Dell PowerEdge R760 Specs and Features
Meet the PowerEdge R760 — Full-Featured Enterprise Power in 2U
2U dual-socket rack server — purpose-built for demanding enterprise workloads including AI, machine learning, virtualization, in-memory databases, and data analytics
Supports up to two 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors — up to 56 cores per socket for extreme compute throughput in a single chassis
32 DDR5 RDIMM slots (16 per processor) supporting up to 4800 MT/s (1DPC) or 4400 MT/s (2DPC) — delivering up to 2 TB of ECC memory capacity
Unmatched storage flexibility — from 12 x 3.5" SAS/SATA LFF to 24 x 2.5" NVMe U.2 Gen4 or 16 x EDSFF E3.S Gen5 drive configurations
Up to 8 x PCIe Gen4 or 4 x PCIe Gen5 expansion slots across 4 riser positions — with 14 distinct riser configurations for maximum customization
GPU-ready chassis — supports up to 2 x double-wide 350 W or 6 x single-wide 75 W accelerators for GPU compute and AI inference workloads
Air cooling standard or Direct Liquid Cooling (DLC) option — Smart Flow chassis maximizes airflow for high-TDP CPUs; DLC available for processors exceeding 270 W TDP
iDRAC9 embedded management with Redfish API, Zero Touch Provisioning, and full OpenManage Enterprise integration for automated lifecycle control
Chassis: 86.8 mm H × 482 mm W × 736.29 mm D (2U standard 19" EIA rack); max weight 36.1 kg (79.6 lbs) fully configured
Engineered for Mixed Workloads, Databases, AI, and Virtualization
Mixed Workload Standardization — the balanced 2U design and broad storage flexibility consolidate diverse server roles onto a single, unified platform
Artificial Intelligence & Machine Learning — GPU accelerator support and high-core-count processors enable AI inference, model training, and data pipeline acceleration at scale
Database & Analytics — DDR5 memory bandwidth plus up to 24 NVMe drives deliver the low-latency storage and high-capacity RAM that in-memory databases and OLAP workloads demand
Virtual Desktop Infrastructure (VDI) — dense memory, optional GPU acceleration, and a modular chassis make the R760 ideal for large-scale VDI deployments with multiple concurrent sessions
Enterprise Virtualization — up to 56 cores per socket and 2 TB DDR5 RAM allow extreme VM density on VMware vSphere, Microsoft Hyper-V, and KVM platforms
High-Performance Computing (HPC) — Intel Xeon Max Processor support (with HBM2e on-package memory) enables memory-bandwidth-intensive scientific and simulation workloads
Software-Defined Storage (SDS) — multiple drive bay form factors (LFF, SFF, NVMe, EDSFF) and dual RAID controller support make the R760 a capable SDS or hyper-converged node
Cloud Infrastructure & DevOps — Redfish automation, Zero Touch Provisioning, and broad hypervisor support streamline cloud-native and CI/CD deployments
4th & 5th Gen Intel® Xeon® Scalable — Up to 60 Cores Per Socket
Up to two 4th or 5th Generation Intel® Xeon® Scalable processors — Socket P+ (LGA-4677 FCLGA), up to 60 cores per socket; 5th Gen Xeon Scalable (Emerald Rapids) requires iDRAC 7.10.05.00 and BIOS 2.0.0+
Intel® Xeon® Max Processor support — includes processors with up to 64 GB HBM2e high-bandwidth on-package memory for extreme memory-bandwidth workloads without adding DIMMs
PCIe 5.0 interface — up to 80 PCIe Gen5 lanes per CPU at 32 GT/s, doubling I/O bandwidth over Gen4 — ideal for 100 GbE NICs, NVMe-oF, and GPU direct paths
Ultra Path Interconnect (UPI) — up to 4 links per CPU at 16 GT/s for ultra-low-latency multi-socket coherency and NUMA-aware communication
TDP range: 125 W–350 W — broad processor ladder from entry-level Xeon Silver 4410Y (16 cores / 150 W) to high-core Xeon Platinum 8470 (52 cores / 350 W)
Smart Flow air-cooled chassis — purpose-built airflow optimized to support the highest core-count CPUs (up to 270 W TDP) in standard air-cooled environments
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Key processor options:
Xeon Platinum 8470 — 52 cores / 2.0 GHz / 4800 MT/s / 350 W
Xeon Platinum 8462Y+ — 32 cores / 2.8 GHz / 4800 MT/s / 300 W
Xeon Gold 6454S — 32 cores / 2.2 GHz / 4800 MT/s / 270 W
Xeon Gold 6448Y — 32 cores / 2.1 GHz / 4800 MT/s / 225 W
Xeon Gold 5420+ — 28 cores / 2.0 GHz / 4400 MT/s / 205 W
Xeon Silver 4410Y — 12 cores / 2.0 GHz / 4400 MT/s / 150 W
DDR5 ECC RDIMM — Up to 32 DIMMs & 4800 MT/s
32 DDR5 DIMM slots — 16 per processor, supporting single- or dual-processor configurations for maximum memory scalability
DDR5 ECC RDIMM — registered error-correcting DIMMs protect in-flight data for mission-critical reliability across all workloads
4800 MT/s speed (1DPC) — single DIMM per channel at 1.1 V delivers dramatically higher bandwidth than DDR4's maximum 3200 MT/s on Gen 15 platforms
4400 MT/s speed (2DPC) — two DIMMs per channel for maximum capacity configurations while maintaining strong DDR5 performance
Up to 2 TB max capacity — 32 × 64 GB RDIMMs provide ample headroom for large in-memory databases, real-time analytics, and enterprise virtualization hosts
Single-processor systems use slots A1–A16; dual-processor systems interleave across A-bank and B-bank for optimal symmetric NUMA bandwidth
Memory Optimizer, Mirror, and Spare modes — configurable via BIOS for maximum performance, fault tolerance, or hybrid approaches depending on workload requirements
Populate identical DIMMs across all channels for peak 4800 MT/s throughput — mixed DIMM densities are supported but limit speed to the slowest installed module
Six Chassis Options — From 12 LFF to 24 NVMe or 16 EDSFF
12 x 3.5" SAS3/SATA LFF — large-format bays for bulk HDD capacity; optional rear 2 x 2.5" SAS/SATA or NVMe for tiered storage; GPU NOT supported in this config
12 x 3.5" + 4 x 2.5" SAS/SATA or NVMe Direct — adds a bottom-front 4-bay SFF cage to the LFF chassis for mixed spinning + flash tiering
8 x 2.5" SFF Universal — SAS/SATA or NVMe mixed configuration for compact SFF deployments with GPU accelerator support
24 x 2.5" SAS4/SATA — high-density SFF configuration with 12 Gb SAS4 backplane for SAS/SATA SSD-dense environments
24 x 2.5" NVMe U.2 Gen4 — NVMe-direct or NVMe-switch configurations; up to 24 U.2 NVMe SSDs for ultra-high-throughput all-flash deployments
16 x EDSFF E3.S Gen5 — enterprise density solid-state drives in the new E3.S form factor with PCIe Gen5 NVMe for the highest-bandwidth storage possible
All hot-swap drive bays — replace drives under power without downtime in properly configured RAID deployments
Rear drive option (LFF chassis only) — 2 x 2.5" SAS/SATA or NVMe Direct rear bays extend capacity without consuming a front bay slot
PERC 12 & PERC 11 RAID — Dual Controller Support for Maximum Flexibility
PERC 12 (Gen 12) controllers — the latest generation controllers with 24 Gb SAS4, Gen4 PCIe backplane, and 8 GB NV-backed cache for premium NVMe and SAS workloads
PERC 11 (Gen 11) controllers — proven 12 Gb SAS3 controllers with up to 8 GB NV cache; RAID 0/1/5/6/10/50/60; cost-effective choice for SAS/SATA-dominant configurations
Dual controller support — install one front PERC (fPERC) plus one additional APERC adapter simultaneously for independent boot and data controller paths
fPERC slot (dedicated front PERC) — dedicated controller position that frees all 8 PCIe expansion slots for networking, GPU, and I/O adapters
HBA non-RAID pass-through — 12 Gb SAS HBA passes drives directly to the OS for software-defined RAID (Ceph, ZFS, Storage Spaces) or JBOD configurations
Software RAID S160 — PCIe Gen4 NVMe-only, no hardware cache, RAID 0/1/5/10; supported on Windows Server for cost-conscious NVMe deployments
RAID levels supported (hardware PERC): 0, 1, 5, 6, 10, 50, 60 — including nested RAID levels for high-capacity data protection
Controller firmware updated via iDRAC9 Lifecycle Controller — no OS boot required for firmware maintenance
BOSS-N1 — Dedicated NVMe Boot Module for Clean OS Separation
BOSS-N1 (Boot Optimized Storage Subsystem) — a dedicated hardware RAID-1 boot module that completely separates OS boot drives from workload data storage
2 x M.2 NVMe SSDs — mirrored RAID-1 for redundancy; the OS lives on BOSS-N1 so all front drive bays remain fully available for application and database storage
BOSS-N1 card position adapts based on the riser and rear drive configuration installed — ensures compatibility across all R760 expansion options
Eliminates the need to sacrifice a front bay drive or allocate PERC cache to OS boot — a cost-effective path to clean data/boot separation
Hot-swappable M.2 module — replace a failed NVMe boot drive without powering down in a BOSS-N1 RAID-1 configuration
Supports all major operating systems: Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, Canonical Ubuntu, and VMware ESXi
Internal USB boot also supported as an alternative when BOSS-N1 is not installed
Up to 6 GPU Accelerators — Double-Wide and Single-Wide Support
Up to 2 x double-wide 350 W GPUs — supports full-width, full-height dual-slot accelerators such as NVIDIA A30, A100 PCIe, and H100 PCIe for intensive AI and HPC workloads
Up to 6 x single-wide 75 W GPUs — low-profile and half-height accelerators including NVIDIA A2, L4, and T4 for AI inference, VDI, and media transcoding
All GPU and FPGA cards require the 1U L-type heat sink and GPU air shroud — standard air shroud must be swapped to the GPU air shroud when accelerators are installed
GPU air shroud includes a filler piece required for single-width GPUs or empty riser slots to maintain proper airflow balance across the chassis
GPU NOT supported in 12 x 3.5" LFF or rear-drive configurations — select a 2.5" SFF or NVMe chassis for deployments combining storage and GPU compute
PCIe Gen4 and Gen5 GPU direct paths available via riser slots — enabling NVLink, GPU Direct RDMA, and NVIDIA Magnum IO for multi-GPU data throughput
Ideal for AI inference at the edge, large-scale VDI graphics, rendering, real-time video analytics, and scientific simulation workloads
4 Riser Slots, 15 Riser Cards — PCIe Gen5 & Gen4 Flexibility
Up to 8 x PCIe Gen4 slots — single-CPU config offers up to 6 slots; dual-CPU unlocks the full 8-slot complement for maximum adapter density
Up to 4 x PCIe Gen5 slots — dual-CPU configurations expose Gen5 x16 slots at 64 GT/s for the highest-bandwidth NICs, NVMe storage controllers, and GPU direct paths
4 dedicated riser slot positions — each position accepts interchangeable riser cards, allowing the expansion configuration to evolve without changing the chassis
15 riser card options across 14 validated configurations — including R1B, R1P, R1P-FL, R1Q, R1R, R1R-FL, R2A, R3A, R3A-FL, R3B, R4B, R4P, R4P-FL, R4Q, and R4R
1 x OCP 3.0 networking slot — x16 physical / x8 electrical; supports 10/25/50/100 GbE adapters from Broadcom, Intel, Mellanox/NVIDIA, and Marvell without consuming a PCIe riser slot
1 x dedicated fPERC slot — front-end PERC controller position isolates the storage controller so all riser slots remain available for networking and GPU expansion
Riser cards are interchangeable and tool-accessible — swap configurations in the field as workload requirements change, without downtime or chassis replacement
LOM or MIC Plus OCP 3.0 — Flexible Networking for Every Deployment
LOM card or MIC card — two mutually exclusive base NIC options; only one may be installed, providing either 2-port or modular NIC connectivity on the system board
OCP 3.0 slot (independent of LOM/MIC selection) — always available; supports 4-port 10/25/50/100 GbE adapters from Broadcom, Intel, Mellanox, and Marvell/QLogic
OCP 3.0 x16 physical slot is electrically x8 due to system board limitations — x16 OCP cards will negotiate down to x8 bandwidth automatically
LOM advantage: 2 ports — cost-effective standard Ethernet; ideal for management plus a single production network VLAN
OCP 3.0 advantage: 4 ports — high-density network connectivity (up to 4 x 100 GbE) without occupying a PCIe riser slot
1 x dedicated iDRAC RJ45 port on the rear panel — always-available out-of-band management network independent of OS or NIC state
Additional PCIe NICs installable in riser slots — enables iSCSI, NVMe-oF, Fibre Channel, or multi-rail Ethernet for dedicated storage and production network separation
SR-IOV, VLAN tagging (802.1Q), PXE boot, and iSCSI boot supported across all NIC options
Hot-Swap Redundant PSUs — AC & DC Options, Platinum & Titanium Efficiency
Two redundant hot-swap PSU bays — N+1 redundancy (1+1); field-replaceable under power without any service interruption or OS downtime
AC and DC power supply options — standard 100–240 VAC input for enterprise data centers; –48 to –60 VDC option for telecom and DC-plant environments
600 W Platinum — right-sized for single-CPU configurations with light to moderate drive populations
800 W Platinum — balanced wattage for dual-CPU systems without GPU acceleration
1100 W Platinum — handles full dual-CPU plus dense NVMe drive configurations at Platinum efficiency
1400 W Platinum / 1800 W Titanium — top-tier wattage for dual-CPU + GPU accelerator + NVMe-dense systems at peak load
Platinum efficiency: ≥93% at 20% load / ≥94% at 50% load — certified 80 PLUS Platinum; Titanium models reach ≥96% at 50% load for the most energy-efficient deployments
Power factor correction (PFC) >0.90; autosensing input voltage; mixed PSU wattages NOT supported — both PSUs must be identical wattage for redundant operation
Smart Flow Air Cooling Plus Direct Liquid Cooling for High-TDP Configs
Smart Flow chassis design — optimized front-to-rear airflow architecture engineered to cool even the highest core-count Xeon Scalable processors without liquid cooling infrastructure upgrades
Up to 6 hot-swap fan modules — Standard (STD), HPR Silver, or HPR Gold fans installed based on CPU TDP, drive configuration, and GPU presence for precise thermal tuning
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Fan selection by TDP:
Standard fans — entry configurations with low-TDP CPUs and no rear drives
HPR Silver fans — required for CPU TDP >165 W (without rear drives) or NVMe/GPU configurations
HPR Gold fans — required for CPU TDP >165 W when rear drive cages are installed
Direct Liquid Cooling (DLC) — CPU cold-plate liquid cooling available for processors exceeding 270 W TDP; reduces fan power and acoustic output significantly for ultra-high-TDP processor deployments
DLC installation removes the rear VGA port — an optional front or rear replacement VGA module is available (rear option occupies one PCIe slot)
12 x 3.5" LFF chassis — fan speed limited to 70% maximum due to drive dynamic thermal profile; DLC is the only cooling path for LFF configs with CPU TDP >270 W
iDRAC9 predictive fan speed control — automatically adjusts fan speed based on real-time thermal telemetry from 20+ temperature sensors across the chassis
Operating ambient: 10–35°C standard; ASHRAE A3 (5–40°C) and A4 (5–45°C) extended ambient supported in specific configurations
Front, Rear & Internal Ports — Complete Access at Every Point
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Front panel ports:
1 x iDRAC Direct (Micro-AB USB 2.0) — direct laptop or tablet management without a network connection
1 x USB 2.0 Type-A — front-mounted USB for peripheral access and local OS installation
1 x USB 3.0 Type-A — high-speed front USB for log collection, diagnostics, and media
1 x VGA — local console video output for front-panel keyboard-video access
Micro SD slot — bootable OS image, iDRAC firmware update, or diagnostics storage
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Rear panel ports:
1 x Dedicated iDRAC Ethernet (RJ45) — isolated out-of-band management network, always accessible regardless of OS state
2 x USB 3.0 Type-A — rear-mounted USB for OS deployment, log export, and hardware security key storage
1 x VGA — rear console output for rack KVM switch integration
1 x Serial port (optional via PCIe) — legacy BIOS console access for appliance and network device deployments
Internal port: 1 x USB 3.0 internal connector — supports internal USB boot devices or hardware-based license dongles
Integrated Matrox G200 video controller — 16 MB frame buffer; up to 1920 × 1200 @ 60 Hz for local and remote KVM console sessions
Cyber Resilient Architecture — Silicon Root of Trust to Secure Enterprise Operations
Silicon Root of Trust — security anchored in custom Dell silicon at manufacturing; every boot validates firmware integrity from the hardware level before any code executes
Cryptographically signed firmware — every firmware component carries a digital signature; unsigned or tampered firmware is rejected before execution, preventing firmware-level attacks
UEFI Secure Boot — verifies boot loader and OS kernel signatures at boot to prevent rootkits, bootkits, and unauthorized OS-level tampering
TPM 2.0 — FIPS 140-2 certified; supports BitLocker key storage, hardware-based disk encryption, measured boot, and cryptographic attestation for zero-trust workflows
Data at Rest Encryption (D@RE) — Self-Encrypting Drives (SEDs) with iDRAC-managed local key management or external SEKM (Secured Enterprise Key Management)
Secured Component Verification (SCV) — factory-to-site supply chain integrity check ensures all installed hardware components match the original factory manifest
Secure Erase — cryptographic media sanitization (NIST 800-88 compliant) for compliant decommissioning of drives and secure data destruction
System Lockdown & Multi-Factor Authentication — prevents unauthorized configuration changes; available under iDRAC9 Enterprise and Datacenter license tiers
iDRAC9 — Agent-Free Out-of-Band Management with Full Lifecycle Automation
iDRAC9 embedded in every R760 — no software agent required; management is available the moment power and network are connected, before any OS is installed
iDRAC RESTful API with Redfish — industry-standard API for scripting, orchestration, and CI/CD pipeline integration with tools like Ansible, Terraform, Chef, and ServiceNow
Zero Touch Provisioning (ZTP) — automatically configures newly racked servers from a centralized profile repository when DHCP is reachable, eliminating manual setup steps for mass deployments
iDRAC Direct (Micro-AB USB 2.0) — manage, update BIOS/firmware, and collect logs by connecting a laptop directly to the front-panel USB port without a network connection
Quick Sync 2 wireless module (optional) — inventory, configure, and manage from a mobile device via Bluetooth without requiring network access at the rack
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iDRAC9 license tiers:
Express — remote management, lifecycle features, Group Manager, and firmware update (standard on most configs)
Enterprise — virtual console/KVM, virtual media, AD/LDAP integration, advanced remote presence
Datacenter — real-time telemetry streaming, automated certificate management, Thermal Manager, and SupportAssist integration
OpenManage Enterprise — centralized one-to-many fleet console for monitoring, firmware updates, compliance reporting, and deployment across all PowerEdge servers
Lifecycle Controller 3.x — embedded firmware management with bare-metal OS deployment, driver injection, and rollback without external tooling
Broad OS & Hypervisor Ecosystem — Windows, Linux, VMware, and More
Microsoft Windows Server with Hyper-V — full WHQL certification for Windows Server 2019 and 2022; ideal for Active Directory, SQL Server, Exchange, and Hyper-V virtualization
Red Hat Enterprise Linux (RHEL) — Tier-1 certified for RHEL 8.x and 9.x with standard and real-time kernels; suitable for OpenShift, containerized, and SAP workloads
SUSE Linux Enterprise Server (SLES) — certified for SAP HANA in-memory database deployments; long-term enterprise support and mission-critical stability guarantees
VMware vSphere / ESXi / vSAN — fully certified for vSphere 7.0 U3+ and 8.0; supports vROps integration, HCI with vSAN, and VMware Cloud Foundation
Canonical Ubuntu Server LTS — certified for Ubuntu 20.04 LTS and 22.04 LTS; widely used for Kubernetes, OpenStack, edge AI, and cloud-native application stacks
Oracle Linux and Oracle VM — supported for Oracle Database and Oracle Virtualization environments requiring Oracle-certified hardware
OEM-Ready — the R760 can be branded, BIOS-customized, and shipped as a white-label or OEM solution for ISV and system integrator deployments
Full interoperability matrix and certified driver versions available at dell.com/ossupport
R760 vs. R750 — The Case for Upgrading to Gen 16
Processor generation leap — 4th Gen Intel Xeon Scalable (Sapphire Rapids) vs. 3rd Gen (Ice Lake/Cooper Lake); more cores per socket, higher UPI bandwidth (16 GT/s vs. 11.2 GT/s), and PCIe 5.0 native support
DDR5 vs. DDR4 — 4800 MT/s DDR5 replaces 3200 MT/s DDR4; up to 50% more memory bandwidth for latency-sensitive databases, real-time analytics, and AI inference workloads
Double the DIMM slots — 32 DIMM slots (vs. 24 on R750) unlocks more granular memory population and greater total capacity for VM-dense and in-memory database deployments
EDSFF E3.S Gen5 drive support — new enterprise form factor with PCIe Gen5 NVMe not available on any Gen 15 platform; delivers higher bandwidth per bay than U.2 NVMe
24 x NVMe U.2 Gen4 — the R760 scales to 24 NVMe drives vs. the R750's maximum of 10 NVMe drives, enabling far denser all-flash configurations
Dual RAID controller support — independent fPERC + APERC configuration allows separate boot and data controller paths, replacing the single-controller limit of the R750
Direct Liquid Cooling (DLC) option — supports CPU TDPs above 270 W with on-chassis liquid cooling; enables next-generation processor deployments not possible in the R750 chassis
PCIe 5.0 riser slots — up to 4 x Gen5 slots in the R760 (vs. Gen4-only on R750) for future-ready NVMe-oF, 400 GbE, and GPU connectivity
| Feature | R750 (Gen 15) | R760 (Gen 16) |
|---|---|---|
| Processor | 3rd Gen Intel Xeon Scalable | 4th Gen Intel Xeon Scalable |
| Max Cores | 40 cores per socket | 56 cores per socket |
| Memory Type | DDR4, max 3200 MT/s | DDR5, max 4800 MT/s |
| DIMM Slots | 24 slots (12 per CPU) | 32 slots (16 per CPU) |
| Max NVMe Drives | 10 x NVMe U.2 | 24 x NVMe U.2 Gen4 |
| EDSFF Support | Not supported | 16 x E3.S Gen5 |
| PCIe Generation | PCIe Gen4 | PCIe Gen4 + Gen5 |
| Liquid Cooling | Air only | Air + Direct Liquid Cooling |
| Boot Module | BOSS-S2 (M.2 SATA) | BOSS-N1 (M.2 NVMe) |
Standard 2U — Built for Dense 19-Inch Rack Environments
Height: 86.8 mm (3.41 inches) — standard 2U; fits any EIA-310-E compliant 4-post 19-inch rack at full density
Width: 482 mm (18.97 inches) — standard 19-inch rack width; ear-to-ear chassis width 434 mm (17.08 inches)
Depth: 700.7 mm (27.58 inches) to rear wall; 736.29 mm (28.98 inches) to PSU handle — verify rack depth before deploying fully loaded DLC configurations
Max weight: 36.1 kg (79.58 lbs) fully loaded — 2-person server lift or mechanical lift strongly recommended for safe rack installation
ReadyRails sliding rail kit — tool-less for Dell Titan racks; adjustable for EIA-310-E square and unthreaded round hole flanges on any standard 19-inch 4-post rack
Static rail option — 2-post and 4-post rack compatibility; ideal for fixed deployments where tool-less sliding access is not required
Cable Management Arm (CMA) available for rear cable organization — NOTE: CMA is not supported in Direct Liquid Cooling (DLC) configurations
Quick Resource Locator (QRL) label on chassis — scan with a smartphone to instantly access product documentation, rail installation guides, and iDRAC credentials
Dell ProSupport & ProDeploy — World-Class Services for Enterprise Deployments
Dell ProSupport Next Business Day (NBD) — standard 3-year support with 24×7 phone support and next-business-day on-site parts and labor at no additional charge
ProDeploy Basic — hardware installation and initial firmware update by Dell-certified technicians during standard business hours
ProDeploy — hardware installation plus OS and software configuration using Dell's certified deployment engineers; ideal for remote sites and co-location facilities
ProDeploy Plus — in-region or on-site resources for complex deployments including post-installation configuration assistance and training credits for your team
ProDeploy Factory Configuration — pre-configured systems shipped with custom OS images, BIOS settings, and asset tags already applied — minimizes on-site setup time for volume rollouts
ProDeploy Rack Integration — complete rack builds with hardware installation, cabling, and system configuration finished before the rack ships to your facility
Dell Residency Services — embedded Dell experts work alongside your IT team for knowledge transfer and hands-on operational support during production go-live
APEX Flex on Demand — consume-as-you-go payment model; scale payments to match actual resource utilization, reducing upfront capital commitment for expanding workloads
Frequently Asked Questions — Dell PowerEdge R760
The Dell PowerEdge R760 supports up to 2 TB of DDR5 ECC memory across 32 DIMM slots (16 per socket) running at up to 4800 MT/s in a dual-socket 2U chassis — headroom suitable for large virtualisation clusters, Kubernetes, and AI inference caching.
The R760 supports up to 24 × 2.5-inch front hot-plug drives (SAS, SATA, or NVMe) plus optional rear NVMe bays — enabling dense all-flash pools or tiered SSD/NVMe configurations for mixed workloads in a single 2U chassis.
The R760 supports 4th Gen Intel Xeon Scalable processors (Sapphire Rapids, LGA4677) in a dual-socket configuration with up to 56 cores and 112 threads per CPU. The platform’s PCIe Gen 5.0 bus and HBM-enabled processor options enable AI inference, high-performance databases, and dense virtualisation.
Yes. Express Computer Systems stocks professionally reconditioned Dell PowerEdge R760 rack servers tested and configured to your specifications. Shop refurbished Dell R760 servers at ECS.
The R760 (Gen 16) replaces the R750 (Gen 15) with 4th Gen Xeon Scalable (Sapphire Rapids) vs 3rd Gen (Ice Lake-SP), DDR5 with more memory channels per socket, PCIe Gen 5.0 vs Gen 4.0, Intel in-die accelerators (AMX for AI matrix, DSA for data streaming, QAT for compression), optional HBM processors, and iDRAC9 for next-generation infrastructure management.
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