Dell PowerEdge R6725 Buyers Review Guide
Target Workloads — HPC, Dense Virtualization, VDI, and AI
High-Performance Compute (HPC) — Dual-socket Zen5 delivers maximum parallel compute throughput for simulation, scientific modeling, and computational fluid dynamics workloads demanding hundreds of cores.
Dense Virtualization — Up to 384 cores and 6 TB DDR5 support extreme VM density in a single 1U chassis, making the R6725 purpose-built for service providers and enterprise private cloud deployments.
Virtual Desktop Integration (VDI) — High core count and massive memory capacity enable hundreds of concurrent virtual desktops per server, reducing per-seat infrastructure costs.
Artificial Intelligence (AI) & Inference — GPU acceleration paired with EDSFF Gen5 NVMe low-latency storage accelerates AI inference, model serving, and smaller training workloads at the rack edge.
Data Warehouse & Analytics — Dual EPYC 9005 memory bandwidth, 24-channel DDR5, and EDSFF Gen5 NVMe storage throughput enable real-time in-memory analytical queries across large datasets.
eCommerce & Mission-Critical Databases — Redundant power and cooling, Cyber Resilient security, and iDRAC10 autonomous management keep transactional workloads online around the clock.
AMD EPYC 9005 Zen5 — Dual-Socket, Up to 384 Total Cores
Two 5th Generation AMD EPYC 9005 Series — Dual-socket configuration supports up to two processors per system, each delivering up to 192 Zen5 cores for a total of up to 384 cores in a single 1U chassis.
Zen5 Architecture — Improved IPC, wider vector execution units, and enhanced memory bandwidth per core compared to Zen4; delivers best-in-class per-core performance for HPC and database workloads.
CXL 2.0 Type 3 Support — AMD EPYC 9005 supports CXL 2.0 Type 3 memory expansion, enabling memory pooling beyond the 24-DIMM physical capacity for memory-constrained workloads.
Maximum TDP: 500 W per socket — High-TDP processor SKUs are available for maximum core-density configurations; DLC is required for sustained operation at peak TDP.
PCIe Gen5 Native I/O — Both processors provide native PCIe Gen5 lanes to all expansion slots, OCP NIC 3.0 slots, and EDSFF Gen5 NVMe backplanes.
NUMA Flexibility — NPS0 (whole system as single NUMA domain), NPS1 (one node per socket), NPS2, and NPS4 configurations allow workload-specific memory topology tuning.
24 DDR5 DIMM Slots — Up to 6 TB at 6400 MT/s
24 DDR5 RDIMM Slots — Twelve channels per processor, one DIMM per channel; the dual-socket R6725 doubles the memory channel count of single-socket platforms for maximum aggregate bandwidth.
Speeds up to 6400 MT/s — One DIMM per channel achieves the full 6400 MT/s rated speed; processor may reduce DIMM speed at full population depending on rank and DIMM model.
Maximum capacity: 6 TB — Achieved with 24× 256 GB RDIMMs; supported DIMM sizes include 16 GB, 32 GB, 64 GB, 96 GB, 128 GB, and 256 GB.
CXL 2.0 Type 3 Memory Expansion — CXL memory devices can extend addressable capacity beyond the 24-DIMM ceiling for in-memory database and analytics use cases.
Registered ECC DDR5 Only — All DIMMs must be DDR5 RDIMMs; unbuffered DIMMs are not supported; identical DIMMs across all populated slots for best performance.
NUMA Interleaving Modes — NPS0 enables 24-way memory interleave across the full system for a flat memory view; NPS1 provides 12-way per socket; NPS2 and NPS4 partition memory into sub-socket NUMA domains.
Up to 22 EDSFF Gen5 NVMe Drives — Seven Chassis Configurations
Maximum configuration: 22 drives — Up to 20 front EDSFF E3.S Gen5 NVMe drives plus 2 rear EDSFF E3.S Gen5 NVMe drives for peak storage density in 1U.
EDSFF E3.S Gen5 NVMe — Enterprise Storage Form Factor (E3.S) drives deliver PCIe Gen5 native bandwidth directly to the processor, with hot-swap capability for zero-downtime maintenance.
Seven chassis configurations — No backplane (compute-only), 4× 3.5-inch SAS/SATA, 8× 2.5-inch Universal/U.2, 10× 2.5-inch SAS/SATA, 10× 2.5-inch with 4× Universal, 8× EDSFF E3.S, or 16× EDSFF E3.S options available.
SAS/SATA and U.2 Support — Legacy 2.5-inch SAS/SATA SSDs and spinning drives, plus U.2 NVMe SSDs, accommodate mixed-media storage strategies across existing drive inventories.
PCIe Gen5 Native Backplane — EDSFF backplanes connect directly to the Gen5 fabric; no protocol translation or bandwidth downgrade between drives and processors.
Rear Drive Bays — 2× additional EDSFF E3.S Gen5 NVMe drives accessible from the rear, enabling a dedicated OS NVMe tier separate from the front data bays in diskless-boot configurations.
Storage Controllers — PERC H365i Through H975i
PERC H365i — Entry-level internal hardware RAID controller with PCIe Gen5 backend; supports RAID 0, 1, 5, 10, 50 for SAS/SATA and NVMe configurations.
PERC H965i — Mid-range internal RAID controller with expanded RAID levels and higher IOPS throughput; suited for mixed SAS/SATA and NVMe storage environments.
PERC H975i — Enterprise-class internal RAID controller with battery-backed write cache, RAID 0–60 support, and dedicated cache for write-intensive transactional workloads.
HBA465e — External HBA (non-RAID) for direct SAN fabric connectivity; presents drives directly to the OS for software-defined storage or passthrough NVMe configurations.
H965e — External RAID controller enabling RAID protection on external SAS/SATA drive enclosures connected to the R6725.
No-Controller Option — EDSFF E3.S Gen5 NVMe drives can be operated in direct NVMe passthrough mode without a PERC controller, maximizing native PCIe Gen5 drive bandwidth to the OS.
BOSS-N1 DC-MHS — Dedicated OS Boot via M.2 NVMe
BOSS-N1 DC-MHS Module — Boot Optimized Storage Subsystem with DC-MHS (Disaggregated Chassis Management Hardware Specification) carrier supporting up to two M.2 NVMe SSDs in RAID 0 default configuration.
Dedicated Boot Path — OS and hypervisor install to the BOSS-N1 M.2 SSDs, freeing all front and rear data drive bays entirely for workload storage — no boot drive occupying a NVMe slot.
Capacity Options — BOSS-N1 DC-MHS card carriers support 480 GB or 960 GB M.2 NVMe SSD modules; 64 KB stripe size in RAID 0 optimized for read-intensive OS boot patterns.
Rear-Mount Installation — BOSS-N1 installs in the rear system slot via a blue latch carrier mechanism; tool-free removal and hot-latch replacement without opening the chassis.
Flatbread PCIe Slot — BOSS occupies Slot 3 (the BOSS flatbread carrier, x4 PCIe, CPU 1) — a dedicated slot that does not compete with the three Gen5 x16 expansion slots.
BOSS Feature Matrix — Supports NVMe only; RAID 0 default; compatible with PERC 12 and PERC 13 controller configurations in the front bay simultaneously.
GPU Acceleration — Up to 3× 75 W Single-Width PCIe Gen5
Up to 3× 75 W Single-Width GPUs — Low-profile (SW) PCIe Gen5 x16 GPU cards fit within the 1U chassis power budget; maximum of three accelerator cards per system in supported riser configurations.
PCIe Gen5 x16 Interface — Full Gen5 bandwidth to each GPU slot eliminates the bandwidth bottleneck between CPU memory and GPU compute; critical for latency-sensitive AI inference pipelines.
NVIDIA L4 Support — The 24 GB L4 GPU is validated for the R6725; Dell recommends 36–48 GB of system DDR5 memory per L4 GPU for optimal CPU-to-GPU data transfer performance.
AI Inference & Acceleration — GPU cards offload matrix operations, video analytics, and neural network inference from host CPUs, freeing AMD EPYC cores for orchestration and pre/post-processing.
Power-Efficient Design — 75 W thermal envelope is managed within the existing air or liquid cooling system without dedicated GPU cooling modules, preserving the 1U form factor.
Memory Sizing Guideline — Dell recommends 1.5×–2× GPU VRAM as system DRAM minimum; scale system memory proportionally when adding multiple GPU cards to the configuration.
NVIDIA BlueField-3 DPU — Infrastructure Offload & Smart NIC
NVIDIA BlueField-3 B3220 — Dual-port 2× 200 GbE DPU; full-height half-length (FHHL) form factor; PCIe Gen5 x16 interface; 150 W power consumption; installed in Riser RC3 slots 1 or 4.
NVIDIA BlueField-3 B3140H — Single-port 1× 400 GbE DPU; FHHL form factor; PCIe Gen5 x16; 75 W power consumption; availability subject to Dell.com product configurator confirmation.
Data Processing Unit (DPU) — System-on-chip combining ARM processing cores, high-performance NIC hardware, and programmable acceleration engines on a single PCIe card.
Infrastructure Offload — Networking (packet processing, encryption, RDMA), storage (NVMe-oF, iSCSI acceleration), and security functions are offloaded from AMD EPYC host CPUs to the DPU’s ARM cores and inline accelerators.
Smart NIC Mode — Operates as a high-performance network adapter with fully programmable data-plane acceleration; host CPUs focus entirely on application workloads while the DPU manages the network stack.
Zero-Trust Infrastructure — DPU enforces microsegmentation, encrypted tenant isolation, and workload identity at the NIC level — hardware-based network security independent of the host OS.
PCIe Expansion — Up to 3× Gen5 x16 Slots, Five Riser Configs
Three PCIe Gen5 x16 Slots — All expansion slots run native PCIe Gen5; no Gen4 fallback slots; every add-in card benefits from full Gen5 bandwidth.
Slot 1 (Riser 2) — Full Height or Low Profile, x16 Gen5, connected to Processor 2; primary high-bandwidth slot for GPUs, DPUs, or high-speed NICs.
Slot 2 (OCP 3.0) — x16 Gen5 OCP 3.0, Processor 2; second OCP NIC 3.0 slot enabling dual-NIC configurations up to 400 GbE per slot.
Slot 4 (Riser 4) — Full Height or Low Profile, x16 Gen5, connected to Processor 1; secondary slot for additional accelerators, HBAs, or fiber channel cards.
Slot 5 (OCP 3.0) — x16 Gen5 OCP 3.0, Processor 1; supports NC-SI BMC port sharing on the embedded DC-SCM slot; primary OCP NIC 3.0 for management-plane integration.
Five Riser Configurations — RC2 (R2a+R4a), RC3 (R2b+R4b), RC4 (R2c+R4a), RC5 (R2p+R4a), RC6 (R2e+R4a); each optimized for different add-in card mix, cooling, and storage controller requirements.
Dual OCP 3.0 — Up to 400 GbE per Slot, 1 Gb BMC Ethernet
Dual OCP 3.0 Slots — Two independent Gen5 x16 OCP 3.0 slots (Slots 2 and 5) allow simultaneous dual high-speed NIC installations for east-west and north-south traffic separation.
Up to 400 GbE per OCP Slot — QSFP112 dual-port 200 GbE or single-port 400 GbE OCP cards available; also 100 GbE, 25 GbE, 10 GbE, and 1 GbE port-speed options for flexible bandwidth tiers.
1 Gb Dedicated BMC Ethernet — The DC-SCM (Datacenter Secure Control Module) provides a dedicated out-of-band 1 GbE management port completely independent of all data NIC ports.
PCIe Add-in Card (AIC) NICs — Up to three PCIe Gen5 AIC NIC positions support 100/400 GbE network adapters plus Fibre Channel HBAs (FC64 and FC32) for SAN connectivity.
OCP 3.0 vs 2.0 — OCP 3.0 (SFF form factor) provides PCIe Gen5 bandwidth, Wake-on-LAN, and aux power; all R6725 OCP slots are Gen5-native versus Gen3-only OCP 2.0.
NC-SI BMC Port Sharing — Slot 5 OCP NIC 3.0 (DC-SCM slot) supports NC-SI, allowing the embedded BMC management port to share a physical NIC rather than requiring a separate cable run.
Hot-Swap Redundant PSUs — 800 W to 1800 W Platinum & Titanium
Dual Hot-Swap PSU Bays — Two 60 mm redundant power supply bays provide full N+1 PSU redundancy; either PSU can be replaced while the system remains fully operational.
Titanium Efficiency — 800 W, 1100 W, 1500 W, and 1800 W* Titanium-rated PSUs achieve maximum power conversion efficiency, minimizing heat dissipation and facility electricity costs.
Platinum Efficiency — 800 W and 1100 W Platinum PSUs provide a lower entry cost while still meeting 80 PLUS Platinum certification for mid-range power configurations.
Multi-Input Support — AC (100–240 Vac standard), HVDC (240 Vdc), 277 Vac XLAC, and -48 Vdc Telco (1400 W) options adapt the R6725 to any data center power infrastructure.
1% Power Monitoring Accuracy — Dell PSU power monitoring precision is 1%, versus the industry standard of 5%; enables accurate power budgeting and rack density planning.
80 PLUS & ENERGY STAR Compliant — PSUs meet 80 PLUS, Climate Savers, and ENERGY STAR certifications; Dell EIPT (Enterprise Infrastructure Planning Tool) available for pre-deployment power sizing.
SmartCooling — Air Cooling + Direct Liquid Cooling Options
Air Cooling — Up to four sets of dual fan modules (High-Performance Silver, Standard, and High-Performance Platinum types) provide graduated thermal headroom across the full processor TDP range.
Direct Liquid Cooling (DLC) — Optional DLC removes heat directly from processor cold plates via a manifold connected to a rack-mounted Cooling Distribution Unit (CDU); required for highest-TDP CPU configurations and supported in both air and DLC hybrid deployments.
N+1 Fan Redundancy — One fan module failure does not interrupt server operation; the remaining fans automatically spin up to compensate, providing continuous availability without manual intervention.
Closed-Loop Thermal Control — Sensors on processors, DIMMs, chipset, drives, and OCP cards feed real-time temperature data to the thermal management system; fan speeds are dynamically adjusted to minimize noise and power draw.
ASHRAE A2/A3/A4 Rated — Operates within 10–35°C (A2), 5–40°C (A3), and 5–45°C (A4) ambient temperature ranges; maximum altitude 3,048 m (10,000 ft).
User-Configurable Thermal Profiles — Performance, Performance Per Watt Optimized (OS), and Custom profiles are selectable via iDRAC or BIOS Setup to balance thermal output with performance requirements.
Front, Rear & Internal I/O — USB 3.1, VGA, BMC Ethernet
Front Ports — 1× USB 2.0 Type-A (optional Left Control Panel KVM), 1× USB 2.0 Type-C HOST/BMC Direct (Right Control Panel), and 1× Mini DisplayPort (optional LCP KVM) for local console access.
Rear Ports — 2× USB 3.1 Type-A, 1× VGA (DB-15 on DC-SCM I/O board), and 1× 1 Gb dedicated BMC Ethernet for persistent out-of-band management access.
Internal Port — 1× USB 3.1 Type-A internal connector for USB-attached storage or internal management media.
BMC Direct Port — USB Type-C HOST/BMC Direct on the front Right Control Panel enables in-band iDRAC access without a separate management network connection; useful during initial provisioning or field service.
Video Output — VGA output on the DC-SCM supports video resolutions up to 1920×1200 at 60 Hz; Mini DisplayPort (front) requires optional LCP-Secondary KVM adapter for local video and keyboard access.
Dual Control Panels — Left Control Panel (LCP-Secondary) for KVM and USB; Right Control Panel (RCP-Primary) for power button, system ID button, and USB Type-C BMC Direct port; both panels are removable for serviceability.
Cyber Resilient Architecture — Silicon Root of Trust, AMD SEV, TPM 2.0
Silicon Root of Trust — Hardware-anchored firmware validation chain from power-on through full OS boot; every firmware image is cryptographically verified before execution, preventing tampered code from running.
AMD Secure Encrypted Virtualization (SEV) — Encrypts each VM’s memory at the processor level with unique keys; prevents a compromised hypervisor from reading guest VM memory contents.
AMD Secure Memory Encryption (SME) — Full system memory encryption with minimal performance overhead; protects against physical memory attacks, cold-boot attacks, and DRAM-snooping threats.
TPM 2.0 FIPS / CC-TCG Certified — Hardware Trusted Platform Module provides a secure enclave for measured boot, remote attestation, and cryptographic key storage; satisfies FIPS 140-2 and Common Criteria requirements.
Secured Component Verification (SCV) — Hardware integrity check validates that installed components match Dell’s factory-configured bill of materials, detecting unauthorized component substitution in the supply chain.
Secure Boot, System Lockdown & Secure Erase — Secure Boot validates OS bootloaders; System Lockdown (requires iDRAC10 Enterprise or Datacenter) prevents unauthorized configuration changes; Secure Erase performs NIST 800-88-compliant media sanitization for drive retirement.
Chassis Intrusion Detection — Physical tamper events are logged to iDRAC with timestamps; alerts generated for physical access outside of authorized maintenance windows.
iDRAC10 — Autonomous Operations, Redfish API, OpenManage Enterprise
iDRAC10 — Embedded agent-free server lifecycle controller; monitor, manage, update, and troubleshoot the R6725 before or after OS installation, from any network location, without requiring host software agents.
Zero-Touch Provisioning (ZTP) — When connected to power and network, iDRAC10 can automatically apply profile-based configurations on first boot, eliminating manual provisioning steps at scale (requires iDRAC10 Enterprise license and DHCP).
Redfish RESTful API — Standards-based Redfish API with Dell extensions enables programmatic at-scale server automation, provisioning, and monitoring via Ansible, Terraform, PowerShell, and Python integrations.
RACADM CLI — Full command-line access to all iDRAC10 configuration, management, and diagnostics functions; scriptable for batch operations across large server fleets.
Quick Sync 2 Wireless Module — Optional wireless module enables mobile management via OpenManage Mobile app; useful for at-the-box service in dense colocation environments without monitor or keyboard access.
OpenManage Enterprise (OME) — Centralized lifecycle management console for multiple PowerEdge generations; plugins extend OME with Power Manager, Update Manager, APEX AIOps Observability (CloudIQ), and integrations for VMware vCenter, Microsoft SCCM, and Windows Admin Center.
OS Support — Windows Server, RHEL, Ubuntu, SLES, VMware ESXi
Microsoft Windows Server with Hyper-V — Dell-certified for Windows Server 2022 and later; Hyper-V virtualization benefits directly from the R6725’s 384-core ceiling and 6 TB DDR5 for high-density Windows VM deployments.
Red Hat Enterprise Linux (RHEL) — Certified and supported across current RHEL versions; AMD EPYC 9005 and iDRAC10 Redfish integration align with Red Hat Ansible automation workflows.
Canonical Ubuntu Server LTS — Certified for current Ubuntu LTS releases; popular for AI/ML toolchains, Kubernetes deployments, and OpenStack private cloud on AMD EPYC platforms.
SUSE Linux Enterprise Server (SLES) — Supported for enterprise SUSE deployments including SUSE Rancher container management and SAP HANA workloads on EPYC 9005.
VMware ESXi — Certified for current VMware ESXi releases; H975i PERC support requires ESXi 9.0 or later; iDRAC10 integrates with VMware Aria Operations (formerly vRealize) via OME vCenter plugin.
OS Support Matrix — For full version-specific certification and interoperability details, see Dell Enterprise OS support matrix at Dell.com/OSsupport.
Rack & Rail Integration — 1U 19-Inch ReadyRails, CMA Option
ReadyRails II Sliding Rails (A15) — Tool-less drop-in installation in 19" EIA-310-E square or unthreaded round-hole 4-post racks; full system extension out of the rack for in-rack serviceability of internal components.
Stab-in/Drop-in Sliding Rails (A16) — Tool-less installation in square, unthreaded round-hole, and Titan/Titan-D rack types; supports both drop-in and stab-in installation methods for maximum rack compatibility.
Static Rails (A14) — Wider depth adjustability range than sliding rails; supports 4-post and 2-post (Telco) racks; smaller footprint when CMA support is not required.
Optional Cable Management Arm (CMA) — Large U-shaped baskets organize rear cabling; unfolds fully when system is pulled out for service without detaching cables; side-reversible without tools; hook-and-loop straps prevent cable damage.
Optional Strain Relief Bar (SRB) — Two-position depth adjustment; tool-less attachment to sliding rails; protects server connectors from cable weight and bending stress in high cable-density deployments.
1U 19-Inch Form Factor — 42.8 mm height, 482 mm width, 816.9 mm depth (with bezel); compatible with all generations of Dell PowerEdge racks and EIA-310-E compliant third-party enclosures.
R6725 vs. R6625 — What’s New in 17th Generation
5th Gen AMD EPYC 9005 Zen5 (up to 192 cores/socket) — Versus 4th Gen EPYC 9004 Genoa Zen4c (up to 128 cores/socket); a 50% per-socket core count increase at the top end with improved Zen5 IPC.
DDR5 speed: 6400 MT/s vs. 4800 MT/s — Faster memory bus increases aggregate bandwidth for analytics, HPC, and in-memory database workloads; both platforms have identical 24 DDR5 DIMM slots.
CXL 2.0 Type 3 support — The R6725 adds CXL 2.0 Type 3 memory expansion capability not present on the R6625, enabling memory pooling beyond the 6 TB DIMM ceiling.
iDRAC10 vs. iDRAC9 — Next-generation lifecycle controller with enhanced autonomous operations, APEX AIOps Observability, Zero-Touch Provisioning, and deeper infrastructure-as-code integrations.
GPU: Up to 3× 75 W SW vs. 2× 75 W SW — An additional GPU slot enables more concurrent accelerator cards, expanding AI inference capacity within the same 1U form factor.
All-PCIe Gen5 slots vs. Gen5/Gen4 mix — Every PCIe slot on the R6725 is Gen5 native; the R6625 mixed Gen5 and Gen4 slots, creating bandwidth bottlenecks for Gen5 DPU and NVMe-oF adapters.
| Feature | R6725 (Gen 17) | R6625 (Gen 16) |
|---|---|---|
| Processor | Two AMD EPYC 9005 Zen5, up to 192 cores/socket | Two AMD EPYC 9004 Genoa Zen4c, up to 128 cores/socket |
| DDR5 DIMM Slots | 24 | 24 |
| Memory Speed | Up to 6400 MT/s | Up to 4800 MT/s |
| Max Memory | 6 TB | 6 TB |
| CXL Support | CXL 2.0 Type 3 | Not supported |
| Embedded Management | iDRAC10 | iDRAC9 |
| GPU | Up to 3× 75 W SW | Up to 2× 75 W SW |
| PCIe Slots | Up to 3× Gen5 x16 (all Gen5) | Up to 3× Gen5/Gen4 mix |
| Max CPU TDP | 500 W | 360 W |
| Cooling | Air + DLC | Air + DLC |
| Form Factor | 1U rack server | 1U rack server |
Dell ProSupport & ProDeploy — End-to-End Service Coverage
ProSupport Infrastructure Suite — Proactive, predictive 24×7 hardware support; Secure Connect Gateway (SCG) automates issue detection, case creation, and diagnostic data collection — minimizing time-to-resolution without requiring on-site technician dispatch.
ProDeploy Infrastructure Suite — End-to-end deployment services covering planning, configuration validation, rack-and-stack, OS installation, and production handoff; available in Basic, Plus, and Enterprise tiers to match project complexity.
Professional Services for AI — Specialized consulting to accelerate AI use case implementation; scope includes hardware sizing, GPU provisioning, model deployment frameworks, and MLOps pipeline design on PowerEdge R6725 configurations.
Secure Connect Gateway (SCG) — Optional service monitoring software that automates technical support for servers, storage, and networking; proactive contact from Dell Technical Support upon issue detection reduces mean time to repair.
Global Service Coverage — Services available across 170+ locations backed by 60,000+ Dell employees and certified partners worldwide; hardware break-fix parts dispatch available next-business-day in most regions.
APEX Flex on Demand — Consumption-based payment model scales monthly charges to actual server utilization; enables OpEx-style acquisition of R6725 infrastructure without large upfront capital expenditure.
Energy Efficiency — Titanium PSUs, DLC, EPYC Performance-per-Watt
Titanium-Rated PSUs — Up to 1800 W Titanium efficiency rating achieves industry-leading power conversion; every watt saved at the PSU level compounds across the data center cooling load and utility bill.
AMD EPYC 9005 Performance-per-Watt — Zen5 delivers best-in-class compute density per watt versus previous-generation EPYC and competing platforms; workload consolidation on R6725 reduces overall server count and power draw.
Direct Liquid Cooling (DLC) — Removes heat directly at the processor cold plate, reducing facility chiller load and fan energy versus equivalent air-cooled high-TDP configurations; enables higher sustained clock speeds in thermally constrained environments.
Smart Cooling & Thermal Management — Closed-loop sensor-driven fan control minimizes fan power draw continuously; ASHRAE A4 support (up to 45°C ambient) reduces data center cooling investment for warm-aisle/cold-aisle designs.
Recycled Materials & Responsible Packaging — Dell PowerEdge servers and packaging incorporate recycled materials; Dell Technologies provides take-back and recycling programs in applicable countries for end-of-life server retirement.
80 PLUS & ENERGY STAR Compliant — R6725 PSUs meet 80 PLUS, Climate Savers, and ENERGY STAR certifications; Dell EIPT (Enterprise Infrastructure Planning Tool) calculates pre-deployment power consumption to right-size facility infrastructure.
Frequently Asked Questions — Dell PowerEdge R6725
The Dell PowerEdge R6725 supports two 5th Generation AMD EPYC 9005 Series processors, each delivering up to 192 Zen5 cores for a total of up to 384 cores per system. The EPYC 9005 processors support CXL 2.0 Type 3 memory expansion, offer a maximum TDP of 500 W per socket, and connect to all PCIe Gen5 slots and EDSFF Gen5 NVMe backplanes via native Gen5 I/O fabric. Direct Liquid Cooling (DLC) is available for the highest-TDP SKUs.
The Dell PowerEdge R6725 supports a maximum of 6 TB of DDR5 ECC RDIMM memory across 24 DIMM slots (12 channels per processor). Memory speeds reach up to 6400 MT/s with one DIMM per channel. Supported DIMM capacities range from 16 GB to 256 GB per slot. In addition, CXL 2.0 Type 3 memory devices can extend addressable capacity beyond the physical DIMM ceiling for memory-intensive workloads such as in-memory analytics and large-footprint databases.
The Dell PowerEdge R6725 supports seven storage chassis configurations: no backplane (compute-only), 4× 3.5-inch SAS/SATA, 8× 2.5-inch Universal or U.2, 10× 2.5-inch SAS/SATA, 10× 2.5-inch with 4× Universal, 8× EDSFF E3.S Gen5 NVMe, and 16× EDSFF E3.S Gen5 NVMe. The maximum configuration adds 2 rear EDSFF E3.S Gen5 NVMe drives for a total of 22 hot-swap drives in 1U. Storage controllers include the PERC H365i, H965i, H975i, and HBA465e.
Yes. The Dell PowerEdge R6725 supports both air cooling and Direct Liquid Cooling (DLC). Air cooling handles most processor configurations using High-Performance Silver, Standard, or High-Performance Platinum fan modules with N+1 redundancy. DLC is required for the highest-TDP AMD EPYC 9005 configurations and removes heat directly at the processor cold plate via a rack-mounted Cooling Distribution Unit (CDU). DLC enables higher sustained performance in thermally constrained data center environments and reduces facility cooling energy.
The R6725 (Gen 17) upgrades to AMD EPYC 9005 Zen5 processors (up to 192 cores/socket) versus the R6625’s EPYC 9004 Genoa Zen4c (up to 128 cores/socket). Memory speed increases from 4800 MT/s to 6400 MT/s, and the R6725 adds CXL 2.0 Type 3 memory expansion support not available on the R6625. iDRAC10 replaces iDRAC9, GPU support expands from 2× to 3× 75W cards, and all PCIe slots are Gen5-native versus the R6625’s Gen5/Gen4 mix. Both platforms share the same 1U dual-socket form factor with 24 DDR5 DIMM slots and up to 6 TB maximum memory.
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