Dell PowerEdge R470 Review — Buyers Guide
Purpose-Built for High-Density, High-Performance Compute
Virtualization & Cloud Scale — Consolidate virtual machines with up to 144 E-cores in a 1U chassis, delivering exceptional VM density per rack unit for private cloud and VDI deployments.
Scale-Out Database — Drive high-throughput OLTP and analytics with DDR5 at 6400 MT/s and NVMe Gen5 storage up to 983 TB raw capacity in a single 1U node.
Edge Compute — Deploy at the network edge with a compact 1U footprint, optional GPU acceleration, and front/rear I/O configurations for cold-aisle or hot-aisle environments.
High-Performance Computing (HPC) — Leverage up to 144 cores with PCIe Gen5 accelerator support for simulation, modeling, and compute-intensive research workloads.
Software-Defined Storage Node — Configure with up to 16x EDSFF E3.S Gen5 NVMe for ultra-dense all-flash storage nodes in distributed or hyperconverged architectures.
Cloud-Scale Web & App Microservices — Handle high-request-rate web serving and containerized microservices with energy-efficient E-core processors and minimal operational overhead.
Data Services — Power analytics pipelines, caching layers, and in-memory databases with DDR5 bandwidth and Intel® Xeon® 6 compute density.
Intel® Xeon® 6 — E-Core and P-Core Flexibility in One Platform
E-Core (Efficient-core) — Up to 144 cores per processor, TDP up to 330W. Delivers exceptional performance-per-watt for cloud-scale and density-optimized workloads. Supports up to 1TB DDR5.
P-Core (Performance-core) — Up to 86 cores per processor, TDP up to 350W. Engineered for the widest workload range with enhanced AI and HPC throughput. Supports up to 4TB DDR5 with R1S option.
DDR5 Memory Bandwidth — Up to 6400 MT/s (1DPC) and 5200 MT/s (2DPC) across 8 channels per CPU for high-throughput data-intensive applications.
PCIe Gen5 I/O — 88 PCIe Gen5 lanes standard; up to 136 lanes with R1S P-Core option — enabling four full-bandwidth x16 accelerator slots at 32 GT/s.
UPI 2.0 — Ultra Path Interconnect at up to 24 GT/s for high-speed coherent I/O communication.
Featured E-Core SKUs — 6780E (144c / 330W), 6766E (144c / 250W), 6756E (128c / 225W), 6746E (112c / 250W), 6740E (96c / 250W), 6710E (64c / 205W).
Featured P-Core SKUs — 6787P (86c / 350W), 6767P (64c / 350W), 6747P (48c / 330W), 6737P (32c / 270W), 6527P (24c / 255W), 6724P (16c / 210W), 6507P (8c / 150W).
Intel Socket E2 — 4710-2 pin socket with PCIe bifurcation at x16 / x8 / x4 / x2 Gen5 and extended heatsink support for TDPs up to 250W or remote heatsink above 250W.
DDR5 RDIMM — Up to 4TB at 6400 MT/s
16 DIMM Slots — 288-pin DDR5 RDIMM sockets across 8 memory channels for maximum bandwidth and capacity utilization.
E-Core Configuration — Supports up to 1TB max using 32GB or 64GB RDIMMs at 6400 MT/s (1DPC) or 5200 MT/s (2DPC).
P-Core Configuration — Supports up to 4TB max using 16GB through 256GB RDIMMs; 6400 MT/s (1DPC) or 5200 MT/s (2DPC).
RDIMM Capacities — 16GB (1R), 32GB (2R), 64GB (2R), 96GB (2R), 128GB (2R), 256GB (8R) — all at 1.1V ECC DDR5.
DDR5 Exclusively — Supports registered ECC DDR5 DIMMs only; no DDR4 compatibility. All DIMM slots must be populated with identical DIMMs — mixing configurations are not allowed.
Speed Notes — 16GB and 96GB DIMMs supported only with P-Core processors. Actual speed depends on processor SKU and DIMM population count.
Flexible Drive Bay Configurations — Up to 983 TB NVMe
Up to 16x EDSFF E3.S Gen5 NVMe — Maximum density configuration with hot-swap E3.S drives reaching 983.04TB raw capacity in a single 1U chassis.
Up to 8x EDSFF E3.S Gen5 NVMe — Front I/O or rear I/O configuration; up to 491.52TB front plus optional 2x E3.S rear drives (max 122.88TB additional).
Up to 10x 2.5" SATA/NVMe — Mixed drive bay with 4x universal ports supporting SATA or NVMe drives; max capacity 614.4TB.
Up to 8x 2.5" SATA/NVMe — Proven hot-swap 2.5" bays for SAS/SATA SSD or NVMe drives; max 491.52TB.
4x 3.5" SATA + 2x E3.S Rear — Up to 4x large-form-factor SATA HDDs (max 128TB) paired with up to 2x EDSFF E3.S NVMe rear drives; available as rear I/O configuration only.
Drive Capacities — EDSFF E3.S Ent NVMe Gen5 up to 61.44TB per drive; 2.5" Ent NVMe Gen4 up to 61.44TB; 3.5" SATA HDD up to 32TB; M.2 NVMe 480GB or 960GB.
17th Gen PERC 12 RAID — fPERC Without Consuming a PCIe Slot
PERC H365i DC-MHS Front — Internal front-mount PERC 12 RAID controller using the DC-MHS small-form-factor connector; no PCIe slot consumed.
PERC H965i DC-MHS Front — Higher-performance internal front PERC 12 with DC-MHS interface for NVMe-optimized RAID configurations.
PERC H365i & H965i Adapter — PCIe-based internal RAID adapters for configurations requiring standard PCIe riser installations.
External Controllers — PERC H965e (RAID) and HBA 465e for connecting external JBOD enclosures and 12Gb MD-series external storage arrays.
No Tri-Mode — PowerEdge does not support mixing SAS, SATA, and NVMe behind the same controller; select the controller appropriate for your drive type.
External Storage — Supports external USB tape, NAS/IDM appliance software, and 12Gb MD-series JBOD connections for storage expansion beyond direct-attach limits.
BOSS-N1 DC-MHS — Dedicated Boot Without Using a Drive Bay
BOSS-N1 DC-MHS — Boot Optimized Storage Subsystem using the DC-MHS connector; supports HWRAID 1 mirroring across 2x M.2 NVMe SSDs (480GB or 960GB each) for OS-level redundancy without occupying a PCIe slot or drive bay.
M.2 Interposer — Optional M.2 Interposer board accommodates up to 2x M.2 NVMe Gen4 SSDs (480GB or 960GB) as an alternative dedicated boot solution.
Internal USB — Single internal USB 3.1 Type-A port available as a lightweight boot option for embedded OS or hypervisor installations.
Front or Rear Placement — BOSS-N1 can be installed at the front or rear of the chassis depending on I/O configuration; note that rear BOSS-N1 is not supported under ASHRAE A4 restrictions.
Lifecycle Controller Integration — Dell recommends Lifecycle Controller for OS installation to ensure all required drivers are pre-bundled, enabling deployment without internet connectivity.
NVIDIA L4 GPU and BlueField-3 DPU Support in 1U
Up to 4x NVIDIA L4 GPU — 24GB GDDR6, 72W TDP, available in Low Profile or Full Height form factor. Enables AI inference, video transcoding, edge AI, and GPU-accelerated compute in a compact 1U chassis.
NVIDIA BlueField-3 B3220 DPU — System-on-chip combining ARM cores, 2x 200GbE high-speed networking (PCIe Gen5 x16, 150W, FHHL) and programmable acceleration engines for networking, storage, and security offload.
DPU Riser Compatibility — Compatible with risers RC2 (Slot 31), RC4 (Slot 1), RC5 (Slot 1), and RC6 (Slot 1); check riser configuration table for processor compatibility.
Full PCIe Gen5 Bandwidth — Each GPU/DPU slot operates at full x16 Gen5 bandwidth (32 GT/s) — no slot sharing or bifurcation required for multi-accelerator configurations.
Workload Fit — AI inference at the edge, real-time video analytics, GPU-accelerated database operations, and SmartNIC offload for virtualized network function stacks.
PCIe Gen5 — Up to Four x16 Slots at 32 GT/s
Up to 4x PCIe Gen5 x16 Slots — Slot 1 (LP x8 or FH x16), Slot 4 (FH x16 half-length), Slot 31 (FH x16 half-length), Slot 32 (FH x16 half-length) — all connected to Processor 0.
PCIe Gen5 Bandwidth — 32 GT/s per lane; x16 slots deliver 64 GB/s bidirectional bandwidth — critical for NVMe-over-Fabric, 200GbE networking, and GPU-direct storage.
Standard vs R1S Lane Count — Standard processors provide 88 PCIe Gen5 lanes; R1S P-Core processors expand to up to 136 lanes for configurations requiring more concurrent accelerators.
PCIe Bifurcation — x16 / x8 / x4 / x2 Gen5 bifurcation for flexible I/O configurations including NVMe storage expansion cards and quad-port 25GbE NICs.
9 Riser Configurations — RC0 (no riser), RC1 (R2u+R4a with rear E3.S), RC2 (RF1c front OCP), RC3 (RF1d front OCP cage), RC4-RC8 with various FH/LP riser combos for front and rear I/O deployments.
R1S Processor Risers — Risers RC4, RC5, and RC7 support R1S P-Core processors only; RC0, RC1, RC2, RC3, RC6, RC8 support both R1S and standard single-processor configurations.
OCP NIC 3.0 — Up to Two Slots, 100GbE Capable
Up to 2x OCP NIC 3.0 Slots — Front I/O configuration supports 2 OCP slots (Slots 31 and 32); rear I/O configuration supports 1 OCP slot at the rear. All OCP 3.0 cards run on PCIe Gen5 x16.
Port Speed Options — 1GbE x2/x4, 10GbE x2/x4, 25GbE x2/x4, 100GbE x2 — select based on application bandwidth requirements and fabric topology.
Supported Vendors — Nvidia (QSFP56 100GbE x2, SFP28 25GbE x2), Broadcom (QSFP56 100GbE x2, SFP28 25GbE x2/x4, BT 1GbE x4, BT 10GbE x2/x4), Intel (QSFP56 100GbE x2, SFP28 25GbE x2/x4, BT 1GbE x2, BT 10GbE x2).
Dedicated BMC Ethernet — 1Gb dedicated iDRAC out-of-band management port (DC-SCM) for separate management-plane traffic — available at front (front I/O) or rear (rear I/O).
OCP 3.0 vs 2.0 — OCP 3.0 uses PCIe Gen5 (vs Gen3 on OCP 2.0) and supports up to x16 lanes in small form factor — enabling next-generation 100GbE and 200GbE throughput.
BlueField-3 DPU Option — NVIDIA BlueField-3 B3220 on PCIe Gen5 x16 provides 2x 200GbE SmartNIC functionality with DPU offload — frees host CPU cycles for application workloads.
Platinum & Titanium Efficiency — 1+1 Hot-Swap Redundant PSUs
800W Platinum/Titanium — 100–240V AC or 240V HVDC; 94% efficiency at 50% load (Platinum) / 94% (Titanium). Standard configurations with E-Core processors up to 250W TDP.
1100W Platinum/Titanium — 100–240V AC or 240V HVDC; 96% Titanium efficiency at 50% load. Recommended for higher-TDP P-Core configurations with GPU complement.
1500W Titanium Mixed Mode — 100–240V AC or 240V HVDC; 96% efficiency. Supports 350W P-Core processors with full four-GPU complement at 72W each.
1500W Titanium 277VAC — High-line 277V AC input for data centers with specialized three-phase power distribution; 96% efficiency at 50% load.
1400W −48V DC Titanium — Direct current input for telecom and carrier-grade facilities operating DC power infrastructure.
1+1 Hot-Swap Redundancy — Both PSUs operate simultaneously; automatic failover on PSU loss with zero downtime. PSUs must be identical wattage for 1+1 redundancy to activate.
1% Power Monitoring Accuracy — Dell’s 1% power monitoring (5× more accurate than the 5% industry standard) enables precise capacity planning and UPS right-sizing via iDRAC telemetry.
Smart Air Cooling — N+1 Redundancy Across ASHRAE A2, A3 & A4
Up to 4x Dual Fan Modules — Hot-swappable fan sets with N+1 redundancy; continuous operation with one failed fan module — no downtime required for fan replacement.
Standard (STD) Fans — Default option for processor TDPs up to 250W in most configurations. Quietest idle configuration achieves 42 dB at 25°C ambient.
High Performance Silver (HPR SLVR) Fans — Required for processor TDPs above 250W (330W E-core, 350W P-core) and 3.5" drive or GPU configurations.
ASHRAE A2 — Standard 10–35°C operating range for conventional data centers with ISO Class 8 air filtration.
ASHRAE A3 — Extended 5–40°C range with restrictions: CPU ≤225W, no GPU/DPU, no DIMMs ≥128GB, dual PSU redundancy required, 85°C active optics or DAC cables.
ASHRAE A4 — High-ambient 5–45°C support with tighter limits: CPU ≤185W (or ≤165W for 10×2.5"/4×3.5" configs); rear BOSS-N1 not supported; no GPU/DPU.
Open & Closed Loop Control — iDRAC dynamically adjusts fan speeds using inlet temperature, CPU/DIMM/drive sensors, and system inventory — minimizing acoustic output and energy consumption.
Dual I/O Configurations — Front or Rear Access
Rear I/O Ports (Hot-Aisle Config) — 2x USB 3.1 Type-A, 1x VGA, 1x dedicated iDRAC BMC Ethernet port for out-of-band management. Standard configuration for rear-access data center aisles.
Front I/O Ports (Cold-Aisle Config) — 1x USB 2.0 Type-C (dual-mode host/iDRAC Direct), 1x USB 2.0 Type-A (optional), 1x Mini-DisplayPort (optional), 1x DB9 Serial, 1x dedicated BMC Ethernet — brings all management access to the front for cold-aisle serviceability.
Internal USB — 1x USB 3.1 Type-A internal port for embedded OS or hypervisor boot media without occupying external facing ports.
iDRAC Direct (Type-C) — Front-panel Type-C port provides direct iDRAC browser/console access via a laptop without network infrastructure; cable length not to exceed 3 feet.
Video Output — Integrated Matrox G200 with 16MB frame buffer; supports up to 1920×1200 at 60Hz. VGA (rear I/O) or Mini-DisplayPort (front I/O, optional) — both cannot be used simultaneously.
Optional Quick Sync 2.0 — Bluetooth front-panel module for mobile management via OpenManage Mobile app — check system health and perform basic configuration from a smartphone without physical connection.
Cyber Resilient Architecture — Zero Trust from Silicon to Software
Silicon Root of Trust — Hardware-anchored cryptographic boot chain verifies firmware integrity at the silicon level before any software loads — protecting against supply chain attacks and firmware tampering from factory to site.
TPM 2.0 (FIPS, CC-TCG Certified) — Trusted Platform Module 2.0 provides hardware-based key storage, attestation, and cryptographic operations for drive encryption and platform integrity verification.
Secure Boot — UEFI Secure Boot validates bootloader and OS kernel signatures, blocking unauthorized operating systems and rootkits from loading during the boot process.
Data at Rest Encryption — Self-Encrypting Drive (SED) support with local or external key management for NIST-compliant data protection across SATA, NVMe, and E3.S drive types.
Secured Component Verification — Factory-to-site hardware integrity check ensures no components were replaced or tampered with during shipping — critical for supply chain zero-trust requirements.
System Lockdown — Requires iDRAC10 Enterprise or Datacenter; locks all firmware update and configuration change pathways, preventing unauthorized modifications even with physical chassis access.
Chassis Intrusion Detection & Secure Erase — Intrusion switch logs chassis access events; Secure Erase cryptographically sanitizes all storage media prior to decommission for data compliance.
Multi-Factor Authentication (MFA) — Enforces MFA across iDRAC and management interfaces, reducing credential-based attack surface in Zero Trust IT environments and operations.
iDRAC10 & OpenManage — Autonomous Infrastructure Control
iDRAC (Integrated Dell Remote Access Controller) — Out-of-band management controller independent of the host OS — provides remote power, console, diagnostics, firmware updates, and configuration management at all times.
iDRAC RESTful API (Redfish) — Industry-standard Redfish API for scripted, automation-friendly server lifecycle management compatible with Ansible, Terraform, and custom orchestration tools.
RACADM CLI — Command-line interface for rapid configuration, scripting, and batch management of PowerEdge servers without GUI overhead.
iDRAC Service Module (iSM) — Host-side agent extending iDRAC visibility into OS-level metrics, process data, and application health for unified cross-layer monitoring.
iDRAC Direct (Type-C Port) — USB-based local iDRAC access via laptop without network infrastructure — configure, troubleshoot, or update firmware on-site without connecting to the network.
Quick Sync 2.0 (Optional) — Wireless Bluetooth front-panel module for mobile device management via OpenManage Mobile app — check server health and perform basic configuration from a smartphone.
Secure Connect Gateway (SCG) — Optional automated support service: monitors hardware health, auto-creates support cases, and uploads diagnostic data to Dell proactively — reducing mean time to resolution.
OpenManage Portfolio — End-to-end tools including OpenManage Enterprise, OpenManage Server Administrator, and Lifecycle Controller for fleet-scale lifecycle management and automation.
Broad OS & Hypervisor Compatibility
Canonical Ubuntu Server LTS — Long-term support Ubuntu for stable enterprise Linux deployments with full iDRAC driver support and Lifecycle Controller integration.
Red Hat Enterprise Linux (RHEL) — Industry-standard enterprise Linux with Dell-certified driver stacks and one-click OS deployment via Lifecycle Controller.
SUSE Linux Enterprise Server (SLES) — High-reliability Linux for SAP workloads and mission-critical enterprise applications requiring long-term kernel stability.
VMware ESXi — Leading type-1 hypervisor for virtualized infrastructure; Dell-certified with OpenManage Integration for vCenter for lifecycle management directly from the vSphere console.
Windows Server & Windows Server Datacenter — Full Microsoft certification including Hyper-V virtualization, Windows Admin Center integration, and NVIDIA L4 GPU support for virtual desktop workloads.
OEM-Ready — Available in OEM and OEMR configurations; hardware can be customized from bezel to BIOS to packaging for white-label or branded customer deployments.
APEX Flex on Demand — Acquire R470 infrastructure as-a-service with payments that scale to actual consumption — converting CapEx to OpEx without surrendering on-premises data sovereignty.
ReadyRails & Static Options — 4-Post and 2-Post Compatible
1U Form Factor — 42.8mm height × 482mm width; cold-aisle front I/O depth 829.44mm; hot-aisle rear I/O depth 816.92mm with bezel or 815.14mm without. Weight up to 19.11 kg (42.13 lbs) fully loaded.
B21 ReadyRails II Sliding Rails — Tool-less installation in 19" EIA-310-E square or unthreaded round hole 4-post racks including all Dell rack generations; supports full extension for in-rack serviceability; optional CMA and SRB.
B22 Stab-in/Drop-in Sliding Rails — Drop-in or stab-in installation; tool-less in Dell Titan-S/D and standard 19" 4-post racks; full extension with optional CMA and SRB.
B20 Static Rails — Widest adjustability range and smallest footprint for 4-post and 2-post racks; tooled installation for threaded-hole racks; not CMA-compatible; enables tighter rack configurations.
Optional CMA — Cable Management Arm keeps rear cables organized during rail extension without disconnecting; compatible with B21 and B22 sliding rails only.
Optional SRB — Strain Relief Bar protects rear cable connections during in-rack service operations; available with B21 and B22 sliding rails.
Dell PowerEdge R470 vs R660XS — Why Upgrade to 17th Gen
Processor Architecture Leap — Intel Xeon 6 E-Core (up to 144 cores) or P-Core (up to 86 cores) vs 4th/5th Gen Xeon Scalable (up to 32c/28c) — up to 4.5× more cores in a single socket for massively parallel workloads.
Memory Speed — DDR5 at 6400 MT/s (1DPC) vs 5200 MT/s on R660XS — approximately 23% faster memory bandwidth for throughput-sensitive applications.
GPU Support Added — R470 supports up to 4x NVIDIA L4 24GB vs R660XS with no GPU support — enabling AI inference and accelerated compute in the same 1U chassis.
DPU Support Added — R470 adds NVIDIA BlueField-3 DPU (2×200GbE) vs R660XS with no DPU — enabling SmartNIC offload for virtualized networking infrastructure.
EDSFF E3.S NVMe Drive Bays — R470 supports up to 16x EDSFF E3.S Gen5 NVMe vs R660XS with 0 EDSFF bays — enabling next-generation NVMe storage density.
PCIe Generation — R470 offers up to 4x PCIe Gen5 x16 slots vs R660XS with 2x Gen5 or 3x Gen4 — doubling available Gen5 slot count for accelerators and high-bandwidth adapters.
OCP Networking Slots — R470 supports up to 2x OCP NIC 3.0 (PCIe Gen5) vs R660XS max 1x OCP 3.0 — enabling higher-bandwidth network redundancy in the same 1U form factor.
| Feature | R470 (Gen 17) | R660XS (Gen 16) |
|---|---|---|
| Processor | Intel Xeon 6 E-Core (up to 144c) or P-Core (up to 86c) | 4th/5th Gen Xeon Scalable (up to 32c / 28c) |
| Max Memory | 4TB DDR5 (P-Core) / 1TB (E-Core) | Limited by processor and DIMM slot count |
| Memory Speed | DDR5 up to 6400 MT/s (1DPC) | DDR5 up to 5200 MT/s |
| EDSFF E3.S Drives | Up to 16x Gen5 NVMe front + 2x rear | Not supported |
| GPU Support | Up to 4x NVIDIA L4 24GB 72W | Not supported |
| DPU Support | NVIDIA BlueField-3 (2×200GbE) | Not supported |
| PCIe Slots | Up to 4x Gen5 x16 | 2x Gen5 or 3x Gen4 |
| OCP NIC Slots | Up to 2x OCP 3.0 (PCIe Gen5) | Max 1x OCP 3.0 |
| Form Factor | 1U Rack | 1U Rack |
ProSupport, ProDeploy & Lifecycle Services Maximize Uptime
ProSupport Infrastructure Suite — 24×7 access to Dell engineers for hardware, software, and OS issues; assisted part dispatch, remote diagnosis, and priority escalation through 170 global service locations backed by 60K+ employees and partners.
ProDeploy Infrastructure Suite — Factory installation, rack integration, OS deployment, and configuration validation — reducing time-to-production with tailored deployment options for specific infrastructure environments.
Lifecycle Controller — Embedded systems management for bare-metal OS deployment and firmware updates with all drivers pre-bundled — no internet connection required at deployment time.
Secure Connect Gateway (SCG) — Automated remote monitoring that detects hardware issues, opens Dell support cases, and uploads diagnostic data proactively — reducing MTTR without manual IT intervention.
ProSupport AI & Professional Services — Accelerate AI use case deployment with Dell Professional Services for AI; predictive and proactive support via ProSupport Plus with SupportAssist telemetry.
APEX Flex on Demand — Acquire R470 infrastructure as-a-service with payments that match actual consumption — convert CapEx to OpEx while retaining on-premises control.
Asset Recovery & Recycling — Dell Technologies end-of-life take-back program for responsible recovery and recycling of decommissioned PowerEdge hardware in compliance with local environmental regulations.
Energy Star Certified — Designed for Lower Carbon, Lower OpEx
Energy Star Compliant — R470 meets Energy Star requirements for server energy efficiency, validating its power consumption profile against international performance standards.
80 PLUS & Climate Savers — PSUs certified to 80 PLUS (Platinum/Titanium) and Climate Savers Computing standards; Titanium PSUs achieve up to 96% efficiency at 50% load.
1% Power Monitoring Accuracy — Dell’s 1% monitoring accuracy (5× the industry 5% standard) enables right-sizing of power infrastructure and UPS capacity, reducing stranded capacity and energy waste.
N+1 Fan Redundancy & Smart Cooling — Closed-loop thermal control dynamically sets minimum required fan speeds — reducing idle power consumption vs fixed-speed cooling alternatives.
Intel Xeon 6 E-Core Efficiency — Efficient-core architecture delivers superior performance-per-watt vs prior Xeon generations; more compute per kilowatt-hour means fewer servers and a smaller data center footprint per workload.
Dell EIPT — Enterprise Infrastructure Planning Tool calculates precise power consumption across server, storage, and networking at specific workload levels — enabling accurate TCO modeling before purchasing decisions.
Recycled Materials & Responsible Sourcing — Dell incorporates recycled content in products and packaging and offers end-of-life take-back to support circular economy goals and reduce landfill impact.
Frequently Asked Questions — Dell PowerEdge R470
The Dell PowerEdge R470 supports up to 4TB of DDR5 RDIMM memory across 16 DIMM slots when configured with an Intel Xeon 6 P-Core processor. With an E-Core processor, the maximum is 1TB. Both configurations support DDR5 speeds up to 6400 MT/s (1 DIMM per channel) or 5200 MT/s (2 DIMMs per channel). All DIMM slots must be populated with identical modules — mixing is not supported.
The Dell PowerEdge R470 supports up to 16x EDSFF E3.S Gen5 NVMe front drives (983.04TB max raw capacity) plus up to 2x EDSFF E3.S Gen5 NVMe rear drives (122.88TB). Alternatively, configure with up to 10x 2.5" SATA/NVMe (614.4TB), 8x 2.5" SATA/NVMe (491.52TB), or 4x 3.5" SATA (128TB) with 2 rear E3.S drives. M.2 NVMe SSDs (480GB or 960GB) are also supported via BOSS-N1 or the M.2 interposer for OS boot.
Yes. The Dell PowerEdge R470 supports up to four NVIDIA L4 24GB 72W GPUs (Low Profile or Full Height) connected via PCIe Gen5 x16 slots. It also accommodates the NVIDIA BlueField-3 B3220 DPU (2×200GbE, PCIe Gen5 x16, 150W) for network and infrastructure offload. The R470 is one of the few 1U single-socket servers to offer both GPU and DPU support simultaneously, making it suitable for edge AI inference, video analytics, and virtualized network functions.
Yes. Express Computer Systems stocks professionally reconditioned refurbished Dell PowerEdge R470 servers tested, cleaned, and configured to your specifications — ready to deploy at significant cost savings versus new. Shop refurbished Dell PowerEdge R470 servers at ECS.
The Dell PowerEdge R470 (17th Gen) delivers major generational improvements over the R660XS (16th Gen) in the same 1U form factor. The R470 supports Intel Xeon 6 processors with up to 144 cores (vs 32 cores on R660XS), DDR5 at up to 6400 MT/s (vs 5200 MT/s), and up to 4TB RAM with a P-Core processor. The R470 also adds GPU support (up to 4x NVIDIA L4), EDSFF E3.S Gen5 NVMe drives (not available on R660XS), DPU support, twice as many PCIe Gen5 slots, and dual OCP NIC 3.0 slots — making it a substantially more capable platform for AI, cloud-scale compute, and high-density storage workloads.
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