high-frequency, lower-core-count workloads. The single-socket architecture delivers exceptional per-core performance and memory bandwidth for virtualization, HPC, and SDS workloads.
The R7615 supports eight front chassis configurations: up to 8 or 12 × 3.5-inch SAS/SATA, up to 8, 16, or 24 × 2.5-inch SAS/SATA/NVMe, or up to 8, 16, or 32 × EDSFF E3.S Gen5 NVMe front drives. Optional rear bays add up to 2 or 4 × 2.5-inch SAS/SATA/NVMe drives. Maximum raw capacity reaches 368.64 TB in the 24 × 2.5-inch configuration or 245.76 TB in the 32 × EDSFF E3.S configuration.
The R7615 supports up to 3 × 300W double-width GPUs (NVIDIA A100 80GB, A40 48GB, A30 24GB, AMD MI210) or up to 6 × 75W single-width GPUs (NVIDIA A2 16GB) depending on riser configuration. GPU is not supported in the 12 × 3.5-inch LFF chassis configuration. All GPU configurations require HPR Gold fans, a GPU air shroud, and appropriate PSU wattage for the total system thermal load.
Yes. Express Computer Systems stocks professionally reconditioned refurbished Dell PowerEdge R7615 servers tested, cleaned, and configured to your specifications — ready to deploy at significant cost savings versus new. Shop refurbished Dell R7615 servers at ECS.
The R7615 (Gen 16) succeeds the R7515 (Gen 15) with AMD EPYC 4th Gen Genoa (SP5) replacing 2nd/3rd Gen EPYC (SP3). Key upgrades include DDR5 up to 3 TB at 4800 MT/s (vs DDR4 at 3200 MT/s), EDSFF E3.S Gen5 NVMe support with up to 32 drives (the R7515 had none), PCIe Gen5 (4 slots vs zero on the R7515), PERC 12 (H965i) RAID controller, optional Direct Liquid Cooling, Secured Component Verification, and a doubled xGMI interconnect at 32 GT/s versus 16 GT/s.
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