Dell PowerEdge R570 Buyers Guide
Dell PowerEdge R570
17th Generation 2U Dual-Socket Server with Intel Xeon 6 Processors
Intel Xeon 6 E-Core & P-Core Processors — Up to 144 Cores
E-Core Option — Up to 144 cores per socket with Intel Xeon 6 E-core processors, ideal for maximum throughput and parallel workloads
P-Core Option — Up to 86 cores per socket with Intel Xeon 6 P-core processors, optimized for per-core performance and lower TDP
R1S Configuration — Single-socket variants support up to 86 cores with P-core configuration
Max TDP — E-core up to 330 W, P-core up to 350 W per socket
Cache Architecture — Unified cache design maximizes memory bandwidth for data center workloads
DDR5 ECC RDIMM — Up to 192 GB per Socket
16 DIMM Slots — Supports up to 16 DDR5 RDIMMs per socket for massive memory capacity
Speed Options — 6400 MT/s (1 DIMM per channel) and 5200 MT/s (2 DIMMs per channel)
Memory Resilience — Mirroring and Fault Resilient Mode (FRM) supported in 8 or 16 DIMM configurations
ECC Protection — Full single-error correction for data integrity in mission-critical environments
Flexible Drive Configurations — 2.5", 3.5", & EDSFF E3.S Options
3.5" LFF Drives — Up to 12 × 3.5-inch SATA drives plus 4 × EDSFF E3.S rear drives for hybrid capacity
2.5" SFF Drives — Up to 24 × 2.5-inch SATA/SSD drives or 16 × 2.5-inch NVMe drives for high-speed all-flash
EDSFF E3.S NVMe — Up to 32 × EDSFF E3.S (hot-aisle) or 16 × (cold-aisle) Gen 5 NVMe drives for extreme density
Rear Drive Module — Optional 4-drive EDSFF E3.S rear cage for extended storage without adding rack depth
Mixed Workloads — Combine drive types for tiered storage: capacity HDDs + high-speed NVMe
PERC RAID Controllers — Dual-Mode SAS4 Architecture
PERC 12 & PERC 11 — Native dual-controller SAS4 architecture for maximum RAID flexibility
Drive Support — Supports SAS or SATA drives behind each controller; does not support Tri-Mode (mixed SAS/SATA/NVMe)
NVMe Native — Separate NVMe drive support via EDSFF E3.S direct attachment
Hot-Swap Redundancy — Hot-swappable drive carriers for non-disruptive maintenance
BOSS-N1 DC-MHS Module — Dual Boot Drives with Hot-Swap
Dual M.2 NVMe — Front or rear BOSS-N1 DC-MHS carrier with 2 × M.2 NVMe slots
Hot-Swappable — Slide-out design for non-disruptive OS and driver updates
Redundancy Support — Configure for mirrored boot or active-backup configurations
Flexible Placement — Front or rear placement based on riser configuration
NVIDIA GPU Accelerators — Up to 4 L4 or 3 L40S/H100 NVL
4 × NVIDIA L4 24GB — Low-power (72 W) single-width GPUs for AI inference and edge compute
3 × NVIDIA L40S 48GB — Double-width (350 W) for generative AI and professional workloads
3 × NVIDIA H100 NVL 94GB — Double-width (400 W) high-performance HPC and large language models
Riser Configuration — RC6 and RC8 configurations support double-width GPUs in slots 7, 4, and 2
Power Management — Dual 12V high-current connectors (12VH 2×6 + 1×4) for double-width accelerators
NVIDIA BlueField DPU — Offload Networking & Security
Supported Slot Configurations — RC1 (Slot 7), RC3 (Slot 31), RC4 (Slot 31), RC5 (Slot 7), RC6 (Slot 7), RC8–RC11 (Slot 7)
Riser Support — Riser 5b and RF1a optimized for DPU card installation
Offload Engine — Offload TCP/IP stack, encryption, and switching from CPU to dedicated processor
Network Acceleration — DPDK-compatible dataplane acceleration for low-latency packet processing
Security Offload — Encrypted packet inspection and threat filtering without CPU overhead
PCIe Gen 5 — Up to 88 Lanes with Multiple Riser Options
PCIe Gen 5 Native — Up to 88 lanes total (136 lanes with R1S configurations)
Multiple Riser Configurations — RC0–RC11 support various slot layouts for GPUs, DPUs, NICs, and storage adapters
Slot Availability — Up to 6 × x16 full-height slots depending on riser configuration
Front & Rear Placement — Flexible front or rear riser option based on airflow and topology
OCP NIC Support — Up to 2 × OCP 3.0 NIC cards installable in front or rear slots
OCP 3.0 Network Interface Cards — Dual NIC Support
Dual OCP NICs — Up to 2 × OCP 3.0 network interface cards in front or rear slots
Flexible Placement — Primary OCP in slot 38 (bottom), secondary in slot 34 depending on riser configuration
Shared NIC Feature — Primary OCP supports shared network stack; secondary OCP does not
Dedicated iDRAC Port — Onboard Gigabit Ethernet dedicated to out-of-band management
High-Speed Connectivity — Support for 100GbE and 400GbE adapters in OCP slots
Redundant M-CRPS 60mm Power Supplies — AC/DC Options
Dual Redundant — 2 × modular Common Redundant Power Supplies (M-CRPS) with N+1 failover
AC & DC Options — Flexible deployment in either AC or DC-powered environments
Hot-Swappable — 60mm compact form factor with slide-in cartridge design
Scaled Power — PSU capacity scales with system configuration for efficient power delivery
Dual Thermal Heatsink Options — Air & Liquid Capable
6 System Fans — High-performance airflow with variable-speed PWM control
2U Standard Heatsink — Passive 2U air-cooled heatsink for processors up to 150 W TDP in non-12×3.5" configurations
HPR Heatsink — High-performance radial (HPR) heatsink required for processors >150 W or all 12×3.5" configurations
Rear E3.S Fan — Dedicated cooling fan for rear EDSFF E3.S drive cage
Unique Air Shroud — Two-piece click-together design (left/right) for simplified installation and maintenance
iDRAC 10 Out-of-Band Management — Redfish API
iDRAC 10 — Enterprise-grade out-of-band management with independent IP and secure authentication
Redfish API — Standards-based REST API for programmatic server management and orchestration
OpenManage Enterprise — Unified multi-server console for fleet management and compliance reporting
Secure Connect Gateway — Optional automated diagnostics collection and proactive support
Quick Sync 2 — On-server LCD panel for quick system status and configuration
Silicon Root of Trust — Cyber Resilient Architecture
Silicon Root of Trust — Hardware-based security foundation with cryptographic identity at silicon level
TPM 2.0 — Trusted Platform Module for OS and application authentication
BIOS Lock & Attestation — Secure boot with firmware integrity verification
Encrypted NVRAM — System configuration protected from unauthorized access
Secure Erase — Cryptographic erase of drives without physical destruction
ReadyRails II Tool-Less Rack Integration
ReadyRails II — Quick-connect rail system without additional tools or hardware
2U Form Factor — Optimized for standard 19-inch EIA racks and 4-post enclosures
Cable Management Arm (CMA) — Optional CMA included for organized power and network routing
Front Bezel — Optional security bezel for controlled access and equipment protection
Thermal Spacing — Optimized for data center airflow management in hot/cold aisle configurations
Comparison of PowerEdge R570 and R760xs
Processor Options — R570 offers one Intel Xeon 6 E-core up to 144 cores or one Xeon 6 P-core up to 86 cores; R760xs uses two 4th/5th Gen Intel Xeon Scalable processors up to 28 cores.
Accelerators — R570 supports up to 3 × 400 W double-width or 4 × 75 W single-width accelerators; R760xs supports up to two single-width 75 W accelerators.
Memory — R570 supports 16 DDR5 RDIMM slots up to 6400 MT/s; R760xs supports 16 DDR5 RDIMM slots up to 5200 MT/s.
Storage — R570 supports large front-bay arrays including 3.5-inch SATA, 2.5-inch NVMe, and up to 32 EDSFF E3.S hot-aisle drives; R760xs supports fewer bays with flexible 2.5-inch and EDSFF configurations.
Boot & Management — R570 uses BOSS-N1 DC-MHS boot and iDRAC management; R760xs uses BOSS-N1, iDRAC9, and additional service module options.
Frequently Asked Questions — Dell PowerEdge R570
The R570 supports up to 16 DDR5 DIMM slots per socket, providing a maximum of 192 GB per socket in a dual-socket configuration. Memory operates at 6400 MT/s (1 DPC) or 5200 MT/s (2 DPC) for optimal performance across various workload scenarios.
The R570 offers flexible drive configurations: up to 12 × 3.5-inch drives (SATA HDD), 24 × 2.5-inch drives (SATA/SSD), or up to 32 × EDSFF E3.S Gen 5 NVMe drives (hot-aisle configuration). An optional rear EDSFF E3.S module adds 4 additional drives without increasing rack depth.
Yes. The R570 supports multiple GPU options: up to 4 × NVIDIA L4 24GB (72 W each) for AI inference, 3 × NVIDIA L40S 48GB (350 W) for generative AI workloads, or 3 × NVIDIA H100 NVL 94GB (400 W) for large language model training. GPU slots depend on riser configuration.
Yes. Express Computer Systems stocks professionally reconditioned refurbished Dell PowerEdge R570 servers tested, cleaned, and configured to your specifications — ready to deploy at significant cost savings versus new. Shop refurbished Dell R570 servers at ECS.
According to the R570 spec materials, the R570 compares directly with the R760xs: R570 offers a single Intel Xeon 6 E/P-core CPU path with faster DDR5 memory up to 6400 MT/s and larger accelerator capacity, while R760xs uses dual 4th/5th Gen Xeon Scalable processors, supports iDRAC9 management, and is optimized for higher-density 2.5-inch and EDSFF storage configurations.
Ready to Deploy the Dell PowerEdge R570?
Express Computer Systems specializes in professionally reconditioned refurbished Dell PowerEdge servers — tested, cleaned, and configured to your exact specifications. Deploy enterprise-grade infrastructure at significant cost savings.
Start building your custom server today